| 1. |
- Lind, Lars, et al.
(författare)
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Heterogeneous contributions of change in population distribution of body mass index to change in obesity and underweight NCD Risk Factor Collaboration (NCD-RisC)
- 2021
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Ingår i: eLife. - : eLife Sciences Publications Ltd. - 2050-084X. ; 10
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Tidskriftsartikel (refereegranskat)abstract
- From 1985 to 2016, the prevalence of underweight decreased, and that of obesity and severe obesity increased, in most regions, with significant variation in the magnitude of these changes across regions. We investigated how much change in mean body mass index (BMI) explains changes in the prevalence of underweight, obesity, and severe obesity in different regions using data from 2896 population-based studies with 187 million participants. Changes in the prevalence of underweight and total obesity, and to a lesser extent severe obesity, are largely driven by shifts in the distribution of BMI, with smaller contributions from changes in the shape of the distribution. In East and Southeast Asia and sub-Saharan Africa, the underweight tail of the BMI distribution was left behind as the distribution shifted. There is a need for policies that address all forms of malnutrition by making healthy foods accessible and affordable, while restricting unhealthy foods through fiscal and regulatory restrictions.
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| 2. |
- Mishra, A, et al.
(författare)
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Diminishing benefits of urban living for children and adolescents' growth and development
- 2023
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Ingår i: Nature. - : Springer Science and Business Media LLC. - 1476-4687 .- 0028-0836. ; 615:7954, s. 874-883
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Tidskriftsartikel (refereegranskat)abstract
- Optimal growth and development in childhood and adolescence is crucial for lifelong health and well-being1–6. Here we used data from 2,325 population-based studies, with measurements of height and weight from 71 million participants, to report the height and body-mass index (BMI) of children and adolescents aged 5–19 years on the basis of rural and urban place of residence in 200 countries and territories from 1990 to 2020. In 1990, children and adolescents residing in cities were taller than their rural counterparts in all but a few high-income countries. By 2020, the urban height advantage became smaller in most countries, and in many high-income western countries it reversed into a small urban-based disadvantage. The exception was for boys in most countries in sub-Saharan Africa and in some countries in Oceania, south Asia and the region of central Asia, Middle East and north Africa. In these countries, successive cohorts of boys from rural places either did not gain height or possibly became shorter, and hence fell further behind their urban peers. The difference between the age-standardized mean BMI of children in urban and rural areas was <1.1 kg m–2 in the vast majority of countries. Within this small range, BMI increased slightly more in cities than in rural areas, except in south Asia, sub-Saharan Africa and some countries in central and eastern Europe. Our results show that in much of the world, the growth and developmental advantages of living in cities have diminished in the twenty-first century, whereas in much of sub-Saharan Africa they have amplified.
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| 3. |
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| 4. |
- Wu, Jingnan, 1994, et al.
(författare)
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On the Conformation of Dimeric Acceptors and Their Polymer Solar Cells with Efficiency over 18 %
- 2023
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Ingår i: Angewandte Chemie International Edition. - : John Wiley & Sons. - 1433-7851 .- 1521-3773. ; 62:45
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Tidskriftsartikel (refereegranskat)abstract
- The determination of molecular conformations of oligomeric acceptors (OAs) and their impact on molecular packing are crucial for understanding the photovoltaic performance of their resulting polymer solar cells (PSCs) but have not been well studied yet. Herein, we synthesized two dimeric acceptor materials, DIBP3F-Se and DIBP3F-S, which bridged two segments of Y6-derivatives by selenophene and thiophene, respectively. Theoretical simulation and experimental 1D and 2D NMR spectroscopic studies prove that both dimers exhibit O-shaped conformations other than S- or U-shaped counter-ones. Notably, this O-shaped conformation is likely governed by a distinctive "conformational lock" mechanism, arising from the intensified intramolecular & pi;-& pi; interactions among their two terminal groups within the dimers. PSCs based on DIBP3F-Se deliver a maximum efficiency of 18.09 %, outperforming DIBP3F-S-based cells (16.11 %) and ranking among the highest efficiencies for OA-based PSCs. This work demonstrates a facile method to obtain OA conformations and highlights the potential of dimeric acceptors for high-performance PSCs.
