| 1. |
- Abgrall, N., et al.
(författare)
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The large enriched germanium experiment for neutrinoless double beta decay (LEGEND)
- 2017
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Ingår i: AIP Conference Proceedings. - : Author(s). - 1551-7616 .- 0094-243X. ; 1894
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Konferensbidrag (refereegranskat)abstract
- The observation of neutrinoless double-beta decay (0νββ) would show that lepton number is violated, reveal that neu-trinos are Majorana particles, and provide information on neutrino mass. A discovery-capable experiment covering the inverted ordering region, with effective Majorana neutrino masses of 15 - 50 meV, will require a tonne-scale experiment with excellent energy resolution and extremely low backgrounds, at the level of ∼0.1 count /(FWHM·t·yr) in the region of the signal. The current generation 76Ge experiments GERDA and the Majorana Demonstrator, utilizing high purity Germanium detectors with an intrinsic energy resolution of 0.12%, have achieved the lowest backgrounds by over an order of magnitude in the 0νββ signal region of all 0νββ experiments. Building on this success, the LEGEND collaboration has been formed to pursue a tonne-scale 76Ge experiment. The collaboration aims to develop a phased 0νββ experimental program with discovery potential at a half-life approaching or at 1028 years, using existing resources as appropriate to expedite physics results.
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| 2. |
- Li, Mengxiong, et al.
(författare)
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Highly Oriented Graphite Aerogel Fabricated by Confined Liquid-Phase Expansion for Anisotropically Thermally Conductive Epoxy Composites
- 2020
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Ingår i: ACS Applied Materials & Interfaces. - : American Chemical Society (ACS). - 1944-8252 .- 1944-8244. ; 12:24, s. 27476-27484
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Tidskriftsartikel (refereegranskat)abstract
- Graphene-based thermally conductive polymer composites are of great importance for the removal of the excess heat generated by electronic devices. However, due to the orientation of graphene sheets in the polymer matrix, the through-plane thermal conductivity of polymer/graphene composites remains far from satisfactory. We here demonstrate a confined liquid-phase expansion strategy to fabricate highly oriented confined expanded graphite (CEG) aerogels. After being incorporated into epoxy resin (EP), the resulting EP/CEG composites exhibit a high through-plane thermal conductivity (4.14 ± 0.21 W m-1 K-1) at a quite low filler loading of 1.75 wt % (0.91 vol %), nearly 10 times higher than that of neat EP resin and 7.5 times higher than the in-plane thermal conductivity of the composite, indicating that the CEG aerogel has a high through-plane thermal conductivity enhancement efficiency that outperforms those of many graphite/graphene-based fillers. The facile preparation method holds great industrial application potential in fabricating anisotropic thermally conductive polymer composites.
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| 3. |
- Andersson, Cristina, 1969, et al.
(författare)
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Characterization of Mechanical Properties of Eutectic Sn-Co-Cu Lead Free Alloy
- 2006
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Ingår i: Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany. - 9781424405527 ; , s. 152-160
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Konferensbidrag (refereegranskat)abstract
- The Sn-Co-Cu eutectic solder alloy is a less expensive and is therefore a possible alternative to the Sn-Ag-Cu alloys. The Sn-Co-Cu system eutectic composition was obtained by means of CALPHAD (CALculation of PHAse Diagram) methodology. The composition of the Sn-rich, eutectic Sn-Co-Cu system was found to be 0.4%Co and 0.7%Cu (wt%) with a melting point of 224°C. The tensile behavior of the eutectic Sn-0.4Co-0.7Cu bulk samples was studied under three different conditions of strain rates (10 -6 , 10 -4 and 10 -3 /s) and compared to both Sn-37Pb and Sn-4.0Ag-0.5Cu alloys. The evaluation of the tensile results showed that the effect of strain rate played an important roll on the tensile properties of these alloys, and it is clearly observed that the tensile strength increases as the strain rate increases. Furthermore, Sn-4.0Ag-0.5Cu alloy shows better Ultimate Tensile Strength (UTS) followed by Sn-37P and Sn-0.4Co-0.7Cu system. © 2006 IEEE.
