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- Ding Yuan, Chen, 1991, et al.
(författare)
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Impact of in situ NH3 pre-treatment of LPCVD SiN passivation on GaN HEMT performance
- 2022
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Ingår i: Semiconductor Science and Technology. - : IOP Publishing. - 1361-6641 .- 0268-1242. ; 37:3
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Tidskriftsartikel (refereegranskat)abstract
- The impact on the performance of GaN high electron mobility transistors (HEMTs) of in situ ammonia (NH3) pre-treatment prior to the deposition of silicon nitride (SiN) passivation with low-pressure chemical vapor deposition (LPCVD ) is investigated. Three different NH3 pre-treatment durations (0, 3, and 10 min) were compared in terms of interface properties and device performance. A reduction of oxygen (O) at the interface between SiN and epi-structure is detected by scanning transmission electron microscopy (STEM )-electron energy loss spectroscopy (EELS) measurements in the sample subjected to 10 min of pre-treatment. The samples subjected to NH3 pre-treatment show a reduced surface-related current dispersion of 9% (compared to 16% for the untreated sample), which is attributed to the reduction of O at the SiN/epi interface. Furthermore, NH3 pre-treatment for 10 min significantly improves the current dispersion uniformity from 14.5% to 1.9%. The reduced trapping effects result in a high output power of 3.4 W mm(-1) at 3 GHz (compared to 2.6 W mm(-1) for the untreated sample). These results demonstrate that the in situ NH3 pre-treatment before LPCVD of SiN passivation is critical and can effectively improves the large-signal microwave performance of GaN HEMTs.
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| 2. |
- Ding Yuan, Chen, 1991, et al.
(författare)
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Thin Al 0.5 Ga 0.5 N/GaN HEMTs on QuanFINE ® Structure
- 2021
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Ingår i: CS MANTECH 2021 - 2021 International Conference on Compound Semiconductor Manufacturing Technology, Digest of Papers. ; , s. 153-155
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Konferensbidrag (refereegranskat)abstract
- The performance of HEMTs fabricated on a thin Al0.5Ga0.5N/GaN heterostructure with a total barrier thickness of 6.5 nm is presented and benchmarked to the epi-structure with a 13 nm thick Al0.3Ga0.7N barrier on an identical QuanFINE® structure. DC transfer characteristics on both samples with a gate length of 100 nm demonstrate a high current above 1 A/mm. A higher extrinsic gm of 550 mS/mm is measured on the sample with a thinner high Al content barrier. Moreover, low trapping effects with a 12-14 % buffer-related dispersion at a VDSQ of 25 V are characterized for both samples, which indicate the advantage of the iron-free QuanFINE® heterostructure.
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