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| 5. |
- Du, Wenhui, et al.
(författare)
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New fast curing isotropic conductive adhesive for electronic packaging application
- 2010
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Ingår i: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010. - 9781424481422 ; :Article number 5582446, s. 199-201
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Konferensbidrag (refereegranskat)abstract
- With the rapid development of technologies on high density assembly and packaging in electronic industry, isotropic conductive adhesive (ICA) has been paid more and more attention as a potential substitute of solder, due to its advantages of low processing temperature, simple processing conditions and good manufacturability. However, the curing time of most traditional ICA is more than half an hour. The process duration of ICA is 2 or 3 times longer than that of solder. Thus, low efficiencies of energy using and product manufacturing has been one of factors which limits widely application of ICA. Generally, the curing speed of ICA depends on types and amount of curing agent as well as curing temperature. In our previous experiments, the effects of curing temperature and amount of curing agent have been investigated. So, the present work attempts to choose a new kind of curing agent to shorten process duration of ICA. By using new curing agent, the curing duration of ICA could be shortened in 5 minutes with a high curing rate compared with the previous version. In addition, the basic performance including bulk resistivity and viscosity are also investigated in this work. Finally, we present some discussions about the further optimization of performance, for example regarding the ways of achieving better electrical conductivity with lower filler content and improvement of viscosity etc. © 2010 IEEE.
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| 6. |
- Kattge, Jens, et al.
(författare)
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TRY plant trait database - enhanced coverage and open access
- 2020
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Ingår i: Global Change Biology. - : Wiley-Blackwell. - 1354-1013 .- 1365-2486. ; 26:1, s. 119-188
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Tidskriftsartikel (refereegranskat)abstract
- Plant traits-the morphological, anatomical, physiological, biochemical and phenological characteristics of plants-determine how plants respond to environmental factors, affect other trophic levels, and influence ecosystem properties and their benefits and detriments to people. Plant trait data thus represent the basis for a vast area of research spanning from evolutionary biology, community and functional ecology, to biodiversity conservation, ecosystem and landscape management, restoration, biogeography and earth system modelling. Since its foundation in 2007, the TRY database of plant traits has grown continuously. It now provides unprecedented data coverage under an open access data policy and is the main plant trait database used by the research community worldwide. Increasingly, the TRY database also supports new frontiers of trait-based plant research, including the identification of data gaps and the subsequent mobilization or measurement of new data. To support this development, in this article we evaluate the extent of the trait data compiled in TRY and analyse emerging patterns of data coverage and representativeness. Best species coverage is achieved for categorical traits-almost complete coverage for 'plant growth form'. However, most traits relevant for ecology and vegetation modelling are characterized by continuous intraspecific variation and trait-environmental relationships. These traits have to be measured on individual plants in their respective environment. Despite unprecedented data coverage, we observe a humbling lack of completeness and representativeness of these continuous traits in many aspects. We, therefore, conclude that reducing data gaps and biases in the TRY database remains a key challenge and requires a coordinated approach to data mobilization and trait measurements. This can only be achieved in collaboration with other initiatives.
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| 7. |
- Lai, Huaxiang, et al.
