| 1. |
- Bogaerts, Wim, et al.
(författare)
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Programmable Photonic Circuits powered by Silicon Photonic MEMS Technology
- 2022
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Ingår i: Photonic Networks and Devices, Networks 2022. - : Optica Publishing Group (formerly OSA).
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Konferensbidrag (refereegranskat)abstract
- Programmable photonic chips allow flexible reconfiguration of on-chip optical connections, controlled through electronics and software. We will present the recent progress of such complex photonic circuits powered by silicon photonic MEMS actuators.
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| 2. |
- Bogaerts, W., et al.
(författare)
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Programmable photonic circuits using silicon photonic MEMS
- 2021
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Ingår i: Optics InfoBase Conference Papers. - : The Optical Society.
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Konferensbidrag (refereegranskat)abstract
- We present a silicon photonics technology extended with low-power MEMS scalable to large circuits. This enables us to make photonic waveguide meshes that can be reconfigured using electronics and software.
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| 3. |
- Bogaerts, Wim, et al.
(författare)
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Programmable silicon photonic circuits powered by MEMS
- 2022
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Ingår i: Proceedings of SPIE - The International Society for Optical Engineering. - : SPIE-Intl Soc Optical Eng.
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Konferensbidrag (refereegranskat)abstract
- We present our work to extend silicon photonics with MEMS actuators to enable low-power, large scale programmable photonic circuits. For this, we start from the existing iSiPP50G silicon photonics platform of IMEC, where we add free-standing movable waveguides using a few post-processing steps. This allows us to implement phase shifters and tunable couplers using electrostatically actuated MEMS, while at the same time maintaining all the original functionality of the silicon photonics platform. The MEMS devices are protected using a wafer-level sealing approach and interfaced with custom multi-channel driver and readout electronics.
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| 4. |
- Bogaerts, Wim, et al.
(författare)
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Scaling programmable silicon photonics circuits
- 2023
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Ingår i: Silicon Photonics XVIII. - : SPIE-Intl Soc Optical Eng.
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Konferensbidrag (refereegranskat)abstract
- We give an overview the progress of our work in silicon photonic programmable circuits, covering the techn stack from the photonic chip over the driver electronics, packaging technologies all the way to the sof layers. On the photonic side, we show our recent results in large-scale silicon photonic circuits with diff tuning technologies, including heaters, MEMS and liquid crystals, and their respective electronic driving sch We look into the scaling potential of these different technologies as the number of tunable elements in a ci increases. Finally, we elaborate on the software routines for routing and filter synthesis to enable the pho programmer.
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| 5. |
- Edinger, Pierre, et al.
(författare)
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A vacuum-sealed silicon photonic MEMS tunable ring resonator with independent control over coupling and phase
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Annan publikation (övrigt vetenskapligt/konstnärligt)abstract
- Ring resonators are a vital element for designing filters, optical delay lines, or sensors in silicon photonics. However, reconfigurable ring resonators with low-power consumption and good optical performance are not available in foundries today. We demonstrate an add-drop ring resonator with the independent tuning of coupling and round-trip phase using low-power microelectromechanical (MEMS) actuation. The MEMS rings are individually vacuum-sealed on wafer scale, enabling reliable long-term operation with low damping. On resonance, we demonstrate a modulation increase of up to 15 dB, with a voltage bias of 4V and a peak drive amplitude as low as 20mV.
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| 6. |
- Edinger, Pierre, et al.
(författare)
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An Integrated Platform for Cavity Optomechanics with Vacuum-Sealed Silicon Photonic MEMS
- 2023
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Ingår i: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023. - : Institute of Electrical and Electronics Engineers Inc.. ; , s. 425-428
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Konferensbidrag (refereegranskat)abstract
- Silicon photonics is an excellent platform for integrated cavity optomechanics due to silicon's high light confinement and favorable mechanical properties. However, optomechanical devices require a vacuum environment to inhibit damping due to air.We present an integrated platform for cavity optomechanics using thermo-compression bonding of silicon caps to provide on-chip vacuum sealing. We demonstrate optomechanical coupling in a vacuum-sealed ring resonator implemented on the platform, either by modulation of the laser power or by using an electrostatic phase shifter in the ring.By enabling optomechanics on a standard platform, we aim to make the technology available to a wider user base.
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| 7. |
- Edinger, Pierre, et al.