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| 4. |
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| 5. |
- Andrae, Anders, 1973, et al.
(författare)
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Uncertainty estimation by Monte Carlo Simulation applied to Life Cycle Inventory of Cordless Phones and Microscale Metallization Processes
- 2004
-
Ingår i: IEEE Transactions on Electronics Packaging Manufacturing. ; 27:4, s. 233-245
-
Tidskriftsartikel (refereegranskat)abstract
- This paper focuses on uncertainty analysis, that is, how the input data uncertainty affects the output data uncertainty in small but realistic product systems is modeled. The motivation for the study is to apply the Monte Carlo simulation for uncertainty estimation in life cycle inventory and environmental assessment of microelectronics applications. This paper addresses the question whether there is an environmental advantage of using DECT phones instead of GSM phones in offices. The paper also addresses the environmental compatibility of Electrochemical Pattern Replication (ECPR) compared to classical photolithography based microscale metallization (CL) for pattern transfer. Both environmental assessments in this paper consider electricity consumption and CO2 emissions. The projects undertaken are two comparative studies of DECT phone/GSM phone and ECPR/CL respectively. The research method used was probabilistic uncertainty modelling with a limited number of inventory parameters used in the MATLAB tool. For the DECT/GSM study the results reflects the longer DECT technical life which is an environmental advantage. For the Electrochemical Pattern Replication (ECPR)/classical photolithography based microscale metallization (CL) study the results reflects the fewer number of process steps and the lower electricity consumption needed by the ECPR to reach the functional unit. The difference in results is large enough to be able to draw conclusions, as the processes with the highest electricity consumption within the system boundaries have been determined. Based on earlier work a straightforward method to include uncertainty for input life cycle inventory data is used to quantify the influence of realistic errors for input data in two microelectronic applications. The conclusion is that the ECPR technology is more electricity efficient than CL in producing one layer of copper on a silicon wafer having a diameter of 20.32 cm. The conclusion is that the longer technical life of a cordless DECT phone is reflected in an electricity/CO2 comparison with a GSM phone, if use in an office is considered. Reasonable uncertainty intervals used for the input life cycle inventory data for the studied DECT/GSM and ECPR/CL system does affect the outcome of calculation of emission of CO2 but not to the degree that conclusions are not valid.Different uncertainty intervals and probability distributions could apply for different types of data and the interrelated input data dependence should be investigated. Today there exist very few life cycle inventory (LCI) data with the range of uncertainty for input and output elements. It must be emphasized that the upcoming LCI databases should have standard deviation characterized LCI data just as the Swiss ecoinvent LCI database.More inventory parameters and probability distributions characteristic for microsystems could be included and error analysis should be applied to future life inventory methodology, especially for future packaging concepts such as System-In-a-Package and System-On-a-Chip comparisons.
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| 6. |
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| 7. |
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| 8. |
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| 9. |
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| 10. |
- Chen, Liu, 1973, et al.
(författare)
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Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
- 2006
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Ingår i: Journal of Electronic Packaging, Transactions of the ASME. - : ASME International. - 1528-9044 .- 1043-7398. ; 128:3, s. 177-183
-
Tidskriftsartikel (refereegranskat)abstract
- Isotropic conductive adhesives (ICA) are gaining more and more application interests in electronic manufacturing, however, their failure mechanism is not been fully understood. In this paper we present reliability investigations on an encapsulated ICA flip chip interconnection. Experimental work included product lifetime measurement, cross section observation, and whole module warpage scanning. Results revealed that the chip-size effect on the ICA lifetime was obvious. A theoretical analysis was conducted with Finite Element Method (FEM) simulation. Viscoelastic models for adhesives and underfill materials were employed, and the comparison with an elastic model was made. Calculated equivalent stresses S eqv and shear stress σ xy fitted well with the experimental lifetime measurement, thus a lifetime relationship similar to the Coffin-Manson formula was established to predict the thermal fatigue life of an encapsulated ICA flip chip. Furthermore, the influences of underfill properties on the ICA reliability were discussed. Copyright © 2006 by ASME.