(författare)
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Effects of BN and SiC nanoparticles on properties of conductive adhesive
- 2010
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Ingår i: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010. - 9781424481422 ; :Article number 5582434, s. 235-239
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Konferensbidrag (refereegranskat)abstract
- Isotropic conductive adhesives (ICAs) are a type of interconnect material used more and more widely in computer, robot, mobile phone, LED and so on. Compared with traditional solders, isotropic conductive adhesives have better working plasticity, creep resistance and heat resistance. In particular, isotropic conductive adhesives are more responsive in high density packaging than solder, which determines the dominance of ICAs in high density packaging in the future. In order to improve the thermal conductivity of ICA with acceptable electrical conductivity, Ag flakers, BN and SiC nanoparticles were added into the matrix. The content of silver flakes was 75wt%, and the content of nanoparticles (BN or SiC) in the isotropic conductive adhesives were 0wt%, 0.5wt%, 1.5wt%, 2.5wt%, 3wt%, 5wt% in weight. The conductive adhesives were coated on the PCBs with stencil printing and fifty SR1206 chip components were mounted on a PCB using conductive adhesive. All samples were cured at 150°for 1h. Further research into the reliability of the above isotropic conductive adhesives after temperature & humidity and thermal-cycling was carried out to analyze the effects of BN and SiC nanoparticals on the properties of ICA. The condition of the temperature & humidity test was 85 ° /85%RH, 500h. The thermal-cycling test was -40 °∼125°, 500 cycles and the soaking time and ramping rate were 19min and ±15°/min. Changes to electrical resistance were used to estimate the reliability of the isotropic conductive adhesives in this study. The microstructure of the failure samples was observed using a Scanning Electron Microscope (SEM). The water absorption of all ICAs is the same after 94h temperature and humidity aging and the rate of water absorption is also the same during the aging. The ICA with 3% boron nitride nanoparticles and 75% micron silver flakes shows the best temperature and humidity reliability, with the fewest cracks on the interface between ICA and component. After 500h thermal cycling aging, the resistance reduces in the first 100h and maintains in a certain value after 332h cycled thermal. The samples have no wide cracks but a few small ones on the interface. © 2010 IEEE.
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| 8. |
- Chen, Si, 1981, et al.
(författare)
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A High Performance Ag Alloyed Nano-scale n-type Bi2Te3 Based Thermoelectric Material
- 2015
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Ingår i: Materials Today: Proceedings. - : Elsevier BV. - 2214-7853. ; 2:2, s. 610-619
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Konferensbidrag (refereegranskat)abstract
- A silver alloyed n-type bismuth telluride (Bi2Te3) thermoelectric (TE) bulk material with nano crystalline structure was studied and characterized in this paper. The Bi2Te3 nanopowders used in this study were first fabricated via a patented explosion based process. Then, the various concentrations of Ag nanoparticles (0-20 wt. %) were added into the Bi2Te3 nanopowders in order to increase the electrical conductivity. Combining the benefits of high electrical conductivity (1.51x10(5) S.m(-1)) and low thermal conductivity (0.441 W.m(-1).K-1), the dimensionless figure of merit (ZT value) of 1.48 for this n-type Bi2Te3 TE material is achieved at 300 K temperature.
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| 9. |
- Chen, Si, 1981
(författare)
-
Application of Metallic Nanoparticles and Vertically Aligned Carbon Nanotubes as Interconnect Materials for Electronics Packaging
- 2013
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Licentiatavhandling (övrigt vetenskapligt/konstnärligt)abstract
- In the electronics industry, packaging is responsible to protect chip from atmosphere and provide the path for signal communication as well as thermal dissipation. The realization of these functions in a packaging system depends on the performance of interconnect materials. Any failure on the interconnect materials could make entire system down. Currently, one of the most popular interconnect materials is lead-free solder, which has been used for two decades instead of toxic Sn-Pb solder. The updates on processes, equipments and standards for lead-free solder have been completed. However, as continuous increase on the chip power and the miniaturization of consumer electronics, lead-free solder is facing big challenges. The disadvantages of traditional lead-free solder, such as high process temperature, grain coarsening and thermal fatigue failure, are gradually exposed. Therefore, one of the urgent needs for packaging is to develop new interconnect materials. In recent years, as the development of nanotechnology, nanostructured materials are gradually applied on the packaging. Following this tendency, two promising nanostructured interconnect materials are presented in this thesis. The first part of this thesis shows a nanocomposite material. It consists of Sn-3.0Ag-0.5Cu nanoparticles and Sn-58Bi solder matrix. Sn-58Bi solder has the advantage on low process temperature. However the inherent brittleness of Sn-58Bi limits its application. For this reason, the Sn-3.0Ag-0.5Cu nanoparticles are added into the Sn-58Bi in order to improve the mechanical properties. The result of shear test shows that the shear strength of Sn-58Bi increases by two times by the addition of Sn-3.0Ag-0.5Cu nanoparticles. The result also indicates that the nanocomposite solder has excellent thermal fatigue resistance. The demonstrated properties make nanocomposite solder can be a potential candidate for replacing Sn-Ag-Cu in future. In this thesis, we also present another kind of interconnect material based on vertically aligned carbon nanofibers. High stability and compatibility of carbon nanofibers are always attractive to the packaging industry. By using a series of processes, such as plasma-enhanced chemical vapor deposition, sputtering, transfer and bonding, the vertically aligned carbon nanofibers are successfully assembled in the packaging system. As interconnect material, vertically aligned carbon nanofibers exhibit acceptable electrical resistance and shear strength. The positive preliminary results motivate further research on the aspects of thermal fatigue resistance and stability.
