| 1. |
- Hansson, Josef, 1991, et al.
(författare)
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Synthesis of a Graphene Carbon Nanotube Hybrid Film by Joule Self-heating CVD for Thermal Applications
- 2018
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Ingår i: Proceedings - Electronic Components and Technology Conference. - 0569-5503.
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Konferensbidrag (refereegranskat)abstract
- Hybrid films based on vertically aligned carbon nanotubes (CNTs) on graphene or graphite sheets have been proposed for application as thermal interface materials and micro heat sinks. However, the fabrication of these materials are limited to small scale, expensive and complicated chemical vapor deposition (CVD) for CNT synthesis. We present a new method for direct growth of CNTs on one or both sides of a thin graphene film (GF) using joule self-heating of the graphene film to provide the necessary heat for the thermal breakdown of carbon feedstock in a CVD process. The resulting CNT forests show good density and alignment consistent with regular CVD synthesis processes on silicon surfaces. The resulting double sided GF/CNT hybrid film is directly applicable as a thermal pad. The CNT forest has a thermal conductivity of 30 W/mK, measured by pulsed photothermal reflectance, and the total thermal interface resistance between aluminum blocks was measured to be 60 Kmm 2 /W using an ASTM D5470 compliant 1-D measurement setup. This method of directly synthesizing CNTs on graphene films is more energy efficient and capable of larger volume production compared to traditional CVD methods. It is also compatible with scaling up towards continuous roll-to-roll production for large scale commercial production, one of the major limitations preventing CVD-grown CNTs from commercial applications
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| 2. |
- Jiang, Di, 1983, et al.
(författare)
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Embedded Fin-Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors
- 2016
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Ingår i: Small. - : Wiley. - 1613-6810 .- 1613-6829. ; 12:11, s. 1521-1526
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Tidskriftsartikel (refereegranskat)abstract
- In this paper, an embedded fin-like metal-coated carbon nanotube (Fin-M/CNT) structure is demonstrated for flexible and transparent conductor wire applications. Embedded in a polydimethylsiloxane polymeric substrate, Fin-M/CNT wires with a minimum width of 5 μm and a minimum pitch of 10 μm have been achieved. Direct current resistances of single Fin-M/CNT wires, where the supporting CNT structures have been covered by Ti/Al/Au metal coatings of different thicknesses, have been measured. The high aspect ratio of the fin-like structures not only improves the adhesion between the wires and the polymeric substrate, but also yields a low resistance at a small surface footprint. In addition, transparent Fin-M/CNT grid lines with hexagonal patterns, with a sheet resistance of as low as 45 Ω sq−1, have been achieved at an optical transmittance of 88%. The robustness of the Fin-M/CNT structures has been demonstrated in bending tests up to 500 cycles and no significant changes in wire resistances are observed.
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| 3. |
- Nylander, Andreas, 1988, et al.
(författare)
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RF properties of carbon nanotube / Copper composite through silicon via based CPW structure for 3D integrated circuits
- 2019
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Ingår i: 2019 IEEE 14th Nanotechnology Materials and Devices Conference, NMDC 2019.
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Konferensbidrag (refereegranskat)abstract
- The development of integrated circuits (ICs) has seen exponential growth in performance over the last couple of decades and has pushed the boundaries for how we use our electronics in our daily lives. The scaling of ICs, and therefore also the performance development, is now starting to slow down when the physical designs are reaching critical dimensions where quantum effects starts to become noticeable. One proposed route to circumvent these issues for a continued scaling is based on the implementation of 3D integration by chip stacking for an increased miniaturization potential. Miniaturisation will soon also result in interconnect dimensions that surpass the mean free path (MFP) in Cu, the commonly used material for interconnects today, with a sharp increase in resistivity as a result. By changing the through silicon via (TSV) interconnect material from Cu to a carbon nanotube (CNT)/Cu composite, continued scaling can be ensured both in terms of electrical conductivity, ampacity and signal delays. Furthermore, a reduced skin effect can be achieved ensuring lower signal losses at higher RF frequencies making the CNT/Cu composite an ideal candidate to replace tranditional Cu interconnects. In this paper, we are demonstrating a coplanar waveguide (CPW) test structure using CNT/Cu filled TSVs connected to Au transmission lines on SiO2-passivated high resistivity Si substrates. The parasitic losses of the CNT/Cu TSV based CPW test structure were measured using a Sparameters test setup. The results showed that the CNT/Cu TSVs with affiliated contacts increased the signal losses up to S21 = -5.5 dB compared to Au reference transmission lines. These results are in line with previous results using CNT based TSVs and will serve as a basis for future improvements of CNT based interconnect technology for 3D integration.
