SwePub
Sök i SwePub databas

  Utökad sökning

Träfflista för sökning "WFRF:(Prunnila Mika) "

Sökning: WFRF:(Prunnila Mika)

  • Resultat 1-4 av 4
Sortera/gruppera träfflistan
   
NumreringReferensOmslagsbildHitta
1.
  • Cherchi, Matteo, et al. (författare)
  • A path towards attojoule cryogenic communication
  • 2022
  • Ingår i: 2022 European Conference on Optical Communication, ECOC 2022. - : Institute of Electrical and Electronics Engineers Inc..
  • Konferensbidrag (refereegranskat)abstract
    • Photonic integration technologies are key to scale-up superconducting quantum computers. Here, we identify suitable classical optical links to control and read out the qubits in cryostats and resolve the power dissipation issue of superconducting computing platforms. Recent results and future solutions are shown.
  •  
2.
  • Generalov, Andrey, 1987, et al. (författare)
  • Distinction of the thermoelectric effect in graphene FET THz detectors
  • 2020
  • Ingår i: International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz. - 2162-2027 .- 2162-2035. ; 2020-November, s. 504-505
  • Konferensbidrag (refereegranskat)abstract
    • This work presents an approach to distinguish the thermoelectric detection mechanism from the resistive mixing or plasma wave rectification in graphene FET THz detectors. Numerical full-wave simulations validate the asymmetric feeding of the existing antenna design and allow for comparison with a reference design of thermoelectric detectors. The experimental results verify quantitively the thermoelectric contribution to the overall rectification, which allows for more accurate modelling of the GFET THz detectors.
  •  
3.
  • Grigoras, K., et al. (författare)
  • Qubit-Compatible Substrates With Superconducting Through-Silicon Vias
  • 2022
  • Ingår i: IEEE Transactions on Quantum Engineering. - 2689-1808. ; 3
  • Tidskriftsartikel (refereegranskat)abstract
    • We fabricate and characterize superconducting through-silicon vias and electrodes suitable for superconducting quantum processors. We measure internal quality factors of a million for test resonators excited at single-photon levels, on chips with superconducting vias used to stitch ground planes on the front and back sides of the chips. This resonator performance is on par with the state of the art for silicon-based planar solutions, despite the presence of vias. Via stitching of ground planes is an important enabling technology for increasing the physical size of quantum processor chips, and is a first step toward more complex quantum devices with three-dimensional integration.
  •  
4.
  • Meng, Fantao, et al. (författare)
  • Nonlinear electrical properties of Si three-terminal junction devices
  • 2010
  • Ingår i: Applied Physics Letters. - : AIP Publishing. - 0003-6951 .- 1077-3118. ; 97:24
  • Tidskriftsartikel (refereegranskat)abstract
    • This letter reports on the realization and characterization of silicon three-terminal junction devices made in a silicon-on-insulator wafer. Room temperature electrical measurements show that the fabricated devices exhibit pronounced nonlinear electrical properties inherent to ballistic electron transport in a three-terminal ballistic junction (TBJ) device. The results show that room temperature functional TBJ devices can be realized in a semiconductor material other than high-mobility III-V semiconductor heterostructures and provide a simple design principle for compact silicon devices in nanoelectronics. (C) 2010 American Institute of Physics. [doi:10.1063/1.3526725]
  •  
Skapa referenser, mejla, bekava och länka
  • Resultat 1-4 av 4

Kungliga biblioteket hanterar dina personuppgifter i enlighet med EU:s dataskyddsförordning (2018), GDPR. Läs mer om hur det funkar här.
Så här hanterar KB dina uppgifter vid användning av denna tjänst.

 
pil uppåt Stäng

Kopiera och spara länken för att återkomma till aktuell vy