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| 10. |
- Chen, Si, 1981
(författare)
-
Characterization of Nanomaterials for Interconnect and Thermal Management in Electronic Packaging
- 2015
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Doktorsavhandling (övrigt vetenskapligt/konstnärligt)abstract
- Electronic packaging, protecting the fragile chip from atmosphere and providing the paths for signal transmission as well as heat dissipation, is one of the most important parts in electronic devices. The cost, dimensions, performance, and reliability of an electronic device therefore strongly depend on its packaging structures and materials. In recent years, the miniaturization and diversification of electrical devices, having increased packaging and power density, pose a serious challenge to the reliability of traditional packaging materials. To address this challenge, several nanomaterials were thus fabricated and used for either interconnection or heat dissipation in the electronic packaging.For interconnection, vertically aligned carbon nanotubes (VACNT) grown with thermal chemical vapor deposition (TCVD) method were used as filling materials of through silicon vias (TSV). Meanwhile, vertically aligned carbon nanofibers (VACNF) fabricated with plasma enhanced chemical vapor deposition (PECVD) method were used as not only the bump material for chips, but also for the reinforcement material for solder joints. By using these carbon nanomaterials, some failure modes, such as burnout, electromigration, and coarseness, can be avoided. Besides carbon, alloy and semiconductor nanomaterials were also fabricated in this thesis for interconnection. Sn3.0Ag0.5Cu (SAC305) alloy and Bi2Te3 semiconductor nanopowders were mixed with traditional Sn58Bi and SAC305 lead free solders respectively in order to improve the shear strength and thermal fatigue resistance of solder joints. The dislocation movement and crack propagation can be effectively delayed by uniformly distributed nanoparticles in the solder matrix. However, it always shows a performance degradation when the content of nanoparticles passes a threshold. This phenomenon could be caused by increased voids and the agglomeration of nanoparticles in the solder matrix with increased content of nanoparticles.For heat dissipation, a polyimide (PI) network enhanced indium thermal interface material (TIM) was developed as a passive heat dissipation solution, and meanwhile a nanostructured bulk thermoelectric (TE) material constructed of Ag and Bi2Te3 nanopowders is presented as an active heat dissipation solution. The mechanical properties of pure indium TIM can be improved by the PI network without any degradation of heat dissipation ability. This is attributed to the Ag-coated PI fibers which formed solid bonding with the indium matrix and constrained the crack propagation. For the TE material, the thermal conductivity of nanostructured Bi2Te3 samples was much lower than that of raw materials due to the increased phonon scattering at the grain boundaries, which consequently led to a higher figure of merit (ZT value).
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| 11. |
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| 12. |
- Chen, Si, 1985, et al.
(författare)
-
Plasmon-enhanced enzyme-linked immunosorbent assay on large arrays of individual particles made by electron beam lithography.
