| 1. |
- Gogova, Daniela, 1967-, et al.
(författare)
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Strain-free bulk-like GaN grown by hydride-vapor-phase-epitaxy on two-step epitaxial lateral overgrown GaN template
- 2004
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Ingår i: Journal of Applied Physics. - : AIP Publishing. - 0021-8979 .- 1089-7550. ; 96:1, s. 799-806
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Tidskriftsartikel (refereegranskat)abstract
- Crack-free bulk-like GaN with high crystalline quality has been obtained by hydride-vapor-phase-epitaxy (HVPE) growth on a two-step epitaxial lateral overgrown GaN template on sapphire. During the cooling down stage, the as-grown 270-μm-thick GaN layer was self-separated from the sapphire substrate. Plan-view transmission electron microscopy images show the dislocation density of the free-standing HVPE-GaN to be ∼2.5×107 cm−2 on the Ga-polar face. A low Ga vacancy related defect concentration of about 8×1015 cm−3 is extracted from positron annihilation spectroscopy data. The residual stress and the crystalline quality of the material are studied by two complementary techniques. Low-temperature photoluminescence spectra show the main neutral donor bound exciton line to be composed of a doublet structure at 3.4715 (3.4712) eV and 3.4721 (3.4718) eV for the Ga- (N-) polar face with the higher-energy component dominating. These line positions suggest virtually strain-free material on both surfaces with high crystalline quality as indicated by the small full width at half maximum values of the donor bound exciton lines. The E1(TO) phonon mode position measured at 558.52 cm−1 (Ga face) by infrared spectroscopic ellipsometry confirms the small residual stress in the material, which is hence well suited to act as a lattice-constant and thermal-expansion-coefficient matched substrate for further homoepitaxy, as needed for high-quality III-nitride device applications. © 2004 American Institute of Physics.
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| 2. |
- Pecz, B., et al.
(författare)
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GaN heterostructures with diamond and graphene
- 2015
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Ingår i: Semiconductor Science and Technology. - : IOP PUBLISHING LTD. - 0268-1242 .- 1361-6641. ; 30:11, s. 114001-
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Tidskriftsartikel (refereegranskat)abstract
- The full performance of GaN devices for high power applications is not exploited due to their self-heating. Possible solutions are the integration of materials with high heat conductivity i.e., single crystalline diamond and graphene layers. We report the growth of single crystalline (0001)-oriented GaN thin films on (100), (110) and (111) diamond single crystals studied by transmission electron microscopy (TEM) in cross-sections. As for graphene, we show a high quality GaN layer that was deposited on patterned graphene layers and 6H-SiC. The atomic structures of the interfaces in the heterostructure are studied using aberration-corrected scanning TEM combined with energy dispersive x-ray and electron energy-loss spectroscopy.
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| 3. |
- Giannazzo, F., et al.
(författare)
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Graphene integration with nitride semiconductors for high power and high frequency electronics
- 2017
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Ingår i: Physica Status Solidi (a) applications and materials science. - : WILEY-V C H VERLAG GMBH. - 1862-6300 .- 1862-6319. ; 214:4
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Tidskriftsartikel (refereegranskat)abstract
- Group III nitride semiconductors (III-N), including GaN, AlN, InN, and their alloys, are currently the materials of choice for many applications in optoelectronics (light-emitting diodes, laser diodes), and high-power and high-frequency transistors. Due to its attractive electrical, optical, mechanical, and thermal properties, graphene (Gr) integration with III-N technology has been considered in the last few years, in order to address some of the major issues which still limit the performances of GaN-based devices. To date, most of the studies have been focused on the use of Gr as transparent conductive electrode (TCE) to improve current spreading from top electrodes and light extraction in GaN-LEDs. This paper will review recent works evaluating the benefits of Gr integration with III-N for high power and high frequency electronics. From the materials side, recent progresses in the growth of high quality GaN layers on Gr templates and in the deposition of Gr on III-N substrates and templates will be presented. From the applications side, strategies to use Gr for thermal management in high-power AlGaN/GaN transistors will be discussed. Finally, recent proposals of implementing new ultra-high-frequency (THz) transistors, such as the Gr base hot electron transistor (GBHET), by Gr integration with III-N will be highlighted. (C) 2016 WILEY-VCH Verlag GmbH amp; Co. KGaA, Weinheim
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| 4. |
- Gogova, Daniela, et al.
