| 1. |
- Gustavsson, S., et al.
(författare)
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Suppressing relaxation in superconducting qubits by quasiparticle pumping
- 2016
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Ingår i: Science. - : American Association for the Advancement of Science (AAAS). - 0036-8075 .- 1095-9203. ; 354:6319, s. 1573-1577
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Tidskriftsartikel (refereegranskat)abstract
- Copyright 2016 by the American Association for the Advancement of Science; all rights reserved.Dynamical error suppression techniques are commonly used to improve coherence in quantum systems.They reduce dephasing errors by applying control pulses designed to reverse erroneous coherent evolution driven by environmental noise. However, such methods cannot correct for irreversible processes such as energy relaxation.We investigate a complementary, stochastic approach to reducing errors: Instead of deterministically reversing the unwanted qubit evolution, we use control pulses to shape the noise environment dynamically. In the context of superconducting qubits, we implement a pumping sequence to reduce the number of unpaired electrons (quasiparticles) in close proximity to the device. A 70%reduction in the quasiparticle density results in a threefold enhancement in qubit relaxation times and a comparable reduction in coherence variability.
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| 2. |
- Rosenberg, D., et al.
(författare)
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3D integrated superconducting qubits
- 2017
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Ingår i: npj Quantum Information. - : Springer Science and Business Media LLC. - 2056-6387. ; 3
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Tidskriftsartikel (refereegranskat)abstract
- As the field of quantum computing advances from the few-qubit stage to larger-scale processors, qubit addressability and extensibility will necessitate the use of 3D integration and packaging. While 3D integration is well-developed for commercial electronics, relatively little work has been performed to determine its compatibility with high-coherence solid-state qubits. Of particular concern, qubit coherence times can be suppressed by the requisite processing steps and close proximity of another chip. In this work, we use a flip-chip process to bond a chip with superconducting flux qubits to another chip containing structures for qubit readout and control. We demonstrate that high qubit coherence (T1, T2, echo > 20 μs) is maintained in a flip-chip geometry in the presence of galvanic, capacitive, and inductive coupling between the chips.
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