| 1. |
- Ebefors, Thorbjörn, et al.
(författare)
-
A robust micro conveyer realized by arrayed polyimide joint actuators
- 1999
-
Ingår i: Proceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems. - 0780351940 ; , s. 576-581
-
Konferensbidrag (refereegranskat)abstract
- A new micromotion system (micro-conveyer) based on arrays of movable robustsilicon legs has been developed and investigated. The motion is achieved by thermal actuation of polyimide joint actuators using electrical heating. Successful experiments on moving flat objects in the millimeter range with high load capacity have been performed. The conveyerconsists of a15×5 mm2 chip with 12 silicon legs each 500 μm long. The maximum load conveyed on the structure was 2000 mg. Conveyance velocities up to 12 mm/s have been measured. Accelerated life-time measurements demonstrate the long-term stability of the actuators. The function of the polyimide joint actuators is unaffected after more than 2×108 load cycles.
|
|
| 2. |
- Ebefors, Thorbjörn, et al.
(författare)
-
A robust micro conveyer realized by arrayed polyimide joint actuators
- 2000
-
Ingår i: Journal of Micromechanics and Microengineering. - : IOP Publishing. - 0960-1317 .- 1361-6439. ; 10:3, s. 337-349
-
Tidskriftsartikel (refereegranskat)abstract
- A new micro-robotic conveyance system based on arrays of movable robust silicon legs has been developed and investigated. Motion is achieved by thermal expansion in polyimide joint actuators using electrical heating. Successful experiments on moving and rotating flat objects in the millimeter range have been performed with high load capacity. The conveyer consists of a 15 x 5 mm(2) chip having 12 silicon legs, each with a length of 500 mu m. The maximum load conveyed on the structure was 3500 mg. Both transverse and rotational movements have been demonstrated experimentally. Conveyance velocities up to 12 mm s(-1) have been measured. Accelerated lifetime measurements demonstrate the long-term stability of the actuators. The functionality of the: polyimide joint actuators is unaffected after more than 2 x 10(8) load cycles.
|
|
| 3. |
|
|
| 4. |
|
|
| 5. |
- Ebefors, Thorbjörn, et al.
(författare)
-
Through-Silicon Vias and 3D Inductors for RF Applications
- 2014
-
Ingår i: Microwave journal (International ed.). - 0192-6225. ; 57:2, s. 80-
-
Tidskriftsartikel (refereegranskat)abstract
- To cope with an increasing number of frequency bands and advanced mobile phone standards supporting high data rates, current and future wireless communication systems must satisfy stringent performance expectations while simultaneously being more energy-efficient and having lower operating costs. One major limitation of today's mobile phones is poor impedance matching of the antenna to the RF front end section resulting in poor antenna efficiency. This is exacerbated by current trends toward higher miniaturization and integration, presenting ever increasing challenges in the design of complex RF systems and the management of RF interaction on signal lines. By introducing tunable RF elements, the overall system architecture can be simplified, leading to significant cost reductions and performance optimization.
|
|
| 6. |
- Haasl, Sjoerd, et al.
(författare)
-
Hybrid mounted micromachined aluminium hot-wire for near-wall turbulence measurements
- 2002
-
Ingår i: FIFTEENTH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS. - : IEEE. - 0780371852 ; , s. 336-339
-
Konferensbidrag (refereegranskat)abstract
- We present the first micromachined metal hot-wire anemometer sensor for use in near-wall turbulence measurements. To measure close to the surface without the circuitry interfering with the flow, a novel hybrid assembly of the sensor has been developed. We present the design, fabrication and characteristics of this sensor.
|
|
| 7. |
- Haasl, Sjoerd, et al.
(författare)
-
Hybrid-mounted micromachined aluminum hotwires for wall shear-stress measurements
- 2005
-
Ingår i: Journal of microelectromechanical systems. - : Institute of Electrical and Electronics Engineers (IEEE). - 1057-7157 .- 1941-0158. ; 14:2, s. 254-260
-
Tidskriftsartikel (refereegranskat)abstract
- In this paper, we present a micromachined metal hotwire anemometer sensor for use in wall shear-stress measurements. We describe its design and fabrication. A novel hybrid assembly method has been developed to make it possible to measure close to the surface without contacting leads interfering with the flow. Experimental results illustrate the behavior and characteristics of this sensor.
|
|
| 8. |
- Haasl, Sjoerd, et al.
(författare)
-
Hybrid-mounted micromachined aluminum hotwires for wall shear stress measurements
- 2005
-
Ingår i: Journal of Microelectromechanical Systems. - 1057-7157. ; 14:2, s. 254-260
-
Tidskriftsartikel (refereegranskat)abstract
- In this paper, we present a micromachined metal hotwire anemometer sensor for use in wall shear-stress measurements. We describe its design and fabrication. A novel hybrid assembly method has been developed to make it possible to measure close to the surface without contacting leads interfering with the flow. Experimental results illustrate the behavior and characteristics of this sensor. © 2005 IEEE.
|
|
| 9. |
|
|
| 10. |
- Khorramdel, Behnam, et al.
(författare)
-
Inkjet printing technology for increasing the I/O density of 3D TSV interposers
- 2017
-
Ingår i: Microsystems & Nanoengineering. - : Nature Publishing Group. - 2055-7434. ; 3, s. 17002-
-
Tidskriftsartikel (refereegranskat)abstract
- Interposers with through-silicon vias (TSVs) play a key role in the three-dimensional integration and packaging of integrated circuits and microelectromechanical systems. In the current practice of fabricating interposers, solder balls are placed next to the vias; however, this approach requires a large foot print for the input/output (I/O) connections. Therefore, in this study, we investigate the possibility of placing the solder balls directly on top of the vias, thereby enabling a smaller pitch between the solder balls and an increased density of the I/O connections. To reach this goal, inkjet printing (that is, piezo and super inkjet) was used to successfully fill and planarize hollow metal TSVs with a dielectric polymer. The under bump metallization (UBM) pads were also successfully printed with inkjet technology on top of the polymer-filled vias, using either Ag or Au inks. The reliability of the TSV interposers was investigated by a temperature cycling stress test (-40 °C to +125 °C). The stress test showed no impact on DC resistance of the TSVs; however, shrinkage and delamination of the polymer was observed, along with some micro-cracks in the UBM pads. For proof of concept, SnAgCu-based solder balls were jetted on the UBM pads.
|
|