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| 11. |
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| 12. |
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| 13. |
- Chen, Shujing, et al.
(författare)
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Manufacturing Graphene-Encapsulated Copper Particles by Chemical Vapor Deposition in a Cold Wall Reactor
- 2019
-
Ingår i: ChemistryOpen. - : Wiley. - 2191-1363. ; 8:1, s. 58-63
-
Tidskriftsartikel (refereegranskat)abstract
- Functional fillers, such as Ag, are commonly employed for effectively improving the thermal or electrical conductivity in polymer composites. However, a disadvantage of such a strategy is that the cost and performance cannot be balanced simultaneously. Therefore, the drive to find a material with both a cost efficient fabrication process and excellent performance attracts intense research interest. In this work, inspired by the core-shell structure, we developed a facile manufacturing method to prepare graphene-encapsulated Cu nanoparticles (GCPs) through utilizing an improved chemical vapor deposition (CVD) system with a cold wall reactor. The obtained GCPs could retain their spherical shape and exhibited an outstanding thermal stability up to 179 degrees C. Owing to the superior thermal conductivity of graphene and excellent oxidation resistance of GCPs, the produced GCPs are practically used in a thermally conductive adhesive (TCA), which commonly consists of Ag as the functional filler. Measurement shows a substantial 74.6 % improvement by partial replacement of Ag with GCPs.
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| 14. |
- Cometto, O., et al.
(författare)
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Control of Nanoplane Orientation in voBN for High Thermal Anisotropy in a Dielectric Thin Film: A New Solution for Thermal Hotspot Mitigation in Electronics
- 2017
-
Ingår i: ACS Applied Materials & Interfaces. - : American Chemical Society (ACS). - 1944-8252 .- 1944-8244. ; 9:8, s. 7456-7464
-
Tidskriftsartikel (refereegranskat)abstract
- High anisotropic thermal materials, which allow heat to dissipate in a preferential direction, are of interest as a prospective material for electronics as an effective thermal management solution for hot spots. However, due to their preferential heat propagation in the in-plane direction, the heat spreads laterally instead of vertically. This limitation makes these materials ineffective as the density of hot spots increases. Here, we produce a new dielectric thin film material at room temperature, named vertically ordered nanocrystalline h-BN (voBN). It is produced such that its preferential thermally conductive direction is aligned in the vertical axis, which facilitates direct thermal extraction, thereby addressing the increasing challenge of thermal crosstalk. The uniqueness of voBN comes from its h-BN nanocrystals where all their basal planes are aligned in the direction normal to the substrate plane. Using the 3 omega method, we show that voBN exhibits high anisotropic thermal conductivity (TC) with a 16-fold difference between through-film TC and in-plane TC (respectively 4.26 and 0.26 W.m(-1).K-1). Molecular dynamics simulations also concurred with the experimental data, showing that the origin of this anisotropic behavior is due to the nature of voBN's plane ordering. While the consistent vertical ordering provides an uninterrupted and preferred propagation path for phonons in the through-film direction, discontinuity in the lateral direction leads to a reduced in-plane TC. In addition, we also use COMSOL to simulate how the dielectric and thermal properties of voBN enable an increase in hot spot density up to 295% compared with SiO2, without any temperature increase.
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| 15. |
- Du, Wenhui, et al.