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| 4. |
- Zehri, Abdelhafid, 1989, et al.
(författare)
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High porosity and light weight graphene foam heat sink and phase change material container for thermal management
- 2020
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Ingår i: Nanotechnology. - : IOP Publishing. - 1361-6528 .- 0957-4484. ; 31:42
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Tidskriftsartikel (refereegranskat)abstract
- During the last decade, graphene foam emerged as a promising high porosity 3-dimensional (3D) structure for various applications. More specifically, it has attracted significant interest as a solution for thermal management in electronics. In this study, we investigate the possibility to use such porous materials as a heat sink and a container for a phase change material (PCM). Graphene foam (GF) was produced using chemical vapor deposition (CVD) process and attached to a thermal test chip using sintered silver nanoparticles (Ag NPs). The thermal conductivity of the graphene foam reached 1.3 W m(-1)K(-1), while the addition of Ag as a graphene foam silver composite (GF/Ag) enhanced further its effective thermal conductivity by 54%. Comparatively to nickel foam, GF and GF/Ag showed lower junction temperatures thanks to higher effective thermal conductivity and a better contact. A finite element model was developed to simulate the fluid flow through the foam structure model and showed a positive and a non-negligible contributions of the secondary microchannel within the graphene foam. A ratio of 15 times was found between the convective heat flux within the primary and secondary microchannel. Our paper successfully demonstrates the possibility of using such 3D porous material as a PCM container and heat sink and highlight the advantage of using the carbon-based high porosity material to take advantage of its additional secondary porosity.
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| 5. |
- Fazi, Andrea, 1992, et al.
(författare)
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Multiple growth of graphene from a pre-dissolved carbon source
- 2020
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Ingår i: Nanotechnology. - : IOP Publishing. - 1361-6528 .- 0957-4484. ; 31:34, s. 345601-
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Tidskriftsartikel (refereegranskat)abstract
- Mono- to few-layer graphene materials are successfully synthesized multiple times using Cu-Ni alloy as a catalyst after a single-chemical vapor deposition (CVD) process. The multiple synthesis is realized by extracting carbon source pre-dissolved in the catalyst substrate. Firstly, graphene is grown by the CVD method on Cu-Ni catalyst substrates. Secondly, the same Cu-Nicatalyst foils are annealed, in absence of any external carbon precursor, to grow graphene using the carbon atoms pre-dissolved in the catalyst during the CVD process. This annealing process is repeated to synthesize graphene successfully until carbon is exhausted in the Cu-Ni foils. After the CVD growth and each annealing growth process, the as-grown graphene is removed using a bubbling transfer method. A wide range of characterizations are performed to examine the quality of the obtained graphene material and to monitor the carbon concentration in the catalyst substrates. Results show that graphene from each annealing growth process possesses a similar quality, which confirmed the good reproducibility of the method. This technique brings great freedom to graphene growth and applications, and it could be also used for other 2D material synthesis.
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| 6. |
- Hansson, Josef, 1991, et al.
(författare)
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Bipolar electrochemical capacitors using double-sided carbon nanotubes on graphite electrodes
- 2020
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Ingår i: Journal of Power Sources. - : Elsevier BV. - 0378-7753. ; 451
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Tidskriftsartikel (refereegranskat)abstract
- The electrochemical capacitor (EC) is a key enabler for the miniaturized self-powered systems expected to become ubiquitous with the advent of the internet-of-things (IoT). Vertically aligned carbon nanotubes (VACNTs) on graphite holds promise as electrodes for compact and low-loss ECs. However, as with all ECs, the operating voltage is low, and miniaturization of higher voltage devices necessitates a bipolar design. In this paper, we demonstrate a bipolar EC using graphite/VACNTs electrodes fabricated using a joule heating chemical vapor deposition (CVD) setup. The constructed EC contains one layer of double-sided VACNTs on graphite as bipolar electrode. Compared to a series connection of two individual devices, the bipolar EC has 22% boost in volumetric energy density. More significant boost is envisaged for stacking more bipolar electrode layers. The energy enhancement is achieved without aggravating self-discharge (71.2% retention after 1 h), and at no sacrifice of cycling stability (96.7% over 50000 cycles) owing to uniform growth of VACNTs and thus eliminating cell imbalance problems.
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| 7. |
- Hansson, Josef, 1991, et al.