(författare)
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Characterization of high-quality free-standing GaN grown by HVPE
- 2004
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Ingår i: Physica Scripta. - 0031-8949 .- 1402-4896. ; T114, s. 18-21
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Tidskriftsartikel (refereegranskat)abstract
- Single-crystalline 330µm thick GaN has been grown on 2'' Al2O3 (0 0 0 1) by hydride vapour phase epitaxy (HVPE). Upon laser-induced lift-off the GaN was delaminated from the sapphire substrate, and bulk-like free-standing GaN was achieved. Various characterization methods were utilized to assess the structural and optical quality of the freestanding material. The X-ray rocking curves of the (1 0–1 4) and (0 0 0 2) diffraction peaks revealed full width at half maximum (FWHM) values of 96 and 129arcsec, respectively. These data compare well with the smallest corresponding values published so far for bulk-like HVPE-GaN. The dislocation density determined by plan-view transmission electron microscopy studies is 1–2 × 107cm–2. The low-temperature near-band-gap photoluminescence spectrum shows the main donor bound exciton (DBE) peak at 3.4718eV with a FWHM of 1.4meV, verifying the high crystalline quality of the bulk-like GaN. The DBE peak position suggests complete stress relief. The phonon spectra measured by infrared spectroscopic ellipsometry confirm as well, that the free-standing material is of high crystalline quality and virtually stress-free.
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| 5. |
- Gogova, Daniela, et al.
(författare)
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Optical and structural characteristics of virtually unstrained bulk-like GaN
- 2004
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Ingår i: Japanese Journal of Applied Physics. - 0021-4922 .- 1347-4065. ; 43:4A, s. 1264-1268
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Tidskriftsartikel (refereegranskat)abstract
- Bulk-like GaN with high structural and optical quality has been attained by hydride vapor-phase exitapy (HVPE). The as-grown 330 mum-thick GaN layer was separated from the sapphire substrate by a laser-induced lift-off process. The full width at half maximum values of the X-ray diffraction (XRD) omega-scans of the free-standing material are 96 and 129 arcsec for the (1 0 -1 4) and (0 0 0 2) reflection, respectively, which rank among the smallest values published so far for free-standing HVPE-GaN. The dislocation density determined by plan-view TEM images is 1-2 x 10(7) cm(-2). Positron annihilation spectroscopy studies show that the concentration of Ga vacancy related defects is about 1.5 x 10(16) cm(-3). The high-resolution XRD, photoluminescence, mu-Raman, and infrared spectroscopic ellipsometry measurements consistently prove that the free-standing material is of high crystalline quality and virtually strain-free. Therefore it is suitable to serve as a substrate for stress-free growth of high-quality III-nitrides based device heterostructures.
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| 6. |
- Gogova, D., et al.
(författare)
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Optical and structural studies of high-quality bulk-like GaN grown by HVPE on a MOVPE AlN buffer layer
- 2006
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Ingår i: Semiconductor Science and Technology. - : IOP Publishing. - 0268-1242 .- 1361-6641. ; 21:5, s. 702-708
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Tidskriftsartikel (refereegranskat)abstract
- High-quality 400 ?m thick GaN has been grown by hydride vapour phase epitaxy (HVPE) on (0 0 0 1) sapphire with a 2 ?m thick AlN buffer layer. The material's crystalline quality and homogeneity was verified by x-ray diffraction (XRD), low-temperature photoluminesence (LT-PL) and LT cathodoluminescence. Plan-view transmission electron microscopy images reveal a low dislocation density of ~1.25 × 107 cm-2. The residual stress of the material was studied by two complementary techniques. LT-PL spectra show the main neutral donor bound exciton line at 3.4720 eV. This line position suggests virtually strain-free material with a high crystalline quality as indicated by the small full width at half maximum value of 0.78 meV. The presence of well resolved A- and B-free excitons in the LT-PL spectra and the absence of a yellow luminescence band prove the high quality of the HVPE-GaN in terms of purity and crystallinity. These findings are consistent with the XRD results, implying the high crystalline quality of the material grown. Hence, the material studied is well suited as a lattice parameter and thermal-expansion- coefficient matched substrate for further homoepitaxy, as needed for high-quality III-nitride device applications. Strain-free homoepitaxy on native substrates is needed to decrease considerably the defect density and in that way an improvement of the device's performance and lifetime can be achieved. © 2006 IOP Publishing Ltd.
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| 7. |
- Gurban, S., et al.
