| 1. |
- Singh, B. P., et al.
(författare)
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Analysis of the Performance of Different Packaging Technologies of SiC Power Modules during Power Cycling Test
- 2023
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Ingår i: 2023 29TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS, THERMINIC. - : Institute of Electrical and Electronics Engineers (IEEE).
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Konferensbidrag (refereegranskat)abstract
- Commercialization of SiC MOSFETs and electrification of the automotive sector has resulted in the accelerated development of power semiconductor devices. To take the most advantage of the SiC properties and make the power semiconductor modules automotive graded, the power module packaging technologies are developing at a rapid pace. New materials are being introduced and more innovative ways are being investigated to operate the SiC die at high temperatures while maintaining high reliability. Silver (Ag) sinter, due to its superior properties, has been introduced as a state-of-the-art die-attaching technology, while different ways are being investigated to either eliminate the aluminium (Al) bondwires or replace them with copper (Cu) counterparts. In this study, we will use the Finite Element (FE) method to investigate the impact of different packaging aspects like using copper foil and Ag sinter on thermal and mechanical performance of the power module. We will also investigate the effect of different packaging on power module reliability.
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| 2. |
- Singh, Bhanu Pratap, et al.
(författare)
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Analyzing the Impact of Die Positions inside the Power Module on the Reliability of Solder Layers for Different Power Cycling Scenarios
- 2023
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Ingår i: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. - : Institute of Electrical and Electronics Engineers (IEEE).
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Konferensbidrag (refereegranskat)abstract
- Solder layers, used as bonding material inside the power module to attach the semiconductor die on Direct Bond Copper (DBC) substrate and DBC substrate on baseplate, are one of the regions most prone to failure. The failure usually occurs in the form of solder cracks and depends on various operating conditions, such as-maximum temperature, temperature swing, and heating time. The cracks generated inside the solder layers can eventually result in its delamination. Power modules are usually power cycled to estimate the failure sites and mechanisms. However, the failure mechanisms can vary depending on the frequency, amplitude, and range of the temperature in the Power Cycling Tests (PCT). In this study, we have used the Finite Element Method (FEM) in COMSOL Multiphysics to analyse the impact of the PCT on both die attach, and baseplate attach solder layers. Additionally, the effect of the degree of asymmetry in the die position on the reliability of both the solder layers are analysed. The FEA (Finite Element Analysis) results are analysed to have a better understanding about the aspects impacting the lifetime of the power module.
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