| 1. |
- Czernohorsky, M., et al.
(författare)
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Stability of crystalline Gd(2)O(3) thin films on silicon during rapid thermal annealing
- 2008
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Ingår i: Semiconductor Science and Technology. - : IOP Publishing. - 0268-1242 .- 1361-6641. ; 23:3, s. 035010-
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Tidskriftsartikel (refereegranskat)abstract
- We investigate the impact of rapid thermal anneals on structural and electrical properties of crystalline Gd(2)O(3) layers grown on Si with different orientations. Due to additional oxygen from the annealing ambient, a structureless two-layer stack ( silicon-oxide-like and silicate-like) between the silicon and the crystalline oxide will be formed. The degradation of layers can be significantly reduced by sealing the layer with a-Si prior to annealing. For the capped layers, the effective capacitance equivalent thickness increases only slightly even after a 1000 degrees C anneal.
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| 2. |
- Ducroquet, F., et al.
(författare)
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Admittance spectroscopy of Si/LaLuO3 and Si/GdSiO MOS Structures (Invited)
- 2012
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Ingår i: ECS Transactions. - : The Electrochemical Society. - 1938-5862 .- 1938-6737. ; 45:3, s. 103 - 117
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Konferensbidrag (refereegranskat)abstract
- Interface states at the gate oxide/channel of metal oxide semiconductor (MOS) transistors generally result in detrimental effects on the device performance which need to be considered for the new generations of high-k dielectrics. In this paper, the admittance of Gadolinium silicate (GdSiO) and Lanthanum Lutetium oxide (LaLuO3) MOS capacitors were investigated as a function of the signal frequency, temperature and gate voltage. The Arrhenius plots of the peak pulsations extracted from the conductance spectra have been discussed on the bases of simulated data taking into account a distribution of the trap energy levels and a thermally enhanced capture cross-section. The consequences of a peaked interface state distribution on the evolution of activation energies are shown to lead to Arrhenius plots following the Meyer-Neldel Rule.
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| 3. |
- Echtermeyer, T., et al.
(författare)
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Investigation of MOS capacitors and SOI-MOSFETs with epitaxial gadolinium oxide (Gd2O3) and titanium nitride (TiN) electrodes
- 2007
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Ingår i: Solid-State Electronics. - : Elsevier BV. - 0038-1101 .- 1879-2405. ; 51:4, s. 617-621
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Tidskriftsartikel (refereegranskat)abstract
- Electrical properties of metal oxide semiconductor (MOS) capacitors with gate stacks of epitaxial gadolinium oxide (Gd2O3) and titanium nitride (TiN) are studied. The influence of CMOS compatible rapid thermal annealing on these gate stacks is examined. Finally, n- and p-type MOS-field effect transistors (MOSFETs) on silicon on insulator (SOI) material with epitaxial Gd2O3 and TiN gate electrodes are presented.
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| 4. |
- Efavi, J K, et al.
(författare)
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Investigation of NiAlN as gate-material for submicron CMOS technology
- 2004
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Ingår i: Microelectronic Engineering. - : Elsevier BV. - 0167-9317 .- 1873-5568. ; 76:1-4, s. 354-359
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Tidskriftsartikel (refereegranskat)abstract
- Nickel-Aluminium-Nitride (NiAlN) is investigated as gate material for submicron CMOS technology for the first time. The MAIN films have been reactively sputtered from a Ni0.5Al0.5 target in a mixture of argon and nitrogen gas. The influence of the reactive gas content and process temperatures on the work function is presented. Electrical properties are extracted from high and low frequency capacitance-voltage measurements (QSCV, HFCV). Resistivity measurements are shown for various process conditions. Interface properties are observed by transmission electron microscopy. Primarily results show NiAlN's suitability for use as gate material in a CMOS replacement gate technology. Fabrication of n-type metal-oxide-semiconductor field effect transistors with a MAIN gates activated at 900 degreesC is demonstrated.
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| 5. |
- Efavi, J K, et al.
(författare)
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Tungsten work function engineering for dual metal gate nano-CMOS
- 2005
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Ingår i: Journal of materials science. Materials in electronics. - : Springer Science and Business Media LLC. - 0957-4522 .- 1573-482X. ; 16:7, s. 433-436
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Tidskriftsartikel (refereegranskat)abstract
- A buffer layer technology for work function engineering of tungsten for dual metal gate Nano-CMOS is investigated. For the first time, tungsten is used as a p-type gate material using 1 nm of sputtered Aluminum Nitride (AlNx) as a buffer layer on silicon dioxide (SiO2) gate dielectric. A tungsten work function of 5.12 eV is realized using this technology in contrast to a mid-gap value of 4.6 eV without a buffer layer. Device characteristics of a p-MOSFET on silicon-on-insulator (SOI) substrate fabricated with this technology are presented.
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| 6. |
- Engstrom, O., et al.
(författare)
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Navigation aids in the search for future high-k dielectrics : Physical and electrical trends
- 2007
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Ingår i: Solid-State Electronics. - : Elsevier BV. - 0038-1101 .- 1879-2405. ; 51:4, s. 622-626
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Tidskriftsartikel (refereegranskat)abstract
- From experimental literature data on metal oxides combined with theoretical estimates, we present empirical relations for k-values and energy band offset values, that can be used in the search for gate dielectric materials fulfilling the needs of future CMOS generations. Only a few materials investigated so far have properties meeting the demands for k and energy band offset values in the development of CMOS down to 22 nm. (c) 2007 Elsevier Ltd. All rights reserved.
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| 7. |
- Engström, Olof, 1943, et al.
(författare)
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A generalised methodology for oxide leakage current metric
- 2008
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Ingår i: Proceeding of 9th European Workshop on Ultimate Integration of Silicon (ULIS), Udine, Italy. - 9781424417308 ; , s. 167-
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Konferensbidrag (refereegranskat)abstract
- From calculations of semiconductor interfacecharge, oxide voltage and tunneling currents for MOSsystems with equivalent oxide thickness (EOT) in therange of 1 nm, rules are suggested for making itpossible to compare leakage quality of different oxideswith an accuracy of a factor 2 – 3 if the EOT is known.The standard procedure suggested gives considerablybetter accuracy than the commonly used method todetermine leakage at VFB+1V for n-type and VFB-1V forp-type substrates.
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