| 1. |
- Batsleer, Janet, et al.
(författare)
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Non-formal spaces of socio-cultural accompaniment: Responding to young unaccompanied refugees – reflections from the Partispace project
- 2018
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Ingår i: European Educational Research Journal. - : SAGE Publications. - 1474-9041. ; 17:2, s. 305-322
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Tidskriftsartikel (refereegranskat)abstract
- Drawing on research in progress in the Partispace project we make a case for the recognition of the importance of non-formal spaces in response to young refugees across three different national contexts: Frankfurt in Germany; Gothenburg in Sweden; and Manchester in the UK. It is argued that recognition of local regulation and national controls of immigration which support climates of hostility makes it important to recognise and affirm the significance of non-formal spaces and ‘small spaces close to home’ which are often developed in the ‘third space’ of civil society and arise from the impulses driven by the solidarity of volunteers. In these contexts it is important that practices of hospitality can develop which symbolically reconstitute refugees as hosts and subjects of a democratic conversation, without which there is no possible administrative solution to the refugee crisis. It is essential that educational spaces such as schools, colleges and universities forge strong bonds with such emergent spaces.
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| 2. |
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| 3. |
- Khorramdel, Behnam, et al.
(författare)
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Inkjet printing technology for increasing the I/O density of 3D TSV interposers
- 2017
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Ingår i: Microsystems & Nanoengineering. - : Nature Publishing Group. - 2055-7434. ; 3, s. 17002-
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Tidskriftsartikel (refereegranskat)abstract
- Interposers with through-silicon vias (TSVs) play a key role in the three-dimensional integration and packaging of integrated circuits and microelectromechanical systems. In the current practice of fabricating interposers, solder balls are placed next to the vias; however, this approach requires a large foot print for the input/output (I/O) connections. Therefore, in this study, we investigate the possibility of placing the solder balls directly on top of the vias, thereby enabling a smaller pitch between the solder balls and an increased density of the I/O connections. To reach this goal, inkjet printing (that is, piezo and super inkjet) was used to successfully fill and planarize hollow metal TSVs with a dielectric polymer. The under bump metallization (UBM) pads were also successfully printed with inkjet technology on top of the polymer-filled vias, using either Ag or Au inks. The reliability of the TSV interposers was investigated by a temperature cycling stress test (-40 °C to +125 °C). The stress test showed no impact on DC resistance of the TSVs; however, shrinkage and delamination of the polymer was observed, along with some micro-cracks in the UBM pads. For proof of concept, SnAgCu-based solder balls were jetted on the UBM pads.
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| 4. |
- Laakso, Miku J., et al.
(författare)
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Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires
- 2018
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Ingår i: IEEE Access. - : Institute of Electrical and Electronics Engineers (IEEE). - 2169-3536. ; 6, s. 44306-44317
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Tidskriftsartikel (refereegranskat)abstract
- A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). However, TGVs are challenging to realize because via holes in glass typically do not have a sufficiently high-quality sidewall profile for super-conformal electroplating of metal into the via holes. To overcome this problem, we demonstrate here that the via holes can instead be filled by magnetically assembling metal wires into them. This method was used to produce TGVs with a typical resistance of 64 m Omega, which is comparable with other metal TGV types reported in the literature. In contrast to many TGV designs with a hollow center, the proposed TGVs can be more area efficient by allowing solder bump placement directly on top of the TGVs, which was demonstrated here using solder-paste jetting. The magnetic assembly process can be parallelized using an assembly robot, which was found to provide an opportunity for increased wafer-scale assembly speed. The aforementioned qualities of the magnetically assembled TGVs allow the realization of glass interposers and MEMS packages in different thicknesses without the drawbacks associated with the current TGV fabrication methods.
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| 5. |
- Laakso, Miku, 1989-, et al.
(författare)
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Maskless Manufacturing of Through Glass Vias (TGVs) and Their Test Structures
- 2017
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Ingår i: Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). - 9781509050789 ; , s. 753-756
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Konferensbidrag (refereegranskat)abstract
- Through glass vias (TGVs) are a key component in glass-based interposers and microelectromechanical-system lid wafers. Magnetic-field-assisted self-assembly has been demonstrated earlier in fabrication of through silicon vias. Here we present an entirely maskless TGV fabrication process utilizing magnetic assembly. Femtosecond laser is used for ablative direct patterning of surface metal layers and for exposing the TGV conductors after wafer thinning. The proposed TGV structure is shown to be electrically functional by measuring the TGV resistance values.
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| 6. |
- Laakso, Miku, 1989-, et al.
