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| 2. |
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| 3. |
- Antelius, Mikael, et al.
(författare)
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An apodized SOI waveguide-to-fiber surface grating coupler for single lithography silicon photonics
- 2011
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Ingår i: Optics Express. - 1094-4087. ; 19:4, s. 3592-3598
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Tidskriftsartikel (refereegranskat)abstract
- We present the design, fabrication, and characterization of a grating for coupling between a single mode silica fiber and the TE mode in a silicon photonic waveguide on a silicon on insulator (SOI) substrate. The grating is etched completely through the silicon device layer, thus permitting the fabrication of through-etched surface coupled silicon nanophotonic circuits in a single lithography step. Furthermore, the grating is apodized to match the diffracted wave to the mode profile of the fiber. We experimentally demonstrate a coupling efficiency of 35% with a 1 dB bandwidth of 47 nm at 1536 nm on a standard SOI substrate. Furthermore, we show by simulation that with an optimized buried oxide thickness, a coupling efficiency of 72% and a 1 dB bandwidth of 38 nm at 1550 nm is achievable. This is, to our knowledge, the highest simulated coupling efficiency for single-etch TE-mode grating couplers. In particular, simulations show that apodizing a conventional periodic through-etched grating decreases the back-reflection into the waveguide from 21% to 0.1%.
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| 4. |
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| 5. |
- Antelius, Mikael, et al.
(författare)
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Hermetic integration of liquids in MEMS by room temperature, high-speed plugging of liquid-filled cavities at wafer level
- 2011
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Ingår i: Proceedings IEEE International Conference on Micro Electro Mechanical Systems (MEMS). - : IEEE. ; , s. 356-359
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- This paper reports a novel room temperature hermetic liquid sealing process based on wire bonded "plugs" over the access ports of liquid-filled cavities. The method enables liquids to be integrated already at the fabrication stage. Test vehicles were manufactured and used to investigate the mechanical and hermetic properties of the seals. A helium leak rate of better than 1E-10 mbarL/s was measured on the successfully sealed structures. The bond strength of the "plugs" were similar to standard wire bonds on flat surfaces.
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| 6. |
- Antelius, Mikael, et al.
(författare)
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Hermetic integration of liquids using high-speed stud bump bonding for cavity sealing at the wafer level
- 2012
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Ingår i: Journal of Micromechanics and Microengineering. - : IOP Publishing. - 0960-1317 .- 1361-6439. ; 22:4, s. 045021-
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Tidskriftsartikel (refereegranskat)abstract
- This paper reports a novel room-temperature hermetic liquid sealing process where the access ports of liquid-filled cavities are sealed with wire-bonded stud bumps. This process enables liquids to be integrated at the fabrication stage. Evaluation cavities were manufactured and used to investigate the mechanical and hermetic properties of the seals. Measurements on the successfully sealed structures show a helium leak rate of better than 10 (10) mbarL s (1), in addition to a zero liquid loss over two months during storage near boiling temperature. The bond strength of the plugs was similar to standard wire bonds on flat surfaces.
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| 7. |
- Antelius, Mikael, et al.
(författare)
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Room-temperature wafer-level vacuum sealing by compression of high-speed wire bonded gold bumps
- 2011
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Ingår i: Proceedings IEEE International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers). - : IEEE. ; , s. 1360-1363
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- This paper reports experimental results of a novel room temperature vacuum sealing process based on compressing wire bonded gold “bumps”, causing a material flow into the access ports of vacuum-cavities. The leak rate out of manufactured cavities was measured over 5 days and evaluated to less than the detection limit, 6×10-12 mbarL/s, per sealed port. The cavities have been sealed at a vacuum level below 10 mbar. The method enables sealing of vacuum cavities at room temperature using standard commercial tools and processes.
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| 8. |
- Antelius, Mikael, et al.