- 2013
-
Ingår i: ACS Nano. - : American Chemical Society (ACS). - 1936-0851 .- 1936-086X. ; 7:10
-
Tidskriftsartikel (refereegranskat)abstract
- Ultrasensitive biosensing is one of the main driving forces behind the dynamic research field of plasmonics. We have previously demonstrated that the sensitivity of single nanoparticle plasmon spectroscopy can be greatly enhanced by enzymatic amplification of the refractive index footprint of individual protein molecules, so-called plasmon-enhanced enzyme-linked immunosorbent assay (ELISA). The technique, which is based on generation of an optically dense precipitate catalyzed by horseradish peroxidase at the metal surface, allowed for colorimetric analysis of ultralow molecular surface coverages with a limit of detection approaching the single molecule limit. However, the plasmonic response induced by a single enzyme can be expected to vary for a number of reasons, including inhomogeneous broadening of the sensing properties of individual particles, variation in electric field enhancement over the surface of a single particle and variation in size and morphology of the enzymatic precipitate. In this report, we discuss how such inhomogeneities affect the possibility to quantify the number of molecules bound to a single nanoparticle. The discussion is based on simulations and measurements of large arrays of well-separated gold nanoparticles fabricated by electron beam lithography (EBL). The new data confirms the intrinsic single-molecule sensitivity of the technique but we were not able to clearly resolve the exact number of adsorbed molecules per single particle. The results indicate that the main sources of uncertainty come from variations in sensitivity across the surface of individual particles and between different particles. There is also a considerable uncertainty in the actual precipitate morphology produced by individual enzyme molecules. Possible routes toward further improvements of the methodology are discussed.
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| 13. |
- Chen, Si, 1981, et al.
(författare)
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Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced With Bi2Te3 Nanoparticles
- 2015
-
Ingår i: IEEE Transactions on Components, Packaging and Manufacturing Technology. - : Institute of Electrical and Electronics Engineers (IEEE). - 2156-3985 .- 2156-3950. ; 5:8, s. 1186-1196
-
Tidskriftsartikel (refereegranskat)abstract
- Nanocomposite solders are regarded as one of the most promising interconnect materials for the high-density electronic packaging due to their high mechanical strength and fine microstructure. However, the developments of nanocomposite solders have been limited by the inadequate compatibility between nanoparticles and solder matrix with respect to density, hardness, coefficient of thermal expansion, and surface activity. The compatibility issue will lead to a huge loss of nanoparticles from the solder matrix after the reflow soldering process. The thermal fatigue resistance of solder joint will also become degraded. Therefore, aiming to solve this problem, a novel nanocomposite solder consisting of Bi2Te3 semiconductor nanoparticles and Sn-3.0Ag-0.5Cu (SAC305) solder is presented. The effect of nanoparticles on the viscosity of solder paste and the void content of solder bump was first studied. Then, a series of analysis on the composition and microstructure of the solder bump were completed using transmission electron microscopy, X-ray diffraction, inductively coupled plasma-mass spectrometry, scanning electron microscopy, and energy dispersive X-ray spectroscopy. The survival rate of nanoparticles in the solder bump after reflow soldering process reaches as high as 80%. The refined microstructure was observed from the cross section of the nanocomposite solders. The shear test showed that the average mechanical strength of SAC305 solder after the addition of Bi2Te3 nanoparticles was higher. Meanwhile, no thermal fatigue resistance degradation was detected in the nanocomposite solder after 1000 thermal cycles in the range of -40 degrees C to 115 degrees C.
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| 14. |
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| 15. |
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| 16. |
- Chen, Si, 1981
(författare)
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Ultra-short vertically aligned carbon nanofibers transfer and application as bonding material
- 2013
-
Ingår i: Soldering and Surface Mount Technology. - : Emerald. - 1758-6836 .- 0954-0911. ; 25:4, s. 242-250
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Tidskriftsartikel (refereegranskat)abstract
- Purpose - The transferred carbon nanofibers (CNFs) can be applied in flip chip package as interconnect material, as an alternative to the conventional solder and conductive adhesive (CA) materials. Design/methodology/approach - The structure of CNFs was confirmed by transmission electron microscopy (TEM). The electrical performance of the vertically aligned carbon nanofibers (VACNFs) joint was measured by four points probe method and compared to conventional lead-free solder Sn3.0Ag0.5Cu, pure indium and silver CA. A shear test was carried out in order to evaluate the mechanical performance of VACNFs joint. After the shear test, the fracture surface was analyzed by scanning electron microscopy and energy dispersive spectroscopy (SEM-EDS). Findings - The results showed a high success rate in the transfer of VACNFs from growth chip to target chip. The Au-coated CNF can be wetted well with melted indium during the transfer and bonding process. In-Au intermetallic compound (IMC) formed on the surface of CNF. The electrical and mechanical performance of VACNFs is comparable to that of the traditional interconnect materials. The fracture surface is located at the interface between VACNFs and chips. The stacked-cone structure of CNF can be confirmed from a cross-section of the break CNF by TEM. Originality/value - Ultra-short VACNFs were grown and first successfully transferred to the target chip using a process which required little pressure, low temperature and short time.
