| 1. |
- Campion, James, 1989-, et al.
(författare)
-
Toward Industrial Exploitation of THz Frequencies : Integration of SiGe MMICs in Silicon-Micromachined Waveguide Systems
- 2019
-
Ingår i: IEEE Transactions on Terahertz Science and Technology. - : Institute of Electrical and Electronics Engineers (IEEE). - 2156-342X .- 2156-3446. ; 9:6, s. 624-636
-
Tidskriftsartikel (refereegranskat)abstract
- A new integration concept for terahertz (THz) systems is presented in this article, wherein patterned silicon-on-insulator wafers form all DC, IF, and RF networks in a homogeneous medium, in contrast to existing solutions. Using this concept, silicon-micromachined waveguides are combined with silicon germanium (SiGe) monolithic microwave integrated circuits (MMICs) for the first time. All features of the integration platform lie in the waveguide’s H-plane. Heterogeneous integration of SiGe chips is achieved using a novel in-line H-plane transition. As an initial step toward complete systems, we outline the design, fabrication, and assembly of back-to-back transition structures, for use at D-band frequencies (110ï¿œ170 GHz). Special focus is given to the industrial compatibility of all components, fabrication, and assembly processes, with an eye on the future commercialization of THz systems. Prototype devices are assembled via two distinct processes, one of which utilizes semiautomated die-bonding tools. Positional and orientation tolerances for each process are quantified. An accuracy of $\pm \text3.5\; μ \textm$, $\pm \text1.5 °$ is achieved. Measured $S$-parameters for each device are presented. The insertion loss of a single-ended transition, largely due to MMIC substrate losses, is 4.2ï¿œ5.5 dB, with a bandwidth of 25 GHz (135ï¿œ160 GHz). Return loss is in excess of 5 dB. Measurements confirm the excellent repeatability of the fabrication and assembly processes and, thus, their suitability for use in high-volume applications. The proposed integration concept is highly scalable, permitting its usage far into the THz frequency spectrum. This article represents the first stage in the shift to highly compact, low-cost, volume-manufacturable THz waveguide systems.
|
|
| 2. |
- Hassona, Ahmed Adel, 1988, et al.
(författare)
-
A Low-loss D-band Chip-to-Waveguide Transition Using Unilateral Fin-line Structure
- 2018
-
Ingår i: IEEE MTT-S International Microwave Symposium Digest. - 0149-645X. ; 2018-June, s. 390-393
-
Konferensbidrag (refereegranskat)abstract
- This paper presents a D-band interconnect realized using unilateral finline structure. The interconnect consists of a microstrip line implemented on a 75μm-thick SiC substrate. The line then couples to a unilateral finline taper that is mounted in the E-plane of a standard WR-6.5 D-band waveguide. The interconnect achieves low insertion loss and covers very wide frequency range. The measured minimum insertion loss is 0.67 dB and the maximum is 2 dB per transition across the entire D-band covering the frequency range 110-170 GHz. The transition does not require any galvanic contacts nor any special processing and can be implemented in any of the commercially available semiconductor technologies. This solution provides low-loss wideband packaging technique that enables millimeter-wave systems assembly using a high-performance simple approach.
|
|
| 3. |
- Hassona, Ahmed Adel, 1988, et al.
(författare)
-
A non-galvanic D-band MMIC-to-waveguide transition using eWLB packaging technology
- 2017
-
Ingår i: 2017 IEEE MTT-S International Microwave Symposium (IMS). - : Institute of Electrical and Electronics Engineers (IEEE). - 0149-645X. - 9781509063604 ; , s. 510-512
-
Konferensbidrag (refereegranskat)abstract
- This paper presents a novel D-band interconnect implemented in a low-cost embedded Wafer Level Ball Grid Array (eWLB) commercial process. The non-galvanic transition is realized through a slot antenna directly radiating to a standard air filled waveguide. The interconnect achieves low insertion loss and relatively wide bandwidth. The measured average insertion loss is 3 dB across a bandwidth of 22% covering the frequency range 110138 GHz. The measured average return loss is -10 dB across the same frequency range. Adopting the low-cost eWLB process and standard waveguides makes the transition an attractive solution for interconnects beyond 100 GHz. This solution enables mm-wave system on chip (SoC) to be manufactured and assembled in high volumes cost effectively. To the authors' knowledge, this is first attempt to fabricate a packaging solution beyond 100 GHz using eWLB technology.
|
|
| 4. |
- Hassona, Ahmed Adel, 1988, et al.