(författare)
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Small footprint wafer-level vacuum packaging using compressible gold sealing rings
- 2011
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Ingår i: Journal of Micromechanics and Microengineering. - : IOP Publishing. - 0960-1317 .- 1361-6439. ; 21:8, s. 085011-
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Tidskriftsartikel (refereegranskat)abstract
- A novel low-temperature wafer-level vacuum packaging process is presented. The process uses plastically deformed gold rings as sealing structures in combination with flux-free soldering to provide the bond force for a sealing wafer. This process enables the separation of the sealing and the bonding functions both spatially on the wafer and temporally in different process steps, which results in reduced areas for the sealing rings and prevents outgassing from the solder process in the cavity. This enables space savings and yields improvements. We show the experimental result of the hermetic sealing. The leak rate into the packages is determined, by measuring the package lid deformation over 10 months, to be lower than 3.5 x 10(-13) mbar l s(-1), which is suitable for most MEMS packages. The pressure inside the produced packages is measured to be lower than 10 mbar.
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| 9. |
- Antelius, Mikael, et al.
(författare)
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Wafer-Level Vacuum Sealing by Coining of Wire Bonded Gold Bumps
- 2013
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Ingår i: Journal of microelectromechanical systems. - 1057-7157 .- 1941-0158. ; 22:6, s. 1347-1353
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Tidskriftsartikel (refereegranskat)abstract
- This paper reports on the investigation of a novel room-temperature vacuum sealing method based on compressing wire bonded gold bumps which are placed to partially overlap the access ports into the cavity. The bump compression, which is done under vacuum, causes a material flow into the access ports, thereby hermetically sealing a vacuum inside the cavities. The sealed cavity pressure was measured by residual gas analysis to 8x10(-4) mbar two weeks after sealing. The residual gas content was found to be mainly argon, which indicates the source as outgassing inside the cavity and no measurable external leak. The seals are found to be mechanically robust and easily implemented by the use of standard commercial tools and processes.
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| 10. |
- Antelius, Mikael
(författare)
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Wafer-scale Vacuum and Liquid Packaging Concepts for an Optical Thin-film Gas Sensor
- 2013
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Doktorsavhandling (övrigt vetenskapligt/konstnärligt)abstract
- This thesis treats the development of packaging and integration methods for the cost-efficient encapsulation and packaging of microelectromechanical (MEMS) devices. The packaging of MEMS devices is often more costly than the device itself, partly because the packaging can be crucial for the performance of the device. For devices which contain liquids or needs to be enclosed in a vacuum, the packaging can account for up to 80% of the total cost of the device.The first part of this thesis presents the integration scheme for an optical dye thin film NO2-gas sensor, designed using cost-efficient implementations of wafer-scale methods. This work includes design and fabrication of photonic subcomponents in addition to the main effort of integration and packaging of the dye-film. A specific proof of concept target was for NO2 monitoring in a car tunnel.The second part of this thesis deals with the wafer-scale packaging methods developed for the sensing device. The developed packaging method, based on low-temperature plastic deformation of gold sealing structures, is further demonstrated as a generic method for other hermetic liquid and vacuum packaging applications. In the developed packaging methods, the mechanically squeezed gold sealing material is both electroplated microstruc- tures and wire bonded stud bumps. The electroplated rings act like a more hermetic version of rubber sealing rings while compressed in conjunction with a cavity forming wafer bonding process. The stud bump sealing processes is on the other hand applied on completed cavities with narrow access ports, to seal either a vacuum or liquid inside the cavities at room temperature. Additionally, the resulting hermeticity of primarily the vacuum sealing methods is thoroughly investigated.Two of the sealing methods presented require permanent mechanical fixation in order to complete the packaging process. Two solutions to this problem are presented in this thesis. First, a more traditional wafer bonding method using tin-soldering is demonstrated. Second, a novel full-wafer epoxy underfill-process using a microfluidic distribution network is demonstrated using a room temperature process.
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| 11. |
- Aparicio, Francisco J., et al.
