| 1. |
- Buchholt, Kristina, et al.
(författare)
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Growth and characterization of epitaxial Ti3GeC2 thin films on 4H-SiC(0001)
- 2012
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Ingår i: Journal of Crystal Growth. - : Elsevier. - 0022-0248 .- 1873-5002. ; 343:1, s. 133-137
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Tidskriftsartikel (refereegranskat)abstract
- Epitaxial Ti3GeC2 thin films were deposited on 4 degrees off-cut 4H-SiC(0001) using magnetron sputtering from high purity Ti, C, and Ge targets. Scanning electron microscopy and helium ion microscopy show that the Ti3GeC2 films grow by lateral step-flow with {11 (2) over bar0} faceting on the SiC surface. Using elastic recoil detection analysis, atomic force microscopy, and X-Ray diffraction the films were found to be substoichiometric in Ge with the presence of small Ge particles at the surface of the film.
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| 2. |
- Buchholt, Kristina, et al.
(författare)
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Ohmic contact properties of magnetron sputtered Ti3SiC2 on n- and p-type 4H-silicon carbide
- 2011
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Ingår i: Applied Physics Letters. - : AIP Publishing. - 0003-6951 .- 1077-3118. ; 98:4, s. 042108-
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Tidskriftsartikel (refereegranskat)abstract
- Epitaxial Ti3SiC2 (0001) thin film contacts were grown on doped 4H-SiC (0001) using magnetron sputtering in an ultra high vacuum system. The specific contact resistance was investigated using linear transmission line measurements. Rapid thermal annealing at 950 degrees C for 1 min of as-deposited films yielded ohmic contacts to n-type SiC with contact resistances in the order of 10(-4) Omega cm(2). Transmission electron microscopy shows that the interface between Ti3SiC2 and n-type SiC is atomically sharp with evidence of interfacial ordering after annealing. (c) 2011 American Institute of Physics.
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| 3. |
- Buono, Benedetto, et al.
(författare)
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Current Gain Degradation in 4H-SiC Power BJTs
- 2011
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Ingår i: Materials Science Forum. - : Trans Tech Publications Inc.. - 0255-5476 .- 1662-9752. ; 679-680, s. 702-705
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Tidskriftsartikel (refereegranskat)abstract
- SiC airs are very attractive for high power application, but long term stability is still problematic and it could prohibit commercial production of these devices. The aim of this paper is to investigate the current gain degradation in BJTs with no significant degradation of the on-resistance. Electrical measurements and simulations have been used to characterize the behavior of the BJT during the stress test. Current gain degradation occurs, the gain drops from 58 before stress to 43 after 40 hours, and, moreover, the knee current shows fluctuations in its value during the first 20 hours. Current gain degradation has been attributed to increased interface traps or reduced lifetime in the base-emitter region or small stacking faults in the base-emitter region, while fluctuations of the knee current might be due to stacking faults in the collector region.
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| 4. |
- Buono, Benedetto, et al.
(författare)
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Influence of Emitter Width and Emitter-Base Distance on the Current Gain in 4H-SiC Power BJTs
- 2010
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Ingår i: IEEE Transactions on Electron Devices. - 0018-9383 .- 1557-9646. ; 57:10, s. 2664-2670
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Tidskriftsartikel (refereegranskat)abstract
- The influence of the emitter-base geometry on the current gain has been investigated by means of measurements and simulations. Particular attention has been placed on the emitter width and on the distance between the emitter edge and the base contact. When the emitter width is decreased from 40 to 8 mu m, the current gain is reduced by 20%, whereas when the distance between the base contact and the emitter edge is decreased from 5 to 2 mu m, the current gain is reduced by 10%. Simulations have been used to investigate the reasons for the current gain reduction. The reduction of the emitter width induces two mechanisms of current gain reduction: earlier forward biasing of the base-collector junction and higher recombination in the emitter region. Both mechanisms result from the higher current density flowing under the emitter region. Placing the base contact very close to the emitter edge increases the base current by increasing the gradient of the electron concentration toward the base contact. The effect of increasing the base doping in the extrinsic region has been simulated, and the results demonstrate that the current gain can be improved if a high doping concentration in the range of 5 x 10(18) cm(-3) is used.
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| 5. |
- Buono, Benedetto, et al.
(författare)
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Investigation of Current Gain Degradation in 4H-SiC Power BJTs
- 2012
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Ingår i: Materials Science Forum. - 0255-5476 .- 1662-9752. ; 717-720, s. 1131-1134
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Tidskriftsartikel (refereegranskat)abstract
- The current gain degradation of 4H-SiC BJTs with no significant drift of the on-resistance is investigated. Electrical stress on devices with different emitter widths suggests that the device design can influence the degradation behavior. Analysis of the base current extrapolated from the Gummel plot indicates that the reduction of the carrier lifetime in the base region could be the cause for the degradation of the gain. However, analysis of the base current of the base-emitter diode shows that the degradation of the passivation layer could also influence the reduction of the current gain.
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| 6. |
- Buono, Benedetto, et al.