(författare)
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New fast curing isotropic conductive adhesive for electronic packaging application
- 2010
-
Ingår i: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010. - 9781424481422 ; :Article number 5582446, s. 199-201
-
Konferensbidrag (refereegranskat)abstract
- With the rapid development of technologies on high density assembly and packaging in electronic industry, isotropic conductive adhesive (ICA) has been paid more and more attention as a potential substitute of solder, due to its advantages of low processing temperature, simple processing conditions and good manufacturability. However, the curing time of most traditional ICA is more than half an hour. The process duration of ICA is 2 or 3 times longer than that of solder. Thus, low efficiencies of energy using and product manufacturing has been one of factors which limits widely application of ICA. Generally, the curing speed of ICA depends on types and amount of curing agent as well as curing temperature. In our previous experiments, the effects of curing temperature and amount of curing agent have been investigated. So, the present work attempts to choose a new kind of curing agent to shorten process duration of ICA. By using new curing agent, the curing duration of ICA could be shortened in 5 minutes with a high curing rate compared with the previous version. In addition, the basic performance including bulk resistivity and viscosity are also investigated in this work. Finally, we present some discussions about the further optimization of performance, for example regarding the ways of achieving better electrical conductivity with lower filler content and improvement of viscosity etc. © 2010 IEEE.
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| 16. |
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| 17. |
- Fu, Yifeng, 1984, et al.
(författare)
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Graphene related materials for thermal management
- 2020
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Ingår i: 2D Materials. - : IOP Publishing. - 2053-1583. ; 7:1
-
Tidskriftsartikel (refereegranskat)abstract
- Almost 15 years have gone ever since the discovery of graphene as a single atom layer. Numerous papers have been published to demonstrate its high electron mobility, excellent thermal and mechanical as well as optical properties. We have recently seen more and more applications towards using graphene in commercial products. This paper is an attempt to review and summarize the current status of the research of the thermal properties of graphene and other 2D based materials including the manufacturing and characterization techniques and their applications, especially in electronics and power modules. It is obvious from the review that graphene has penetrated the market and gets more and more applications in commercial electronics thermal management context. In the paper, we also made a critical analysis of how mature the manufacturing processes are; what are the accuracies and challenges with the various characterization techniques and what are the remaining questions and issues left before we see further more applications in this exciting and fascinating field.
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| 18. |
- Fu, Yifeng, 1984, et al.
(författare)
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Selective growth of double-walled carbon nanotubes on gold films
- 2012
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Ingår i: Materials Letters. - : Elsevier BV. - 1873-4979 .- 0167-577X. ; 72, s. 78-80
-
Tidskriftsartikel (refereegranskat)abstract
- Growth of high-quality vertical aligned carbon nanotube (CNT) structures on silicon supported gold (Au) films by thermal chemical vapor deposition (TCVD) is presented. Transmission electron microscopy (TEM) images show that the growth is highly selective. Statistical study reveals that 79.4% of the as-grown CNTs are double-walled. The CNTs synthesized on Au films are more porous than that synthesized on silicon substrates under the same conditions. Raman spectroscopy and electrical characterization performed on the as-grown double-walled CNTs (DWNTs) indicate that they are competitive with those CNTs grown on silicon substrates. Field emission tests show that closed-ended DWNTs have lower threshold field than those open-ended.
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| 19. |
- Fu, Yifeng, 1984, et al.
(författare)
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Templated Growth of Covalently Bonded Three-Dimensional Carbon Nanotube Networks Originated from Graphene
- 2012
-
Ingår i: Advanced Materials. - : Wiley. - 0935-9648 .- 1521-4095. ; 24:12, s. 1576-1581
-
Tidskriftsartikel (refereegranskat)abstract
- A template-assisted method that enables the growth of covalently bonded three-dimensional carbon nanotubes (CNTs) originating from graphene at a large scale is demonstrated. Atomic force microscopy-based mechanical tests show that the covalently bonded CNT structure can effectively distribute external loading throughout the network to improve the mechanical strength of the material.
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| 20. |
- Jing, Lin, et al.
