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| 2. |
- Nigussie, E., et al.
(författare)
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Boosting performance of self-timed delay-insensitive bit parallel on-chip interconnects
- 2011
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Ingår i: IET CIRC DEVICE SYST. - : Institution of Engineering and Technology (IET). - 1751-858X. ; 5:6, s. 505-517
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Tidskriftsartikel (refereegranskat)abstract
- The authors present a performance boosting technique with a better power efficiency for delay-insensitive on-chip interconnects. The increase in signal propagation delay uncertainty with technology scaling makes self-timed delay-insensitive on-chip interconnects the most appropriate alternative. However, achieving high-performance communication in self-timed delay-insensitive links is difficult, especially for large bit parallel transmission because of the time-consuming detection of each bit validity. The authors present a high-speed completion detection technique along with its circuit implementation and two on-chip interconnects which use the proposed completion detection circuit. The performance, power consumption, power efficiency and area of the presented on-chip interconnects are analysed and compared with the conventionally implemented delay-insensitive interconnects. For 64-bit parallel transmission, 2.07 and 1.72 times throughput improvement with 47 and 39% more power efficiency have been achieved for the two interconnects compared to their conventional counterparts. The interconnect circuits are designed and simulated using Cadence Analog Spectre and Hspice with 65 nm complementary metal-oxide semiconductor technology from STMicroelectronics.
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| 3. |
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| 4. |
- Daneshtalab, M., et al.
(författare)
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A Low-Latency and Memory-Efficient On-chip Network
- 2010
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Ingår i: NOCS 2010. ; , s. 99-106
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Konferensbidrag (refereegranskat)abstract
- Using multiple SDRAMs in MPSoCs and NoCs to increase memory parallelism is very common nowadays. In-order delivery, resource utilization, and latency are the most critical issues in such architectures. In this paper, we present a novel network interface architecture to cope with these issues efficiently. The proposed network interface exploits a resourceful reordering mechanism to handle the in-order delivery and to increase the resource utilization. A brilliant memory controller is efficiently integrated into this network interface to improve the memory utilization and reduce both memory and network latencies. In addition, to bring compatibility with existing IP cores the proposed network interface utilizes AXI transaction based protocol. Experimental results with synthetic test cases demonstrate that the proposed architecture gives significant improvements in average network latency (12%), average memory access latency (19%), and average memory utilization (22%).
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| 5. |
- Daneshtalab, M., et al.
(författare)
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CMIT : A novel cluster-based topology for 3D stacked architectures
- 2010
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Ingår i: IEEE 3D System Integration Conference 2010, 3DIC 2010.
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Konferensbidrag (refereegranskat)abstract
- Combining the benefits of 3D IC and Network-on-Chip (NoC) schemes, provides a significant performance gain for 3D stacked architectures. In recent years, Through-Silicon-Via (TSV), employed for inter-layer connectivity (vertical channel), has attracted a lot of interest since it enables faster and more power efficient inter-layer communication across multiple stacked layers. However, the area overhead of TSVs reduces wafer utilization and yield which impact design of 3D architectures using a large number of TSVs. In this paper, we propose a novel stacked topology, named CMIT (Cluster Mesh Inter-layer Topology) for 3D architectures to reduce the area overhead of TSVs and power dissipation on each layer with minimal performance penalty. Experimental results with synthetic test cases demonstrate that the presented topology can save more than 75% of TSV area footprint and reduces more than 10% of power consumption with a negligible performance overhead.
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| 6. |
- Daneshtalab, M., et al.
(författare)
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High-performance on-chip network platform for memory-on-processor architectures
- 2011
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Ingår i: 6th International Workshop on Reconfigurable Communication-Centric Systems-on-Chip, ReCoSoC 2011 - Proceedings.
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Konferensbidrag (refereegranskat)abstract
- Three Dimensional Integrated Circuits (3D ICs) are emerging to improve existing Two Dimensional (2D) designs by providing smaller chip areas, higher performance and lower power consumption. Stacking memory layers on top of a multiprocessor layer (logic layer) is a potential solution to reduce wire delay and increase the bandwidth. To fully employ this capability, an efficient on-chip communication platform is required to be integrated in the logic layer. In this paper, we present an on-chip network platform for the logic layer utilizing an efficient network interface to exploit the potential bandwidth of stacked memory-on-processor architectures. Experimental results demonstrate that the platform equipped with the presented network interface increases the performance considerably.