(författare)
-
Compact Low-Loss Chip-to-Waveguide and Chip-to-Chip Packaging Concept Using EBG Structures
- 2021
-
Ingår i: IEEE Microwave and Wireless Components Letters. - 1558-1764 .- 1531-1309. ; 31:1, s. 9-12
-
Tidskriftsartikel (refereegranskat)abstract
- This letter presents a novel approach for packaging millimeter-wave (mmW) and terahertz (THz) circuits. The proposed technique relies on using an on-chip coupling structure that couples the signal to a quarter-wavelength cavity, which in turn couples to either a waveguide (WG) or another chip. The solution also uses a periodic electromagnetic bandgap (EBG) structure that controls the electromagnetic wave and prevents field leakage in undesired directions. The proposed solution is fabricated and demonstrated at the D-band (110-170 GHz), and the measurement results show that it achieves a minimum insertion loss of 0.8 and a 3-dB bandwidth extending from 124 to 161 GHz. The proposed approach does not require any galvanic contacts and can be used for packaging integrated circuits in WG modules as well as for chip-to-chip communication.
|
|
| 5. |
- Hassona, Ahmed Adel, 1988, et al.
(författare)
-
D-band waveguide-to-microstrip transition implemented in eWLB packaging technology
- 2020
-
Ingår i: Electronics Letters. - : Institution of Engineering and Technology (IET). - 1350-911X .- 0013-5194. ; 56:4, s. 187-
-
Tidskriftsartikel (refereegranskat)abstract
- This Letter presents a non-galvanic D-band (110-170 GHz) interconnect realised in embedded wafer level ball grid array (eWLB) packaging technology. The interconnect consists of a patch-radiator-based waveguide transition implemented using one of the technology's redistribution layers. The patch radiates to a WR-6.5 standard waveguide perpendicular to its plane. An electromagnetic band-gap structure realised by metal patches is used to suppress undesired modes and improve the performance of the transition. The proposed solution is experimentally verified, and measurement results show that the transition exhibits an average insertion loss of 2 dB across the frequency range 122-146 GHz which, to the best of the authors' knowledge, is the lowest reported loss for a D-band packaging solution in eWLB technology and hence addresses one of the main integration challenges facing millimetre-wave systems.
|
|
| 6. |
- Hassona, Ahmed Adel, 1988, et al.
(författare)
-
D-band Waveguide Transition Based on Linearly Tapered Slot Antenna
- 2017
-
Ingår i: 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac). - 9781538630556 ; , s. 64-67
-
Konferensbidrag (refereegranskat)abstract
- In this work, an on-chip Monolithic Microwave Integrated Circuit (MMIC) to waveguide transition is realized based on Linearly Tapered Slot antenna (LTSA) structure. The antenna is implemented on a 50-um-thick Gallium Arsenide (GaAs) substrate and placed in the E-plane of an air-filled D-band waveguide. The transition shows a maximum insertion loss of 1 dB across the frequency range 110-170 GHz. The average return loss of the transition is -15 dB and the minimum is -9 dB. The structure occupies an area of 0.82x0.6 mm2. The transition provides low-loss wide-band connectivity for millimeter-wave systems and addresses integration challenges facing systems operating beyond 100 GHz.
|
|
| 7. |
- Hassona, Ahmed Adel, 1988, et al.
(författare)
-
Demonstration of +100-GHz Interconnects in eWLB Packaging Technology
- 2019
-
Ingår i: IEEE Transactions on Components, Packaging and Manufacturing Technology. - 2156-3985 .- 2156-3950. ; 9:7, s. 1406-1414
-
Tidskriftsartikel (refereegranskat)abstract
- This paper presents waveguide interconnects implemented in an embedded wafer level ball grid array (eWLB) packaging technology. The interconnects operate at D-band (110–170 GHz), hence are enabling the realization and commercialization of high-data-rate systems. The interconnects rely on implementing radiating structures on the technology’s redistribution layers instead of using conventional ball grid arrays for the transmission of the RF signal to/from the package. The interconnects interface with standard WR-6.5 waveguides. Moreover, they do not require any galvanic contacts with the waveguide. The interconnects achieve a measured insertion loss of 2.8 dB over a bandwidth of 33%. The adopted eWLB packaging technology is suitable for low-cost high-volume production and allows heterogeneous integration with other technologies. This paper proposes cost-effective high-performance interconnects for THz integration, thus addressing one of the main challenges facing systems operating beyond 100 GHz.