(författare)
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Thermal Conductivity Enhancement of Coaxial Carbon@Boron Nitride Nanotube Arrays
- 2017
-
Ingår i: ACS Applied Materials & Interfaces. - : American Chemical Society (ACS). - 1944-8252 .- 1944-8244. ; 9:17, s. 14555-14560
-
Tidskriftsartikel (refereegranskat)abstract
- We demonstrate the thermal conductivity enhancement of the vertically aligned carbon nanotube (CNT) arrays (from ?15.5 to 29.5 W/mK, ?90% increase) by encapsulating outer boron nitride nanotube (BNNT, 0.97 nm-thick with ?3-4 walls). The heat transfer enhancement mechanism of the coaxial C@BNNT was further revealed by molecular dynamics simulations. Because of their highly coherent lattice structures, the outer BNNT serves as additional heat conducting path without impairing the thermal conductance of inner CNT. This work provides deep insights into tailoring the heat transfer of arbitrary CNT arrays and will enable their broader applications as thermal interface material.
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| 21. |
- Kaindl, Reinhard, et al.
(författare)
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Aerosol Jet Printing of Graphene and Carbon Nanotube Patterns on Realistically Rugged Substrates
- 2021
-
Ingår i: ACS Omega. - : American Chemical Society (ACS). - 2470-1343. ; 6:50, s. 34301-34313
-
Tidskriftsartikel (refereegranskat)abstract
- Direct-write additive manufacturing of graphene and carbon nanotube (CNT) patterns by aerosol jet printing (AJP) is promising for the creation of thermal and electrical interconnects in (opto)electronics. In realistic application scenarios, this however often requires deposition of graphene and CNT patterns on rugged substrates such as, for example, roughly machined and surface oxidized metal block heat sinks. Most AJP of graphene/CNT patterns has thus far however concentrated on flat wafer-or foil type substrates. Here, we demonstrate AJP of graphene and single walled CNT (SWCNT) patterns on realistically rugged plasma electrolytic-oxidized (PEO) Al blocks, which are promising heat sink materials. We show that AJP on the rugged substrates offers line resolution of down to similar to 40 mu m width for single AJP passes, however, at the cost of noncomplete substrate coverage including noncovered mu m-sized pores in the PEO Al blocks. With multiple AJP passes, full coverage including coverage of the pores is, however, readily achieved. Comparing archetypical aqueous and organic graphene and SWCNT inks, we show that the choice of the ink system drastically influences the nanocarbon AJP parameter window, deposit microstructure including crystalline quality, compactness of deposit, and inter/intrapass layer adhesion for multiple passes. Simple electrical characterization indicates aqueous graphene inks as the most promising choice for AJP-deposited electrical interconnect applications. Our parameter space screening thereby forms a framework for rational process development for graphene and SWCNT AJP on application-relevant, rugged substrates.
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| 22. |
- Lai, Huaxiang, et al.
(författare)
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Effects of BN and SiC nanoparticles on properties of conductive adhesive
- 2010
-
Ingår i: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010. - 9781424481422 ; :Article number 5582434, s. 235-239
-
Konferensbidrag (refereegranskat)abstract
- Isotropic conductive adhesives (ICAs) are a type of interconnect material used more and more widely in computer, robot, mobile phone, LED and so on. Compared with traditional solders, isotropic conductive adhesives have better working plasticity, creep resistance and heat resistance. In particular, isotropic conductive adhesives are more responsive in high density packaging than solder, which determines the dominance of ICAs in high density packaging in the future. In order to improve the thermal conductivity of ICA with acceptable electrical conductivity, Ag flakers, BN and SiC nanoparticles were added into the matrix. The content of silver flakes was 75wt%, and the content of nanoparticles (BN or SiC) in the isotropic conductive adhesives were 0wt%, 0.5wt%, 1.5wt%, 2.5wt%, 3wt%, 5wt% in weight. The conductive adhesives were coated on the PCBs with stencil printing and fifty SR1206 chip components were mounted on a PCB using conductive adhesive. All samples were cured at 150°for 1h. Further research into the reliability of the above isotropic conductive adhesives after temperature & humidity and thermal-cycling was carried out to analyze the effects of BN and SiC nanoparticals on the properties of ICA. The condition of the temperature & humidity test was 85 ° /85%RH, 500h. The thermal-cycling test was -40 °∼125°, 500 cycles and the soaking time and ramping rate were 19min and ±15°/min. Changes to electrical resistance were used to estimate the reliability of the isotropic conductive adhesives in this study. The microstructure of the failure samples was observed using a Scanning Electron Microscope (SEM). The water absorption of all ICAs is the same after 94h temperature and humidity aging and the rate of water absorption is also the same during the aging. The ICA with 3% boron nitride nanoparticles and 75% micron silver flakes shows the best temperature and humidity reliability, with the fewest cracks on the interface between ICA and component. After 500h thermal cycling aging, the resistance reduces in the first 100h and maintains in a certain value after 332h cycled thermal. The samples have no wide cracks but a few small ones on the interface. © 2010 IEEE.