(författare)
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Dye-based photonic sensing systems
- 2016
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Ingår i: Sensors and actuators. B, Chemical. - : Elsevier. - 0925-4005 .- 1873-3077. ; 228, s. 649-657
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Tidskriftsartikel (refereegranskat)abstract
- We report on dye-based photonic sensing systems which are fabricated and packaged at wafer scale. For the first time luminescent organic nanocomposite thin-films deposited by plasma technology are integrated in photonic sensing systems as active sensing elements. The realized dye-based photonic sensors include an environmental NO2 sensor and a sunlight ultraviolet light (UV) A+B sensor. The luminescent signal from the nanocomposite thin-films responds to changes in the environment and is selectively filtered by a photonic structure consisting of a Fabry-Perot cavity. The sensors are fabricated and packaged at wafer-scale, which makes the technology viable for volume manufacturing. Prototype photonic sensor systems have been tested in real-world scenarios. (C) 2016 Elsevier B.V. All rights reserved.
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| 12. |
- Aparicio, Francisco J., et al.
(författare)
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Transparent Nanometric Organic Luminescent Films as UV-Active Components in Photonic Structures
- 2011
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Ingår i: Advanced Materials. - : Wiley. - 0935-9648 .- 1521-4095. ; 23:6, s. 761-765
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Tidskriftsartikel (refereegranskat)abstract
- A new kind of visible-blind organic thin-film material, consisting of a polymeric matrix with a high concentration of embedded 3-hydroxyflavone (3HF) dye molecules, that absorbs UV light and emits green light is presented. The thin films can be grown on sensitive substrates, including flexible polymers and paper. Their suitability as photonic active components in photonic devices is demonstrated.
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| 13. |
- Dubois, Valentin J., et al.
(författare)
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A single-lithography SOI rib waveguide sensing circuit with apodized low back-reflection surface grating fiber coupling
- 2012
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Ingår i: SILICON PHOTONICS AND PHOTONIC INTEGRATED CIRCUITS III. - : SPIE - International Society for Optical Engineering. - 9780819491237 ; , s. 84311-84311
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Konferensbidrag (refereegranskat)abstract
- We present a single-lithography Mach-Zehnder interferometer sensor circuit, with integrated low back-reflection input and output grating couplers. The low back-reflection is accomplished by a duty cycle apodization optimized for coupling light between single-mode silica fibers and the nanometric silicon-on-insulator (SOI) rib-waveguides. We discuss the design, fabrication, and characterization of the circuit. The apodization profile of the gratings is algorithmically generated using eigenmode expansion based simulations and the integrated waveguides, splitters, and combiners are designed using finite element simulations. The maximum simulated coupling efficiencies of the gratings are 70% and the multimode interference splitters and combiners have a footprint of only 19.2ￜ4.5 ￜm2. The devices are fabricated on an SOI wafer with a 220 nmdevice layer and 2 ￜm buried oxide, by a single electron beam lithography and plasma etching. We characterize the devices in the wavelength range from 1460-1580 nm and show a grating pass-band ripple of only 0.06 dB and grating coupling efficiency of 40% at 1530 nm. The integrated Mach-Zehnder interferometer has an extinction ratio of -18 dB at 1530 nm and between -13 and -19 dB over the whole 1460-1580 nm range.
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| 14. |
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| 15. |
- Gatty, Hithesh Kumar, 1980-, et al.
(författare)
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A ppb level, miniaturized fast response amperometric nitric oxide sensor for asthma diagnostics
- 2013
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Ingår i: Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on. - New York : IEEE. - 9781467356541 ; , s. 1001-1004
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Konferensbidrag (refereegranskat)abstract
- This paper reports on a novel miniaturized MEMS-based amperometric nitric oxide sensor that is suitable for a point of care testing device for asthma. The novelty lies in the combination of a high surface area microporous structured electrode, nano-structured Nafion that is coated on the side walls of the micropores, and liquid electrolyte. This combination allows detection of very low concentration (parts-per-billion) gas, has a high sensitivity of 4 mu A/ppm/cm(2) and has both a response and a recovery time of 6 s. The sensor is integrated with a PCB potentiostat to form a complete measuring module. The limit of detection of this sensor was estimated to be 0.3 ppb.
