| 1. |
- Long, Xu, et al.
(författare)
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Mechanical behaviour of sintered silver nanoparticles reinforced by SiC microparticles
- 2019
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Ingår i: Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing. - : Elsevier BV. - 0921-5093. ; 744, s. 406-414
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Tidskriftsartikel (refereegranskat)abstract
- SiC microparticles with various weight ratios (0.0, 0.5, 1.0 and 1.5 wt%) are incorporated into sintered silver nanoparticles (AgNP) as one of the promising packaging materials for high-power electronic devices. Mechanical properties and constitutive behaviour of sintered AgNP reinforced by SiC microparticles are investigated based on nanoindentation experiment and analytical approach. Nanoindentations were performed in the manner of continuous stiffness measurement for a maximum penetration depth of 2000 nm at a strain rate of 0.05 s−1. Particularly, a Berkovich indenter is utilized to evaluate the values of Young's modulus and hardness, and a spherical indenter is utilized to describe the constitutive behaviour. For sintered AgNP with 0.5 wt% SiC, the morphology exhibits uniformly compact microstructures to enable optimizing the heat conductivity, the yield strength and hardening capacity of sintered AgNP material is enhanced. To describe the constitutive behaviour, an analytical approach is proposed to simulate the indentation behaviour. The parameters in the modified power-law model are determined by fitting the average indentation responses. The developed correlation between microstructure and macroscopic properties facilitates the design of AgNP paste morphology and improves the mechanical properties of sintered AgNP in electronics packaging.
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| 2. |
- Lu, Xiuzhen, et al.
(författare)
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The influence of sintering process on thermal properties of nano-silver paste
- 2018
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Ingår i: 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). - 9781538663868 - 9781538663868 ; , s. 1157-1160
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Konferensbidrag (refereegranskat)abstract
- Nano-silver paste with low sintering temperature and high operation temperature was introduced to the application of bonding materials for GaN and SiC devices. Thermal properties are critical issues for die attach materials due to the heat dissipation requirements of high power devices. The influence of sintering process parameters for nano-silver paste on the thermal properties was investigated. The thermal conductivity of sintered nano-silver paste increased with the increase of sintering temperature and sintering time because of the dense structure due to high temperature and long sintering time. To improve the thermal property, Ag coated micro-SiC particles were used as an alternative to partly replace pure nano-Ag particles. The results demonstrate that the SiC particles can reduce the voids and improve the density of the sintered silver structure. Moreover, the addition of SiC particles can also contribute to the increase of thermal diffusivity. As a result, the thermal conductivity of sintered silver paste with 1.5 wt.% Ag coated SiC particles was two times as compared to that without SiC particles with the same Ag concentration.
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