SwePub
Sök i SwePub databas

  Utökad sökning

Träfflista för sökning "WFRF:(Wang Shouxu) "

Sökning: WFRF:(Wang Shouxu)

  • Resultat 1-2 av 2
Sortera/gruppera träfflistan
   
NumreringReferensOmslagsbildHitta
1.
  • Li, Jiujuan, et al. (författare)
  • In-situ chemical polymerization of Cu-Polythiophenes composite film as seed layer for direct electroplating on insulating substrate
  • 2020
  • Ingår i: Electrochimica Acta. - : Elsevier BV. - 0013-4686. ; 330
  • Tidskriftsartikel (refereegranskat)abstract
    • Metal particles are embedded in the polymer to form a polymer composite film as a seed layer on an insulating substrate to overcome the limitation that electrodeposited copper only occurring at the interface between the polymer and the metal electrode. In this work, we successfully developed a Cu-polythiophenes composite film (Cu-PT composite film) through a facile in-situ reduction method, obtaining porous-networked PT containing homogeneously distributed Cu. the Cu-PT composite film serve as a feasible seed layer for subsequent metallization on the insulating substrate. The deposition conditions for the optimized migration rate of copper during the electroplating process of the composite film were obtained by multiple groups of single factor experiments. Notably, electroplated textile fabrics with the Cu-PT composite film demonstrate a wide stretch-resistant working range (0–50% applied strain) maintaining stable conductivity.
  •  
2.
  • Li, Jiujuan, et al. (författare)
  • Polymer-based Cu/Ag composite as seed layer on insulating substrate for copper addition of multi-dimensional conductive patterns
  • 2021
  • Ingår i: Journal of the Taiwan Institute of Chemical Engineers. - : Elsevier BV. - 1876-1070. ; 123, s. 254-260
  • Tidskriftsartikel (refereegranskat)abstract
    • Conductive polymer direct electroplating technology is one of the research hotspots in printed circuit board manufacturing. In this work, we designed a simple, efficient and environmental friendly chemical polymerization method to form a conductive polymer-based metal-mixed composite film where the polymer was polythiophene and the metals included copper and silver (PT-based Cu/Ag composite film). The work function of the PT-based Cu/Ag composite film decreased from 4.822 eV of pure PT to 4.638 eV, which serves as a seed layer to prepare conductive circuits by the additive process. The method without the metal etching and photolithography steps solves the problems of conventional subtractive processes for forming conductive patterns. Besides, the PT-based Cu/Ag composite film is able to increase the roughness of the substrate to improve the bonding force between the electroplated copper layer and the substrate. Moreover, due to the particularity of oxidation solution for preparing the PT-based Cu/Ag composite film, conductive lines and patterns can be selectively formed on insulating substrate with arbitrary shapes by the additive process.
  •  
Skapa referenser, mejla, bekava och länka
  • Resultat 1-2 av 2
Typ av publikation
tidskriftsartikel (2)
Typ av innehåll
refereegranskat (2)
Författare/redaktör
Andersson, Martin (2)
He, Wei (2)
Li, Jiujuan (2)
Zhou, Guoyun (2)
Hong, Yan (2)
Wang, Shouxu (2)
visa fler...
Wang, Chong (2)
Chen, Yuanming (2)
Zhou, Jinqun (1)
Miao, Hua (1)
Weng, Zesheng (1)
Zhang, Huaiwu (1)
Su, Xinhong (1)
Sun, Yukai (1)
visa färre...
Lärosäte
Lunds universitet (2)
Språk
Engelska (2)
Forskningsämne (UKÄ/SCB)
Naturvetenskap (1)
Teknik (1)

År

Kungliga biblioteket hanterar dina personuppgifter i enlighet med EU:s dataskyddsförordning (2018), GDPR. Läs mer om hur det funkar här.
Så här hanterar KB dina uppgifter vid användning av denna tjänst.

 
pil uppåt Stäng

Kopiera och spara länken för att återkomma till aktuell vy