| 1. |
- Atallah, Jad G., et al.
(författare)
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A frequency planning and generation scheme for multi-standard wireless transceivers
- 2005
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Ingår i: 12th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2005. - 9789972611001
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Konferensbidrag (refereegranskat)abstract
- This work presents a novel frequency planning scheme associated with a reference frequency generation scheme that has the potential of providing low phase noise contribution for several wireless standards including DCS1800, WCDMA II and III, DECT, WLAN a/b/g and Bluetooth. The scheme is particularly useful when implemented in future technologies and can be extended to cover newer wireless standards in newer bands of interest. It uses a single multi-band voltage-controlled oscillator (VCO) with switching inductors and high speed dividers directly generating the quadrature outputs. The VCO itself covers the frequency ranges from 4.8GHz to 6GHz and from 6.8GHz to 8GHz. Its phase noise is -136dBc/Hz at 1MHz offset from a center frequency of 1.85GHz. The design is sent for fabrication using 0.18ÎŒm CMOS.
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| 2. |
- Michielsen, Wim, et al.
(författare)
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Performance and cost estimations of packaged single band Voltage Controlled Oscillators
- 2004
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Ingår i: PROCEEDINGS OF THE IEEE 6TH CIRCUITS AND SYSTEMS SYMPOSIUM ON EMERGING TECHNOLOGIES: FRONTIERS OF MOBILE AND WIRELESS COMMUNICATION, VOLS 1 AND 2. - NEW YORK : IEEE. - 0780379381 ; , s. 53-56
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Konferensbidrag (refereegranskat)abstract
- This paper reports the performance and cost estimations in the early stage of a LC tank based Voltage Controlled Oscillator (VCO) design. System-on-Chip (SoC) versus System-on-package (SoP) configurations is compared for electrical performance and cost of a 1.25 GHz voltage controlled oscillator. It is found that a single chip design is not always the best solution. We obtained the best figure of merit for a SoP implementation where only the inductors were put off-chip.
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| 3. |
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| 4. |
- Zheng, Li-Rong, et al.
(författare)
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Cost and performance tradeoff analysis in radio and mixed-signal system-on-package design
- 2004
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Ingår i: IEEE Transactions on Advanced Packaging. - 1521-3323 .- 1557-9980. ; 27:2, s. 364-375
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Tidskriftsartikel (refereegranskat)abstract
- An optimal total solution for radio and mixed-signal system integration needs tradeoffs between different design options. Among various design metrics, cost and performance are probably the two most important factors for design decisions. In this paper, we review and analyze cost-performance tradeoffs of system-on-chip (SOC) versus system-on-Package (SOP) solutions for radio and mixed-signal applications. A new design methodology, which quantitatively predicts performance and cost gains of SOP versus SOC,is presented. The performance model evaluates various mixed-signal isolation techniques between sensitive analog/RF circuits and noisy digital circuits in SOC or SOP. The cost analysis includes new factors such as extra chip area and additional process steps for mixed-signal isolation, seamless integration of "virtual components" or intellectual property (IP) modules, yield and technology compatibility for merging logic, memory and analog/RF circuits on a single chip, and extra costs for moving passives off chip. In addition to these, a complete and systematic analysis method for on-chip versus off-chip passives tradeoffs is presented. The analysis and modeling techniques explore tradeoffs between performance, cost, robustness, and yield when different on-chip or off-chip passives are used. It thus provides a complete picture of quantitative tradeoffs for using on-chip or off-chip passives. The design methodology and analysis techniques are then demonstrated through several design examples in wireless applications. It is clearly shown that for all complex and high performance mixed-signal systems, SOP is a lower cost solution than SOC. Finally,some design guidelines for SOC versus SOP and on-chip versus off-chip are concluded.
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| 5. |
- Zheng, Li-Rong, et al.
(författare)
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Design and implementation of system-on-package for radio and mixed-signal applications
- 2004
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Ingår i: PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04). - NEW YORK : IEEE. - 0780386205 ; , s. 97-104
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Konferensbidrag (refereegranskat)abstract
- Emerging wireless applications for logistics, intelligent home networks, smart dusts, wireless body area networks (WBAN) will need integration and fusion of a diversity of technologies, which may include digital CMOS circuits, analog/RF circuits, sensors/MEMS, embedded software and memories, antenna, displays, polymer, packaging and interconnections, new materials and new integration process. System-on-package (SoP) is considered as a promising solution for the fundamental integration platform for such applications. In this paper, we show how SoP technology can address the integration platform for these applications and how this can be done in a better way than system-on-chip integration. We first demonstrate the integration process of, SoP in liquid-crystal polymer materials. We see that liquid-crystal-polymer is a promising material for low cost RF SoP. We then demonstrate some design examples. The first one is an integrated 5GHz RF receiver front-end in liquid crystal polymer. Due to high quality of passive components in SoP, superior RF performance is found in this module. In the second example, we address several critical design issues for on-chip versus off-chip passives in a multi-band multi-standard radio for beyond 3G applications. We find that not only RF performance can be improved. Cost benefits are also obvious for such a complex radio. Chip-package co-design for smart parasitic absorption is demonstrated through an RF module for an ultrawide band radio in gigabit wireless. Concept of a SoP pacemaker in a WBAN is shown. Finally, we discuss some system level integration issues and we show how a system can be smartly partitioned for SoP so that we can obtain an optimal total solution for low-cost and good-performance wireless integration.
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