| 1. |
- Kruglov, Dmitrii, 1994, et al.
(författare)
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Contactless Measurement of a D-Band On-Chip Antenna Using an Integrated Reflective Load Switch
- 2024
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Ingår i: IEEE Antennas and Wireless Propagation Letters. - 1548-5757 .- 1536-1225. ; 23:3, s. 1075-1079
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Tidskriftsartikel (refereegranskat)abstract
- A novel measurement setup is proposed for the contactless characterization of on-chip antennas. A D-band patch antenna is fabricated on a 100 μm-thick GaAs substrate and is monolithically integrated with a reflective load switch to allow for fast electronic control of the antenna port termination. The antenna under test is illuminated by a reference antenna in the anechoic chamber after which the impedance and gain of the patch antenna are reconstructed from the change in backscattered field due to different port terminations. In our experiment, the over-the-air reconstructed antenna input impedance exhibits a frequency shift of less than 1% with respect to the (non-ideal) on-wafer probe measurement in the 115–130 GHz frequency range. Furthermore, the measured realized gain of 0.9±0.5 dBi is close to the simulated one of 1.1 dBi.
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| 2. |
- Kruglov, Dmitrii, 1994, et al.
(författare)
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Enhancing mmWave On-Chip-Antennas Using In-Package Electromagnetic Bandgap Structures
- 2021
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Ingår i: European Microwave Conference. - 1527-3342 .- 1557-9581. - 9782874870637 ; , s. 885-888
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Konferensbidrag (refereegranskat)abstract
- We propose a silicon on-Chip-in-Package antenna design featuring a simulated radiation efficiency of > 70% and an S11 matching better than −10 dB in the 112–125 GHz frequency range. High radiation performance is achieved by: (i) thinning the silicon substrate down to 100 μm through wafer-level grinding; (ii) embedding the IC in-between two PCBs, one of which forms an electromagnetic bandgap structure that attenuates the EM leakage inside the silicon substrate. Furthermore, since the die-embedding concept employs the gap-waveguide packaging technology, a universal contactless waveguide interconnect is realized between the IC and the radiating gap waveguide in the package. This will also enable modular antenna designs.
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| 3. |
- Kruglov, Dmitrii, 1994, et al.
(författare)
-
Numerical analysis of Huygens-like on-chip antennas for mm-wave applications
- 2021
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Ingår i: 15th European Conference on Antennas and Propagation, EuCAP 2021.
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Konferensbidrag (refereegranskat)abstract
- As we transition to 5G and beyond, the frequencies increase and the efficiency of the antennas becomes a pressing issue. Silicon technologies are preferred when it comes to en masse user equipment production, but the antennas in silicon suffer from high dielectric losses and strong substrate waves coupling. The use of a Huygens source as the antenna element has a potential of decreasing these negative effects, as was demonstrated in several non-silicon PCB designs. In this paper, we investigate if a similar performance enhancement can be achieved in thin back-gated silicon antenna chips. We present a numerical comparison of an electric dipole, a magnetic dipole and a Huygens source antenna at 120 GHz on a lossy silicon substrate sitting on a ground plane. Antennas are defined in MATLAB as distributed currents and imported as near-field sources into CST Microwave Studio. This way we treat the problem in a very general way without regards for any particular physical antenna implementations. Radiation efficiency and gain are shown as functions of substrate thickness. We found that there is no apparent advantage of using a Huygens source over either electric or a magnetic dipole in the described setup. We argue that this result is based on the fact that the Huygens source is derived assuming infinite current sheets at the interface of two infinite homogeneous regions, and propose another definition for a Huygens source in multi-layer structures.
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| 4. |
- Meyer, E., et al.
(författare)
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The state of the art in beyond 5G distributed massive multiple-input multiple-output communication system solutions
- 2022
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Ingår i: Open Research Europe. - : F1000 Research Ltd. - 2732-5121. ; 2
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Forskningsöversikt (refereegranskat)abstract
- Beyond fifth generation (5G) communication systems aim towards data rates in the tera bits per second range, with improved and flexible coverage options, introducing many new technological challenges in the fields of network architecture, signal pro- cessing, and radio frequency front-ends. One option is to move towards cell-free, or distributed massive Multiple-Input Multiple-Output (MIMO) network architectures and highly integrated front-end solutions. This paper presents an outlook on be- yond 5G distributed massive MIMO communication systems, the signal processing, characterisation and simulation challenges, and an overview of the state of the art in millimetre wave antennas and electronics.
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