(författare)
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Effects of high temperature treatment of carbon nanotube arrays on graphite : Increased crystallinity, anchoring and inter-tube bonding
- 2020
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Ingår i: Nanotechnology. - : Institute of Physics Publishing (IOPP). - 0957-4484 .- 1361-6528. ; 31:45
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Tidskriftsartikel (refereegranskat)abstract
- Thermal treatment of carbon nanotubes (CNTs) can significantly improve their mechanical, electrical and thermal properties due to reduced defects and increased crystallinity. In this work we investigate the effect of annealing at 3000 degrees C of vertically aligned CNT arrays synthesized by chemical vapor deposition (CVD) on graphite. Raman measurements show a drastically reduced amount of defects and, together with transmission electron microscope (TEM) diffraction measurements, an increased average crystallite size of around 50%, which corresponds to a 124% increase in Young's modulus. We also find a tendency for CNTs to bond to each other with van der Waals (vdW) forces, which causes individual CNTs to closely align with each other. This bonding causes a densification effect on the entire CNT array, which appears at temperatures >1000 degrees C. The densification onset temperature corresponds to the thermal decomposition of oxygen containing functional groups, which otherwise prevents close enough contact for vdW bonding. Finally, the remaining CVD catalyst on the bottom of the CNT array is evaporated during annealing, enabling direct anchoring of the CNTs to the underlying graphite substrate.
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| 8. |
- Jing, Lin, et al.
(författare)
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Thermal Conductivity Enhancement of Coaxial Carbon@Boron Nitride Nanotube Arrays
- 2017
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Ingår i: ACS Applied Materials & Interfaces. - : American Chemical Society (ACS). - 1944-8252 .- 1944-8244. ; 9:17, s. 14555-14560
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Tidskriftsartikel (refereegranskat)abstract
- We demonstrate the thermal conductivity enhancement of the vertically aligned carbon nanotube (CNT) arrays (from ?15.5 to 29.5 W/mK, ?90% increase) by encapsulating outer boron nitride nanotube (BNNT, 0.97 nm-thick with ?3-4 walls). The heat transfer enhancement mechanism of the coaxial C@BNNT was further revealed by molecular dynamics simulations. Because of their highly coherent lattice structures, the outer BNNT serves as additional heat conducting path without impairing the thermal conductance of inner CNT. This work provides deep insights into tailoring the heat transfer of arbitrary CNT arrays and will enable their broader applications as thermal interface material.
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| 9. |
- Li, Hangxi, 1994, et al.
(författare)
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Experimentally Verified, Fast Analytic, and Numerical Design of Superconducting Resonators in Flip-Chip Architectures
- 2023
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Ingår i: IEEE Transactions on Quantum Engineering. ; 4
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Tidskriftsartikel (refereegranskat)abstract
- In superconducting quantum processors, the predictability of device parameters is of increasing importance as many laboratories scale up their systems to larger sizes in a 3-D-integrated architecture. In particular, the properties of superconducting resonators must be controlled well to ensure high-fidelity multiplexed readout of qubits. Here, we present a method, based on conformal mapping techniques, to predict a resonator's parameters directly from its 2-D cross-section, without computationally heavy and time-consuming 3-D simulation. We demonstrate the method's validity by comparing the calculated resonator frequency and coupling quality factor with those obtained through 3-D finite-element-method simulation and by measurement of 15 resonators in a flip-chip-integrated architecture. We achieve a discrepancy of less than 2% between designed and measured frequencies for 6-GHz resonators. We also propose a design method that reduces the sensitivity of the resonant frequency to variations in the interchip spacing.
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| 10. |
- Liu, Ya, 1991, et al.
(författare)
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Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader
- 2019
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Ingår i: Proceedings - 2019 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2019. ; , s. 1-5
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Konferensbidrag (refereegranskat)abstract
- Thermally conductive materials with electrically insulating properties have been extensively investigated for thermal management of electronic devices. The combined properties of high thermal conductivity, structural stability, corrosion resistance and electric resistivity make hexagonal boron nitride (h-BN) a promising candidate for this purpose. Theoretical studies have revealed that h-BN has a high in-plane thermal conductivity up to 400-800 W m-1 K-1 at room temperature. However, it is still a big challenge to achieve high thermally conductive h-BN thick films that are commercially feasible due to its poor mechanical properties. On the other hand, many polymers exhibit advantages for flexibility. Thus, combining the merits of polymer and the high thermal conductivity of h-BN particles is considered as a promising solution for this issue. In this work, orientated PVP/h-BN films were prepared by electrospinning and a subsequent mechanical pressing process. With the optimized h-BN loading, a PVP/h-BN composite film with up to 22 W m-1 K-1 and 0.485 W m-1 K-1 for in-plane and through-plane thermal conductivity can be achieved, respectively. We believe this work can help accelerate the development of h-BN for thermal management applications.
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