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| 16. |
- Gatty, Hithesh K., et al.
(författare)
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An amperometric nitric oxide sensor with fast response and ppb-level concentration detection relevant to asthma monitoring
- 2015
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Ingår i: Sensors and actuators. B, Chemical. - : Elsevier BV. - 0925-4005 .- 1873-3077. ; 209, s. 639-644
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Tidskriftsartikel (refereegranskat)abstract
- A MEMS-based amperometric nitric oxide (NO) gas sensor is reported in this paper. The sensor is designed to detect NO gas for the purpose of asthma monitoring. The unique property of this sensor lies in the combination of a microporous high-surface area electrode that is coated with Nafion (TM), together with a liquid electrolyte. The sensor is able to detect gas concentrations of the order of parts-per-billion (ppb) and has a measured NO sensitivity of 0.045 nA/ppb and an operating range between 25 and 65% relative humidity. The settling time of the sensor is measured to 8s. The selectivity to interfering gases such as ammonia (NH3) and carbon monoxide (CO) was high when placing an activated carbon fiber filter above the sensor. The ppb-level detection capability of this sensor combined with its relatively fast response, high selectivity to CO and NH3 makes the sensor potentially applicable in gas monitoring for asthma detection.
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| 17. |
- Gylfason, Kristinn B., et al.
(författare)
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An apodized surface grating coupler enabling the fabrication of silicon photonic nanowire sensor circuits in one lithography step
- 2011
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Ingår i: Proceedings IEEE International Conference on Solid-State Sensors, Actuators,and Microsystems (Transducers). - Beijing, China : IEEE. - 9781457701573 ; , s. 1539-1541
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- We present the design, fabrication, and experimental characterization of a silicon surface grating coupler that enables the creation of complete photonic nanowire sensor circuits in a single lithography step on a standard SOI wafer. This advance is achieved without sacrifices in the coupling efficiency through the use of an apodization algorithm that tunes the width of each gap and bar in the grating. This design optimization provides a high light coupling efficiency and a low back reflection with a grating etched fully through the SOI device layer. We experimentally demonstrate a coupling efficiency of 35% on a standard SOI substrate at a wavelength of 1536 nm, and show that with an optimized buried oxide (BOX) thickness, a coupling efficiency of 72% could be achieved.
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| 18. |
- Lapisa, Martin, et al.
(författare)
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Wafer-Level capping and sealing of heat sensitive substances and liquids with gold gaskets
- 2013
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Ingår i: Sensors and Actuators A-Physical. - : Elsevier. - 0924-4247 .- 1873-3069. ; 201, s. 154-163
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Tidskriftsartikel (refereegranskat)abstract
- This paper reports on a novel wafer-level packaging method employing gold gaskets and an epoxy underfill. The packaging is done at room-temperature and atmospheric pressure. The mild packaging conditions allow the encapsulation of sensitive devices. The method is demonstrated for two applications; the wafer-level encapsulation of a liquid and the wafer-level packaging of a photonic gas sensor containing heat sensitive dye-films.
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| 19. |
- Möller, Björn, et al.
