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- Furikado, Ippei, et al.
(författare)
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Particle Adsorption Using a Quartz Crystal Microbalance with Dissipation by Applying a Kelvin-Voigt-Based Viscoelastic Model and the Gauss-Newton Method
- 2023
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Ingår i: Analytical Chemistry. - 0003-2700. ; 95:41, s. 15286-15292
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Tidskriftsartikel (refereegranskat)abstract
- The use of a quartz crystal microbalance with dissipation (QCM-D) to study the adsorption of particles larger than 100 nm, such as liposomes, viruses, and nano/micro-plastics, remains challenging owing to the lack of appropriate models for data evaluation. This study presents a method for quantifying the adsorption of negatively charged polystyrene latex (100 nm-1 μm) at the solid-liquid interface. The validity of a viscoelastic model based on Kelvin-Voigt theory was assessed, and the model was used to evaluate particle adsorption data obtained from QCM-D measurements. The Gauss-Newton method was used to fit the data; the values obtained were larger than results from atomic force microscopy, indicating that the viscoelastic model combined with the Gauss-Newton method can quantify the adsorption of large polystyrene particles and the surrounding water around them. We suggested that QCM-D, in combination with an appropriate viscoelastic model, is applicable to estimate adsorption at the solid-liquid interface even for soft particles larger than 1 μm, which are out of the range of applications to the hydrodynamics model. Furthermore, we successfully showed that the recorded dissipation reflects the viscoelastic properties of the layer. The viscoelastic model allowed quantification of the rheological properties of the layer. The ratio of the viscous and elastic contributions was characterized by using loss tangent (tan δ) values that were extracted from the experimental data by applying the viscoelastic model. These values were lower for the adsorption of the negatively charged polystyrene particles on a positive surface than on a negative surface. This suggests that tan δ reflects the strength of the contact between the particle and substrate.
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| 2. |
- McNamee, Cathy E., et al.
(författare)
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Rice starch particle interactions at air/aqueous interfaces-effect of particle hydrophobicity and solution ionic strength
- 2018
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Ingår i: Frontiers in Chemistry. - : Frontiers Media SA. - 2296-2646. ; 6:MAY
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Tidskriftsartikel (refereegranskat)abstract
- Starch particles modified by esterification with dicarboxylic acids to give octenyl succinic anhydride (OSA) starch is an approved food additive that can be used to stabilize oil in water emulsions used in foods and drinks. However, the effects of the OSA modification of the starch particle on the interfacial interactions are not fully understood. Here, we directly measured the packing of films of rice starch granules, i.e., the natural particle found inside the plant, at air/aqueous interfaces, and the interaction forces in that system as a function of the particle hydrophobicity and ionic strength, in order to gain insight on how starch particles can stabilize emulsions. This was achieved by using a combined Langmuir trough and optical microscope system, and the Monolayer Interaction Particle Apparatus. Native rice starch particles were seen to form large aggregates at air/water interfaces, causing films with large voids to be formed at the interface. The OSA modification of the rice starches particles decreased this aggregation. Increasing the degree of modification improved the particle packing within the film of particles at the air/water interface, due to the introduction of inter-particle electrostatic interactions within the film. The introduction of salt to the water phase caused the particles to aggregate and form holes within the film, due to the screening of the charged groups on the starch particles by the salt. The presence of these holes in the film decreased the stiffness of the films. The effect of the OSA modification was concluded to decrease the aggregation of the particles at an air/water interface. The presence of salts, however, caused the particles to aggregate, thereby reducing the strength of the interfacial film.
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