|
|
| 8. |
- Hassona, Ahmed Adel, 1988
(författare)
-
Enabling Solutions for Integration and Interconnectivity in Millimeter-wave and Terahertz Systems
- 2020
-
Doktorsavhandling (övrigt vetenskapligt/konstnärligt)abstract
- Recently, Terahertz (THz) systems have witnessed increasing attention due to the continuous need for high data rate transmission which is mainly driven by next-generation telecommunication and imaging systems. In that regard, the THz range emerged as a potential domain suitable for realizing such systems by providing a wide bandwidth capable of achieving and meeting the market requirements. However, the realization of such systems faces many challenges, one of which is interconnectivity and high level of integration. Conventional packaging techniques would not be suitable from performance perspective above 100 GHz and new approaches need to be developed. This thesis proposes and demonstrates several approaches to implement interconnects that operate above 100 GHz. One of the most attractive techniques discussed in this work is to implement on-chip coupling structures and insert the monolithic microwave integrated circuit (MMIC) directly into a waveguide (WG). Such approach provides high level of integration and eliminates the need of galvanic contacts; however, it suffers from a major drawback which isthe propagation of parasitic modes in the circuit cavity if the MMIC is large enough to allow such modes to propagate. To mitigate this problem, this work suggests and investigates the use of electromagnetic bandgap (EBG) structures that suppresses those modes such as bed of nails and mushroom-type EBG structures. The proposed techniques are used to implement several on-chip packaging solutions that have an insertion loss as low as 0.6 dB at D-band (110-170 GHz). Moreover, the solutions are demonstrated in several active systems using various commercial MMIC technologies. The thesis also investigates the possibility of utilizing the commercially available packaging technologies such as Embedded Wafer Level Ball Grid Array (eWLB) packaging. Such technology has been widely used for integrated circuits operating below 100 GHz but was not attempted in the THz range before. This work attempts to push the limits of the technology and proposes novel solutions based on coupling structures implemented in the technology’s redistribution layers. The proposed solutions achieve reasonable performance at D-band that are suitable for low-cost mass production while allowing heterogeneous integration with other technologies as well. This work addresses integration challenges facing systems operating in the THz range and proposes high-performance interconnectivity solutions demonstrated in a wide range of commercial technologies and hence enables such systems to reach their full potential and meet the increasing market demands.
|
|
| 9. |
- Hassona, Ahmed Adel, 1988, et al.
(författare)
-
F-band Low-loss Tapered Slot Transition for Millimeter-wave System Packaging
- 2019
-
Ingår i: 2019 49th European Microwave Conference, EuMC 2019. - 9782874870552 ; , s. 432-435
-
Konferensbidrag (refereegranskat)abstract
- This work presents a packaging solution at F-band (90 - 140 GHz) using on-chip waveguide transition. The transition is realized using a Linearly Tapered Slot (LTS) implemented in a commercial Gallium Arsenide (GaAs) Monolithic Microwave Integrated Circuit (MMIC) technology. The LTS is mounted in the E-plane of a split-block waveguide module and fed through a microstrip line. The transition is experimentally verified using a back-to-back test structure and it exhibits an average insertion loss of 1.7 dB over the frequency range extending from 100 to 135 GHz. This work presents an on-chip packaging technique to realize the interface between MMICs and standard waveguides at millimeter-wave (mmW) frequencies and hence addressing one of the main integration challenging facing systems operating at that range.
|
|
| 10. |
- Hassona, Ahmed Adel, 1988, et al.
(författare)
-
G-band Frequency Converters in 130-nm InP DHBT Technology
- 2021
-
Ingår i: 2020 50th European Microwave Conference, EuMC 2020. ; , s. 1027-1030
-
Konferensbidrag (refereegranskat)abstract
- This paper presents the design and characterisation of a two G-band (140 - 220 GHz) fundamental mixers. The mixers are implemented in a 130-nm indium phosphide (InP) double heterojunction bipolar transistor (DHBT) technology. First, a passive double balanced topology was investigated using a diode ring with balanced RF and LO ports. The mixer operates in both upconversion and downconversion modes. In order to reduce the power requirement on the local oscillator (LO) at G-band, the diodes were dc biased. Measurement results show that the mixer has an average conversion loss of 12.4 and 14 dB for upconversion and downconversion modes respectively and covers the frequency range extending from 180 to 194 GHz. The mixer exhibits an LO-RF isolation of 21 dB and requires an LO power of +2 dBm. An upconverting transconductance mixer topology was also investigated using the same technology. Measurement results show that the mixer has an average conversion gain of 1 dB over the frequency range of 171 to 220 GHz. The mixer operates as an upconverter and requires a low LO power of only -4 dBm.
|
|