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| 7. |
- Daneshtalab, M., et al.
(författare)
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High-Performance TSV Architecture for 3-D ICs
- 2010
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Ingår i: Proceedings - IEEE Annual Symposium on VLSI, ISVLSI 2010. - : Institute of Electrical and Electronics Engineers (IEEE). - 9781424473212 ; , s. 467-468
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Konferensbidrag (refereegranskat)abstract
- Three-dimensional integrated circuits (3-D ICs) outperform traditional planar ICs in terms of performance, packaging density, interconnection power consumption, and functionality. Since the performance of 3-D ICs employing Through Silicon Vias (TSVs) depends on vertical interlayer interconnects, in this paper we present a high-performance bus architecture for TSVs.
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| 8. |
- Daneshtalab, M., et al.
(författare)
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Input-Output Selection Based Router for Networks-on-Chip
- 2010
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Ingår i: IEEE Annual Symposium on VLSI, ISVLSI 2010. ; , s. 92-97
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Konferensbidrag (refereegranskat)abstract
- In this paper, we propose a novel on-chip router architecture for avoiding congested areas in regular twodimensional on-chip networks. This architecture takes advantage of an efficient adaptive routing model based on the Hamiltonian path for both the multicast and unicast traffic. The output selection of the proposed architecture is based on the congestion condition of neighboring routers and the input selection is based on the Weighted Round Robin mechanism which allows packets to be serviced from each input port according to its congestion level The simulation results show that in multicast, unicast, and mixed traffic profiles the proposed model has lower average delays and lower average and peak power compared to previously proposed models.
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| 9. |
- Daneshtalab, M., et al.
(författare)
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Memory-Efficient On-Chip Network With Adaptive Interfaces
- 2012
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Ingår i: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. - : Institute of Electrical and Electronics Engineers (IEEE). - 0278-0070 .- 1937-4151. ; 31:1, s. 146-159
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Tidskriftsartikel (refereegranskat)abstract
- To achieve higher memory bandwidth in network-based multiprocessor architectures, multiple dynamic random access memories can be accessed simultaneously. In such architectures, not only resource utilization and latency are the critical issues but also a reordering mechanism is required to deliver the response transactions of concurrent memory accesses in-order. In this paper, we present a memory-efficient on-chip network architecture to cope with these issues efficiently. Each node of the network is equipped with a novel network interface (NI) to deal with out-of-order delivery, and a priority-based router to decrease the network latency. The proposed NI exploits a streamlined reordering mechanism to handle the in-order delivery and utilizes the advance extensible interface transaction-based protocol to maintain compatibility with existing intellectual property cores. To improve the memory utilization and reduce the memory latency, an optimized memory controller is integrated in the presented NI. Experimental results with synthetic test cases demonstrate that the proposed on-chip network architecture provides significant improvements in average network latency (16%), average memory access latency (19%), and average memory utilization (22%).
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| 10. |
- Daneshtalab, M., et al.
(författare)
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Pipeline-based interlayer bus structure for 3D networks-on-chip
- 2010
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Ingår i: Proceedings - 15th CSI International Symposium on Computer Architecture and Digital Systems, CADS 2010. ; , s. 35-41
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Konferensbidrag (refereegranskat)abstract
- The structure of direct vertical interconnections, called Through Silicon Vias (TSVs), is an important issue in the realm of 3D ICs. The bus-based and network-based structures are the two dominant architectures for implementing TSVs as interlayer connection in 3D ICs. Both implementations have some disadvantages. The former suffers from poor scalability and deteriorates the performance at high injection rates, and the latter consumes more area and power dissipation. In this paper, we propose a novel pipeline bus structure for TSVs to improve the performance of the prior bus-based architecture. The presented structure can utilize bi-synchronous FIFO for synchronization between stacked layers if each layer is fabricated by different technologies. Experimental results with synthetic test cases demonstrate that the proposed architecture gives significant improvements in average network latency. Also, the hardware area and power consumption of the presented bus structure are 9% and 11% less than the typical bus structure of TSVs, respectively.
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