(författare)
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Determination of the thickness distribution of a graphene layer grown on a 2 SiC wafer by means of Auger electron spectroscopy depth profiling
- 2014
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Ingår i: Applied Surface Science. - : Elsevier. - 0169-4332 .- 1873-5584. ; 316, s. 301-307
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Tidskriftsartikel (refereegranskat)abstract
- Auger electron spectroscopy (AES) depth profiling was applied for determination of the thickness of a macroscopic size graphene sheet grown on 2 in. 6H-SiC (0 0 0 1) by sublimation epitaxy. The measured depth profile deviated from the expected exponential form showing the presence of an additional, buffer layer. The measured depth profile was compared to the simulated one which allowed the derivation of the thicknesses of the graphene and buffer layers and the Si concentration of buffer layer. It has been shown that the graphene-like buffer layer contains about 30% unsaturated Si. The depth profiling was carried out in several points (diameter 50 mu m), which permitted the constructing of a thickness distribution characterizing the uniformity of the graphene sheet.
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| 8. |
- Hallin, Christer, et al.
(författare)
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Improved Ni ohmic contact on n-type 4H-SiC
- 1997
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Ingår i: Journal of Electronic Materials. - : Springer Science and Business Media LLC. - 0361-5235 .- 1543-186X. ; 26:3, s. 119-122
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Tidskriftsartikel (refereegranskat)abstract
- This paper presents the structural, chemical and electronic properties of Al/Ni/ Al-layers evaporated on 4H silicon carbide and then annealed at 1000°C for 5 min. The structure was investigated before and after annealing by transmission electron spectroscopy from cross-sectional specimens. With x-ray photoelectron spectroscopy, both element distribution and bonding energies were followed during sputtering through the alloyed metal-semiconductor contact. Voids are found in both annealed Ni/4H-SiC and Al/Ni/Al/4H-SiC contact layers, though closer to the metal-semiconductor interface in the former case. The first aluminum-layer is believed to prevent voids to be formed at the interface and also to reduce the oxide on the semiconductor surface. The contact was found to be ohmic with a specific contact resistance ρc - 1.8 × 10−5 Ωcm2 which is more than three times lower ρc than for the ordinary Ni/4H-SiC contact prepared in the same way.
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| 9. |
- Hultman, L, et al.
(författare)
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Growth and electronic properties of epitaxial TiN thin films on 3C-SiC(001) and 6H-SiC(0001) substrates by reactive magnetron sputtering
- 1996
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Ingår i: Journal of Materials Research. - 0884-2914. ; 11:10, s. 2458-2462
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Tidskriftsartikel (refereegranskat)abstract
- Epitaxial TiN films were grown on cubic (3C)-SiC(001) and hexagonal (6H)-SiC(0001) substrates by ultrahigh vacuum reactive magnetron sputtering from a Ti target in a mixed Ar and N2 discharge at a substrate temperature of 700°C. Cross-sectional transmission electron microscopy, including high-resolution imaging, showed orientational relationships TiN(001) ∥ 3C-SiC(001), and TiN[110] ∥ 3C-SiC[110], and TiN(111) ∥ 6H-SiC(0001) and TiN[110],[101] ∥ 6H-SiC[1210]. In the latter case, twin-related TiN domains formed as the result of nucleation on SiC terraces with an inequivalent stacking sequence of Si and C. The TiN/SiC interface was locally atomically sharp for both SiC polytypes. Defects in the TiN layers consisted of threading double positioning domain boundaries in TiN(111) on 6H-SiC. Stacking faults in 3C-SiC did not propagate upon growth of TiN. Room-temperature resistivity of TiN films was ρ = 14 μΩ cm for 6H-SiC(0001) and ρ = 17 μΩ cm for 3C-SiC(001) substrates. Specific contact resistance of TiN to 6H-SiC(0001) was 1.3 × 10-3 Ω cm2 for a 6H-SiC substrate with an n-type doping of 5 × 1017 cm-3.
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| 10. |
- Marinova, Ts., et al.
(författare)
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Nickel based ohmic contacts on SiC
- 1997
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Ingår i: Materials Science and Engineering B. - 0921-5107. ; 46:1-3, s. 223-226
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Tidskriftsartikel (refereegranskat)abstract
- We have compared the chemical and structural properties of Ni/SiC and Ni2Si/SiC interfaces. In the case of Ni/SiC, the contact formation is initiated by the dissociation of SiC, due to the strong reactivity of nickel at 950 °C. Ni2Si is formed and carbon accumulates, both at the interface and throughout the metal layer. At the interface, many Kirkendall voids are observed by TEM. Despite this poor interface morphology, low contact resistances have been measured. But the presence of carbon in the contact layer and at the interface is a potential source of contact degradation at high temperature. In the case of Ni/Si multilayers evaporated on SiC instead of pure Ni, the contact formation is preceded by Ni and Si mutual diffusion in the deposited layer yielding Ni2Si. Therefore, a smaller amount of carbon is released from SiC. Low carbon segregation, abrupt interface and low contact resistance characterize this contact. The thermal stability of Ni2Si contacts is illustrated with ageing experiments carried out at 500 °C.
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