(författare)
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Through-Glass Vias for MEMS Packaging
- 2018
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- Novelty / Progress Claims We have developed a new method for fabrication of through-glass vias (TGVs). The method allows rapid filling of via holes with metal rods both in thin and thick glass substrates.Background Vertical electrical feedthroughs in glass substrates, i.e. TGVs, are often required in wafer-scale packaging of MEMS that utilizes glass lids. The current methods of making TGVs have drawbacks that prevent the full utilization of the excellent properties of glass as a package material, e.g. low RF losses. Magnetic assembly has been used earlier to fabricate through-silicon vias (TSVs), and in this work we extend this method to realize TGVs [1]. Methods The entire TGV fabrication process is maskless, and the processes used include: direct patterning of wafer metallization using femtosecond laser ablation, magnetic-fieldassisted self-assembly of metal wires into via holes, and solder-paste jetting of bump bonds on TGVs.Results We demonstrate that: (1) the magnetically assembled TGVs have a low resistance, which makes them suitable even for low-loss and high-current applications; (2) the magneticassembly process can be parallelized in order to increase the wafer-scale fabrication speed; (3) the magnetic assembly produces void-free metal filling for TGVs, which allows solder placement directly on top of the TGV for the purpose of high integration density; and (4) good thermal-expansion compatibility between TGV metals and glass substrates is possible with the right choice of materials, and several suitable metals-glass pairs are identified for possible improvement of package reliability [2].[1] M. Laakso et al., IEEE 30th Int. Conf. on MEMS, 2017. DOI:10.1109/MEMSYS.2017.7863517[2] M. Laakso et al., “Through-Glass Vias for Glass Interposers and MEMS Packaging Utilizing Magnetic Assembly of Microscale Metal Wires,” manuscript in preparatio
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| 7. |
- Larsson, S., et al.
(författare)
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Simple method for quality factor estimation in resonating MEMS structures
- 2018
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Ingår i: Proceedings of the 17th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications, 2017. - : IOP Publishing.
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Konferensbidrag (refereegranskat)abstract
- The quality factor of a packaged MEMS resonating structure depends on both the packaging pressure and the structure's proximity to the walls. This type of mechanical constraints, which causes energy dissipation from the structure to the surrounding air, are applicable for oscillating energy harvesters and should be considered in the design process. However, the modelling of energy losses or the measurements of their direct influence inside a packaged chip is not trivial. In this paper, a simple experimental method to quantify the energy loss in an oscillating MEMS structures due to the surrounding air is described together with preliminary results. The main advantage of the method is the ability to characterize the damping contributions under different vacuum and packaging conditions without requiring any packaging of the harvester chip or fabrication of multiple devices with different cavity depths. © Published under licence by IOP Publishing Ltd.
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| 8. |
- Liljeholm, Jessica, et al.
(författare)
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Multilayer ferromagnetic composites enabling on-chip magnetic-core inductors beyond 1 GHZ
- 2015
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Ingår i: Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on. - : IEEE conference proceedings. ; , s. 811-814
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Konferensbidrag (refereegranskat)abstract
- This paper reports of fabricated unpatterned ferromagnetic NiFe/AlN multilayer composites and an established process flow for magnetic core material suitable for integration with Silex 3D RF TSV technology. The fabricated single-loop test inductors achieved an inductance enhancement of 4.8 and a quality factor enhancement of 4.5 at 400 MHz. Simulations show that magnetic material in connection with 3D TSV inductors result in an inductance enhancement up to a factor of 5 at GHz frequencies for the same inductor area or the same inductance can be achieved at 9 times smaller area and cost.
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| 9. |
- Liljeholm, Jessica, et al.
(författare)
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Through-Glass-Via Enabling Low Loss High-Linearity RF Components
- 2016
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Konferensbidrag (refereegranskat)abstract
- This paper reports on successful fabrication of metal through glass via (TGV) for low-loss high-linearity wafer-level 3D packages (WLP). The DC resistance was characterized to 28mOhm/TGV and the non-linearity of two sets of TGVs with a 1.1 mm long transmission line was better than 78 dBm (IP3).
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| 10. |
- McMahon, Grainne, et al.
(författare)
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Participation Biographies: Meaning-making, Identity-work and the Self
- 2019
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Ingår i: Young People and the Struggle for Participation. Contested Practices, Power and Pedagogies in Public Spaces. Andreas Walther, Janet Batsleer, Patricia Loncle, Axel Pohl (red.). - London : Routledge. - 9781138362420 ; , s. 161-175
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Bokkapitel (övrigt vetenskapligt/konstnärligt)abstract
- Young People and the Struggle for Participation rethinks dominant concepts and meanings of participation by exploring what young people do in public spaces and what these spaces mean to them, individually and collectively. This book discusses how different spaces and places structure and are in turn structured by young peoples’ activities. Drawing on findings from a comparative study in eight European cities, insights into different styles of youth participation emerging from formal, non-formal and informal settings are presented. The book provides a comparative analysis of how transnational discourses, national welfare states and local youth policies affect youth participation. It also investigates how it comes about that young people get involved in different forms of participation in the course of their biographies. This book will appeal to academics, researchers and post-graduate students in the fields of youth studies, community studies, sociology of education, political science, social work, psychology and anthropology.
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