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| 23. |
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| 24. |
- Liu, Hao, et al.
(författare)
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Graphene oxide for nonvolatile memory application by using electrophoretic technique
- 2020
-
Ingår i: Materials Today Communications. - : Elsevier BV. - 2352-4928. ; 25
-
Tidskriftsartikel (refereegranskat)abstract
- The experimental work presented here, for the first time using electrophoretic technique to fabricate graphene oxide (GO)-based resistive random access memory (RRAM). By using electrophoretic technique, nonvolatile RRAM devices with Aluminum (Al)/GO/Indium tin oxide (ITO) cross-bar sandwich-like structure were fabricated. The fabricated devices show typical bipolar resistant switching behavior with ON/OFF ratio more than 10, retention time more than 102 s, and transition voltage less than 1.7 V. The switching mechanism for the devices is ascribed to the formation and rupture of the conducting filament induced by the diffusion of oxygen ions. The results show that the electrophoretic technique holds great potential for film manufacturing for RRAM.
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| 25. |
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| 26. |
- Liu, Hao, et al.
(författare)
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Thermally Conductive Graphene Film/Indium/Aluminum Laminated Composite by Vacuum Assisted Hot-pressing
- 2020
-
Ingår i: 2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). - 9781728168265
-
Konferensbidrag (refereegranskat)abstract
- In order to meet the ever more demanding requirements of modern thermal management with the increasing high power density, an easy-fabricated laminated graphene film/indium/aluminum (GF/In/Al) composite was developed. The GF was fabricated through assemble graphene oxide (GO) sheets in a layer-by-layer structure and then subjected to graphitization process at high temperature as well as press forming process. The fabricated GF exhibits ultrahigh in-plane thermal conductivity together with good tensile strength. The GF/In/Al laminated composite was fabricated by hot-pressing indium coated GF and Al layers in vacuum environment. The indium layer was easily coated onto the GF due to its low melting point along with good flowing property. The thermal resistance measurements show that the indium bonding possess greater preponderance of reducing contact resistance than without bonding material and thermal conductive adhesive (TCA) bonding, because indium layer could fill the gap between GF and Al layers, and provide more stable connection. The results show that the obtained laminated composite could be potentially used in the thermal management of high power systems.
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| 27. |
- Liu, Johan, 1960, et al.
(författare)
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Stem Cell Growth and Migration on Nanofibrous Polymer Scaffolds and Micro-Fluidic Channels on Silicon-Chip
- 2009
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Ingår i: Proceedings of the 2009 Electronic Components and Technology Conference. - 0569-5503. - 9781424444762 ; , s. 1080-1085
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Konferensbidrag (refereegranskat)abstract
- Stem cell growth and migration on nanofibrous scaffolds and micro-fluidic channels on Silicon-Chip were studied by using neural stem cells isolated from adult rats' brain. Electrospinning and lithographic technique were used for developing nanofibrous-polylactic acid (PLA) and polyurethane (PU) based-scaffolds and micro-fluidic channels on Si-Chips respectively. Immunocytochemical and morphological analysis showed better cell-matrix interaction with profound adhesion, proliferation and migration on the developed scaffolds. Cell culture assay with microfluidic channel revealed the ability of developed channel system in guiding neuronal stem cell growth towards specified directions. These studies extend the possibility of using developed nanofibrous scaffolds and micro-fluidic channel system for future electrical signal transmission based on living neural stem cells.