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| 17. |
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| 18. |
- Fu, C., et al.
(författare)
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Optimization of stiffness for isotropic conductive adhesives
- 2010
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Ingår i: 2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10. - 9781424467563 ; , s. 29-33
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- With the rapid developments of electronic packaging, there is an increasing demand on high performance isotropic conductive adhesives (ICAs). However, the traditional ICAs are brittle, sensitive for crack formation and delamination, which is one of the major drawbacks that limits their use in a wide range of applications. Therefore great efforts have been made to make conductive adhesives more flexible. The present work aims at studying of several chemicals in terms of flexibilizing materials to modify the stiffuess modulus of the conductive adhesives. The effect of the flexibilizers has been characterized by different methods, such as Differential Scanning Calorimetry (DSC), Dynamic Mechanical Analysis (DMA), Thermogravimetric Analysis (TGA), etc. Moreover, the electrical resistance, thermal conductivity and viscosity are also measured in various conditions. Experimental results indicate that one of the flexibilizing materials using flexible ester-linkage is particular of interest as it offers low electrical resistance, high thermal performance and low modulus without decreasing glass transition temperature (Tg) and influencing curing and decomposition conditions. ©2010 IEEE.
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| 19. |
- Fu, Yifeng, 1984, et al.
(författare)
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Selective growth of double-walled carbon nanotubes on gold films
- 2012
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Ingår i: Materials Letters. - : Elsevier BV. - 1873-4979 .- 0167-577X. ; 72, s. 78-80
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Tidskriftsartikel (refereegranskat)abstract
- Growth of high-quality vertical aligned carbon nanotube (CNT) structures on silicon supported gold (Au) films by thermal chemical vapor deposition (TCVD) is presented. Transmission electron microscopy (TEM) images show that the growth is highly selective. Statistical study reveals that 79.4% of the as-grown CNTs are double-walled. The CNTs synthesized on Au films are more porous than that synthesized on silicon substrates under the same conditions. Raman spectroscopy and electrical characterization performed on the as-grown double-walled CNTs (DWNTs) indicate that they are competitive with those CNTs grown on silicon substrates. Field emission tests show that closed-ended DWNTs have lower threshold field than those open-ended.
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| 20. |
- Fu, Yifeng, 1984, et al.
(författare)
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Ultrafast Transfer of Metal Enhanced Carbon Nanotubes at Low Temperature for Large Scale Electronics Assembly
- 2010
-
Ingår i: Advanced Materials. - : Wiley. - 0935-9648 .- 1521-4095. ; 22:44, s. 5039-5042
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Tidskriftsartikel (refereegranskat)abstract
- An indium-assisted ultrafast carbon nanotube (CNT) transfer method with a yield rate over 90% is described. Metal-coated as-transferred CNT structures exhibit excellent electrical performance that is at least one order of magnitude better than the previously published results. Shear test results show that the adhesion between CNTs and the substrate is greatly improved and excellent flexibility is obtained after the transfer process.
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| 21. |
- Jeong, Seung Hee, et al.
(författare)
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Mechanically Stretchable and Electrically Insulating Thermal Elastomer Composite by Liquid Alloy Droplet Embedment
- 2015
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Ingår i: Scientific Reports. - : Springer Science and Business Media LLC. - 2045-2322. ; 5
-
Tidskriftsartikel (refereegranskat)abstract
- Stretchable electronics and soft robotics have shown unsurpassed features, inheriting remarkable functions from stretchable and soft materials. Electrically conductive and mechanically stretchable materials based on composites have been widely studied for stretchable electronics as electrical conductors using various combinations of materials. However, thermally tunable and stretchable materials, which have high potential in soft and stretchable thermal devices as interface or packaging materials, have not been sufficiently studied. Here, a mechanically stretchable and electrically insulating thermal elastomer composite is demonstrated, which can be easily processed for device fabrication. A liquid alloy is embedded as liquid droplet fillers in an elastomer matrix to achieve softness and stretchability. This new elastomer composite is expected useful to enhance thermal response or efficiency of soft and stretchable thermal devices or systems. The thermal elastomer composites demonstrate advantages such as thermal interface and packaging layers with thermal shrink films in transient and steady-state cases and a stretchable temperature sensor.