(författare)
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Vacuum-sealed silicon photonic MEMS tunable ring resonator with an independent control over coupling and phase
- 2023
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Ingår i: Optics Express. - : Optica Publishing Group. - 1094-4087. ; 31:4, s. 6540-6551
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Tidskriftsartikel (refereegranskat)abstract
- Ring resonators are a vital element for filters, optical delay lines, or sensors in silicon photonics. However, reconfigurable ring resonators with low-power consumption are not available in foundries today. We demonstrate an add-drop ring resonator with the independent tuning of round-trip phase and coupling using low-power microelectromechanical (MEMS) actuation. At a wavelength of 1540 nm and for a maximum voltage of 40 V, the phase shifters provide a resonance wavelength tuning of 0.15 nm, while the tunable couplers can tune the optical resonance extinction ratio at the through port from 0 to 30 dB. The optical resonance displays a passive quality factor of 29 000, which can be increased to almost 50 000 with actuation. The MEMS rings are individually vacuum-sealed on wafer scale, enabling reliable and long-term protection from the environment. We cycled the mechanical actuators for more than 4 x 109 cycles at 100 kHz, and did not observe degradation in their response curves. On mechanical resonance, we demonstrate a modulation increase of up to 15 dB, with a voltage bias of 4 V and a peak drive amplitude as low as 20 mV.
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| 8. |
- Jo, Gaehun, 1992-, et al.
(författare)
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Wafer-level Hermetic Sealing of Silicon Photonic MEMS by Direct Metal-to-Metal Bonding
- 2022
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- The field of silicon (Si) photonic micro-electromechanical system (MEMS) for photonic integrated circuits (PICs) has evolved rapidly. Thanks to the ultra-low power consumption of Si photonic MEMS, it enables a wide range of high-performance photonic devices such as integrated optical MEMS phase shifters, tunable couplers and switches. However, photonic MEMS have suspended and movable parts which need to be protected from environmental influences, such as exposure to dust and humidity. Therefore, a packaging solution is needed for reliable operation over long periods. Here, we demonstrate wafer-level vacuum sealing of Si photonic MEMS inside cavities with ultra-thin Si caps.
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| 9. |
- Jo, Gaehun, 1992-, et al.
(författare)
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Wafer-level hermetically sealed silicon photonic MEMS
- 2022
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Ingår i: Photonics Research. - : Optical Society of America. - 2327-9125. ; 10:2, s. A14-A21
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Tidskriftsartikel (refereegranskat)abstract
- The emerging fields of silicon (Si) photonic micro–electromechanical systems (MEMS) and optomechanics enable a wide range of novel high-performance photonic devices with ultra-low power consumption, such as integrated optical MEMS phase shifters, tunable couplers, switches, and optomechanical resonators. In contrast to conventional SiO2-clad Si photonics, photonic MEMS and optomechanics have suspended and movable parts that need to be protected from environmental influence and contamination during operation. Wafer-level hermetic sealing can be a cost-efficient solution, but Si photonic MEMS that are hermetically sealed inside cavities with optical and electrical feedthroughs have not been demonstrated to date, to our knowledge. Here, we demonstrate wafer-level vacuum sealing of Si photonic MEMS inside cavities with ultra-thin caps featuring optical and electrical feedthroughs that connect the photonic MEMS on the inside to optical grating couplers and electrical bond pads on the outside. We used Si photonic MEMS devices built on foundry wafers from the iSiPP50G Si photonics platform of IMEC, Belgium. Vacuum confinement inside the sealed cavities was confirmed by an observed increase of the cutoff frequency of the electro-mechanical response of the encapsulated photonic MEMS phase shifters, due to reduction of air damping. The sealing caps are extremely thin, have a small footprint, and are compatible with subsequent flip-chip bonding onto interposers or printed circuit boards. Thus, our approach for sealing of integrated Si photonic MEMS clears a significant hurdle for their application in high-performance Si photonic circuits.
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| 10. |
- Jo, Gaehun, 1992-, et al.
(författare)
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Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS
- 2021
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Ingår i: Proceedings SPIE OPTO 6-12 march 2021 silicon photonics XVI. - : SPIE-Intl Soc Optical Eng.
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- Silicon (Si) photonic micro-electro-mechanical systems (MEMS), with its low-power phase shifters and tunable couplers, is emerging as a promising technology for large-scale reconfigurable photonics with potential applications for example in photonic accelerators for artificial intelligence (AI) workloads. For silicon photonic MEMS devices, hermetic/vacuum packaging is crucial to the performance and longevity, and to protect the photonic devices from contamination. Here, we demonstrate a wafer-level vacuum packaging approach to hermetically seal Si photonic MEMS wafers produced in the iSiPP50G Si photonics foundry platform of IMEC. The packaging approach consists of transfer bonding and sealing the silicon photonic MEMS devices with 30 µm-thick Si caps, which were prefabricated on a 100 mm-diameter silicon-on-insulator (SOI) wafer. The packaging process achieved successful wafer-scale vacuum sealing of various photonic devices. The functionality of photonic MEMS after the hermetic/vacuum packaging was confirmed. Thus, the demonstrated thin Si cap packaging shows the possibility of a novel vacuum sealing method for MEMS integrated in standard Si photonics platforms.
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