(författare)
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Modeling and Characterization of Current Gain Versus Temperature in 4H-SiC Power BJTs
- 2010
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Ingår i: IEEE Transactions on Electron Devices. - : Institute of Electrical and Electronics Engineers (IEEE). - 0018-9383 .- 1557-9646. ; 57:3, s. 704-711
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Tidskriftsartikel (refereegranskat)abstract
- Accurate physical modeling has been developed to describe the current gain of silicon carbide (SiC) power bipolar junction transistors (BJTs), and the results have been compared with measurements. Interface traps between SiC and SiO2 have been used to model the surface recombination by changing the trap profile, capture cross section, and concentration. The best agreement with measurement is obtained using one single energy level at 1 eV above the valence band, a capture cross section of 1 x 10(-15) cm(2), and a trap concentration of 2 x 10(12) cm(-2). Simulations have been performed at different temperatures to validate the model and characterize the temperature behavior of SiC BJTs. An analysis of the carrier concentration at different collector currents has been performed in order to describe the mechanisms of the current gain fall-off at a high collector current both at room temperature and high temperatures. At room temperature, high injection in the base ( which has a doping concentration of 3 x 10(17) cm(-3)) and forward biasing of the base-collector junction occur simultaneously, causing an abrupt drop of the current gain. At higher temperatures, high injection in the base is alleviated by the higher ionization degree of the aluminum dopants, and then forward biasing of the base-collector junction is the acting mechanism for the current gain fall-off. Forward biasing of the base-collector junction can also explain the reduction of the knee current with increasing temperature by means of the negative temperature dependence of the mobility.
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| 7. |
- Buono, Benedetto, et al.
(författare)
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Modeling and Characterization of the ON-Resistance in 4H-SiC Power BJTs
- 2011
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Ingår i: IEEE Transactions on Electron Devices. - 0018-9383 .- 1557-9646. ; 58:7, s. 2081-2087
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Tidskriftsartikel (refereegranskat)abstract
- The ON-resistance of silicon carbide bipolar transistors is characterized and simulated. Output characteristics are compared at different base currents and different temperatures in order to validate the physical model parameters. A good agreement is obtained, and the key factors, which limit the improvement of R-ON, are identified. Surface recombination and material quality play an important role in improving device performances, but the device design is also crucial. Based on simulation results, a design that can enhance the conductivity modulation in the lowly doped drift region is proposed. By increasing the base doping in the extrinsic region, it is possible to meet the requirements of having low voltage drop, high current density, and satisfactory forced current gain. According to simulation results, if the doping is 5 x 10(18) cm(-3), it is possible to conduct 200 A/cm(2) at V-CE = 1 V by having a forced current gain of about 8, which represents a large improvement, compared with the simulated value of only one in the standard design.
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| 8. |
- Buono, Benedetto, et al.
(författare)
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Temperature Modeling and Characterization of the Current Gain in 4H-SiC Power BJTs
- 2010
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Ingår i: Materials Science Forum. - : Trans Tech Publications Inc.. - 0255-5476 .- 1662-9752. ; 645-648, s. 1061-1064
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Tidskriftsartikel (refereegranskat)abstract
- The current gain of 4H-SiC BJTs has been modeled using interface traps between SIC and SiO2 to describe surface recombination, by a positive temperature dependence of the carrier lifetime in the base region and by bandgap narrowing in the emitter region. The interface traps have been modeled by one single level at 1 eV above the valence band, with capture cross section of 1 x 10(-15) cm(2) and concentration of 2 x 10(12) cm(-2). The temperature behavior of SiC BJTs has been simulated and the results have been compared with measurements. An analysis of the carrier concentration has been performed in order to describe the mechanisms for fall-off of the current gain at high collector current. At room temperature high injection in the base and forward biasing of the base-collector junction occur simultaneously causing an abrupt drop of the current gain. At higher temperatures high injection in the base is alleviated by the higher ionization degree of the aluminum dopants, and then forward biasing of the base-collector junction is the only acting mechanism for the current gain fall-off at high collector current. This mechanism and the negative temperature dependence of the carrier mobility can also explain the reduction of the knee current for gain fall-off with increasing temperature. Simulations with different emitter widths have been also performed and analyzed to characterize the emitter size effect. Higher current density caused by reducing the emitter width introduces higher carrier recombination in the emitter region, leading to a reduction of the current gain.
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| 9. |
- Ghandi, Reza, et al.
(författare)
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Backside Nickel Based Ohmic Contacts to n-type Silicon Carbide
- 2009
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Ingår i: Materials Science Forum. - : Trans Tech Publications Inc.. - 0255-5476 .- 1662-9752. ; 600-603, s. 635-638
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Tidskriftsartikel (refereegranskat)abstract
- This work focuses on Ni ohmic contacts to the C-face (backside) of n-type 4H-SiC substrates. Low-resistive ohmic contacts to the wafer backside are important especially for vertical power devices. Ni contacts were deposited using E-beam evaporation and annealed at different temperatures (700-1050 degrees C) in RTP to obtain optimum conditions for forming low resistive ohmic contacts. Our results indicate that 1 min annealing at temperatures between 950 and 1000 degrees C provides high quality ohmic contacts with a contact resistivity of 2.3x10(-5) Omega cm(2). Also our XRD results show that different Ni silicide phases appear in this annealing temperature range.
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| 10. |
- Ghandi, Reza, et al.
(författare)
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Experimental evaluation of different passivation layers on the performance of 3kV 4H-SiC BJTs
- 2010
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Ingår i: Materials Science Forum. - 0255-5476 .- 1662-9752. ; 645-648:Part 1-2, s. 661-664
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Tidskriftsartikel (refereegranskat)abstract
- In this work, the electrical performance in terms of maximum current gain, ON-resistance and blocking capability has been compared for 4H-SiC BJTs passivated with different surface passivation layers. Variation in BJT performance has been correlated to densities of interface traps and fixed oxide charge, as evaluated through MOS capacitors. Six different methods were used to fabricate SiO2 surface passivation on BJT samples from the same wafer. The highest current gain was obtained for PECVD deposited SiO2 which was annealed in N2O ambient at 1100 degrees C during 3 hours. Variations in breakdown voltage for different surface passivations were also found, and this is attributed to differences in fixed oxide charge that can affect the optimum dose of the high voltage JTE termination.
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