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| 22. |
- Jeong, Seung Hee, 1978-, et al.
(författare)
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Stretchable Thermoelectric Generators Metallized with Liquid Alloy
- 2017
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Ingår i: ACS Applied Materials & Interfaces. - : American Chemical Society (ACS). - 1944-8252 .- 1944-8244. ; 9:18, s. 15791-15797
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Tidskriftsartikel (refereegranskat)abstract
- Conventional thermoelectric generators (TEGs) are normally hard, rigid, and flat. However, most objects have curvy surfaces, which require soft and even stretchable TEGs for maximizing efficiency of thermal energy harvesting. Here, soft and stretchable TEGs using conventional rigid Bi2Te3 pellets metallized with a liquid alloy is reported. The fabrication is implemented by means of a tailored layer-by-layer fabrication process. The STEGs exhibit an output power density of 40.6 ?W/cm2 at room temperature. The STEGs are operational after being mechanically stretched-and-released more than 1000 times, thanks to the compliant contact between the liquid alloy interconnects and the rigid pellets. The demonstrated interconnect scheme will provide a new route to the development of soft and stretchable energy-harvesting avenues for a variety of emerging electronic applications.
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| 23. |
- Jeong, Seung Hee, et al.
(författare)
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Thermal Elastomer Composites for Soft Transducers
- 2015
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Ingår i: 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015. - : IEEE conference proceedings. - 9781479989553 ; , s. 1873-1876
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Konferensbidrag (refereegranskat)abstract
- There is a need for thermal elastomer composites (TEC) which are stretchable, electrically insulating and easily processablefor soft and stretchable sensor or actuator systems as a thermal conductor or heat spreader at an interface or in a package.A novel TEC was made by embedding a gallium based liquid alloy (Galinstan) as a droplet in polydimethylsiloxane (PDMS,Elastosil RT 601) matrix with a high speed mechanical mixing process.
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| 24. |
- Jiang, Di, 1983, et al.
(författare)
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Paper-mediated controlled densification and low temperature transfer of carbon nanotube forests for electronic interconnect application
- 2013
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Ingår i: Microelectronic Engineering. - : Elsevier BV. - 0167-9317. ; 103, s. Pages 177-180
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Tidskriftsartikel (refereegranskat)abstract
- We report on the fabrication and characterization of densified and transferred carbon nanotube forests for electronic interconnect application. A simple, low cost and quality method is developed for densifying vertically-aligned carbon nanotube (VA-CNTs) forests at room temperature. Commercially available paper is utilized in this work to serve as a solvent carrier. Highly densified CNT bundles are formed by the sorption of evaporative liquid from the paper into carbon nanotube forests. An average Young’s modulus increase from approximately 15.8 to 111.9 MPa is extrapolated from the measured load–displacement curves in the compression tests of the as-densified VA-CNTs. Subsequent low temperature transfer method is used to transfer the VA-CNT bundles onto the target substrate. Four-probe measurement of the transferred VA-CNTs shows resistance of 3.70 ± 0.04 Ω of each CNT bundle.
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| 25. |
- Jiang, Di, 1983, et al.
(författare)
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Vertically stacked carbon nanotube-based interconnects for through silicon via application
- 2015
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Ingår i: IEEE Electron Device Letters. - 0741-3106 .- 1558-0563. ; 36:5, s. 499-501
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Tidskriftsartikel (refereegranskat)abstract
- Stacking of silicon chips with carbon nanotube (CNT)-based through-silicon vias (TSVs) is experimentally demonstrated. Polymer filling is used to improve the transfer quality of CNTs into pre-etched silicon holes. Special hexagonal CNTs are designed to achieve high aspect ratio (10:1) CNT vias. TSVs filled with closely packed CNTs show a highly linear dc I - V response. The proposed process works at room temperature, which makes it compatible with existing device fabrication flow.
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