(författare)
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Early experiences from migrating to the hla evolved C++ and java APIs
- 2009
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Ingår i: Simulation Interoperability Standards Organization - Spring Simulation Interoperability Workshop 2009. - 9781605607986 ; , s. 556-568
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Konferensbidrag (refereegranskat)abstract
- Several previous papers have described a number of new concepts and services in the HLA Evolved (IEEE 1516-2009) standard, such as fault tolerance, update rate reduction and modular FOMs. This paper focuses on the particulars of the updated C++ and Java APIs. One reason for updating the APIs is to support the new or extended HLA functionality. Another reason is to make it easier to switch between different RTI implementations by simply replacing an RTI library file. This paper describes some early experiences from migrating from HLA 1.3 and HLA 1516-2000 to the new C++ and Java APIs for some commonly used HLA functionality. It is based on migration work done both for some basic federates as well as some general-purpose HLA tools. Both the C++ and Java APIs have seen an evolution in the data types used for handles, which will affect every migration effort. For the C++ API there are also changes in the memory management schemes. The way that optional arguments are handled in the APIs has also evolved. All federates will need to introduce the new connect/join sequence. Otherwise the majority of the HLA service functionality is very similar to earlier HLA versions or even simplified. Federates still using HLA 1.3 DDM may however need a major revision. A few basic examples of using the new Encoding helpers are also given. This paper also shows how the new standardized time types are used. Some properties of the HLA Evolved Dynamic Link Compatibility API (EDLC API) based on the earlier SISO DLC standard (SISO-STD-004.1-2004) are explained in detail. One particular feature here is the ability to dynamically choose between different RTI implementations at runtime. The relationship between the link compatibility, standardized time types and extendable transportation types is also explained. This paper isn't a complete migration cookbook. Still it is intended to give developers some insights that are useful for planning their HLA Evolved migration efforts.
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| 20. |
- Wang, Xiaojing, et al.
(författare)
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Narrow footprint copper sealing rings for low-temperature hermetic wafer-level packaging
- 2017
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Ingår i: TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems. - : Institute of Electrical and Electronics Engineers (IEEE). - 9781538627310 ; , s. 423-426
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Konferensbidrag (refereegranskat)abstract
- This paper reports a narrow footprint sealing ring design for low-temperature, hermetic, and mechanically stable wafer-level packaging. Copper (Cu) sealing rings that are as narrow as 8 μm successfully seal the enclosed cavities on the wafers after bonding at a temperature of 250 °C. Different sealing structure designs are evaluated and demonstrate excellent hermeticity after 3 months of storage in ambient atmosphere. A leak rate of better than 3.6×10'16 mbarL/s is deduced based on results from residual gas analysis measurements. The sealing yield after wafer bonding is found to be not limited by the Cu sealing ring width but by a maximum acceptable wafer-to-wafer misalignment.
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| 21. |
- Wang, Xiaojing, 1990-, et al.
(författare)
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Wafer-level vacuum packaging enabled by plastic deformation and low-temperature welding of copper sealing rings with a small footprint
- 2017
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Ingår i: Journal of microelectromechanical systems. - : IEEE. - 1057-7157 .- 1941-0158. ; 26:2, s. 357-365
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Tidskriftsartikel (refereegranskat)abstract
- Wafer-level vacuum packaging is vital in the fabrication of many microelectromechanical systems (MEMS) devices and enables significant cost reduction in high-volume MEMS production. In this paper, we propose a low-temperature wafer-level vacuum packaging method based on plastic deformation and low-temperature welding of copper sealing rings with a small footprint. A device wafer with copper ring structures and a cap wafer with corresponding metalized grooves are placed inside a vacuum chamber and pressed together at a temperature of 250 ̊C, resulting in low-temperature welding of the copper, and thus, hermetic sealing of the cavities enclosed by the sealing rings. The vacuum pressure inside the fabricated cavities 146 days after bonding was measured using residual gas analysis to be as low as 2.6×10-2 mbar. Based on this value, the leak rate is calculated to be smaller than 3.6×10-16 mbarL/s using the most conservative assumptions, demonstrating the excellent hermeticity of the seals. Shear testing was used to demonstrate that the seals are mechanically stable with over 90 MPa in shear strength for 5.2 μm-high Cu sealing rings with widths down to 8 μm. The reported method is potentially compatible with complementary metaloxide-semiconductor (CMOS) substrates and may be applied to vacuum packaging of 3-D heterogeneously integrated MEMS on state-of-the-art CMOS substrates.
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