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| 28. |
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| 29. |
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| 30. |
- Liu, Ya, 1991, et al.
(författare)
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A Novel Graphene Quantum Dot-Based mRNA Delivery Platform
- 2021
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Ingår i: ChemistryOpen. - : Wiley. - 2191-1363. ; 10:7, s. 666-671
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Tidskriftsartikel (refereegranskat)abstract
- During the last decades, there has been growing interest in using therapeutic messager RNA (mRNA) together with drug delivery systems. Naked, unformulated mRNA is, however, unable to cross the cell membrane and is susceptible to degradation. Here we use graphene quantum dots (GQDs) functionalized with polyethyleneimine (PEI) as a novel mRNA delivery system. Our results show that these modified GQDs can be used to deliver intact and functional mRNA to Huh-7 hepatocarcinoma cells at low doses and, that the GQDs are not toxic, although cellular toxicity is a problem for these first-generation modified particles. Functionalized GQDs represent a potentially interesting delivery system that is easy to manufacture, stable and effective.
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| 31. |
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| 32. |
- Liu, Ya, 1991, et al.
(författare)
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Effect of Boron Nitride Particle Geometry on the Thermal Conductivity of a Boron Nitride Enhanced Polymer Composite Film
- 2019
-
Ingår i: THERMINIC 2019 - 2019 25th International Workshop Thermal Investigations of ICs and Systems.
-
Konferensbidrag (refereegranskat)abstract
- Hexagonal Boron Nitride (h-BN) has been considered as a promising enhancement filler for thermal management due to its high thermal conductivity, structural stability, and super electrical resistivity. Numerus studies have reported using BN as an enhancement filler to achieve high thermally conductive polymer based thermal management materials. However, there are limited data regarding the influence of the flake size of BN sheets to the thermal management property of BN filled composites. In this work, three h-BN size geometries, including microscale h-BN powder, h-BN nanosheets, and a mixture of micro and nanoscale h-BN, were studied regarding its thermal transfer performance. The results show that h-BN nanosheets are able to achieve the highest in-plane thermal conductivity with loading from 0 - 5 wt% while for the through-plane thermal conductivity, all three geometries show similar thermal property when the filler loading less than 5 wt%. Through-plane thermal conductivity exhibits a sudden increase to 5.69 W m-1 K-1 at a loading of 5 wt%..
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| 33. |
- Liu, Ya, 1991, et al.
(författare)
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Egg albumen templated graphene foams for high-performance supercapacitor electrodes and electrochemical sensors
- 2018
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Ingår i: Journal of Materials Chemistry A. - : Royal Society of Chemistry (RSC). - 2050-7488 .- 2050-7496. ; 6:37, s. 18267-18275
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Tidskriftsartikel (refereegranskat)abstract
- We demonstrate a simple and scalable strategy to obtain N, S and Si co-doped biocompatible graphene foams (GFs) with different shapes using egg albumen as the template. The unique porous structure and element doping endow the GFs with a high charge-discharge rate and good wettability, which largely improve the electrochemical performance of the electrodes, including ultrahigh specific capacitance (534 F g-1at 1 A g-1), and excellent rate capability (308 F g-1at 100 A g-1) and cycling performance (96.1% retention of the initial capacitance after 10000 cycles at a high current density of 10 A g-1). Besides, when used as an electrochemical sensor for dopamine, the GF exhibits a detection limit as low as 1.2 μM with a linear response up to 70 μM, due to the low equivalent series resistance. These reveal great potential for promoting the application of 3D graphene in energy storage and electrochemical sensors.
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| 34. |
- Liu, Ya, 1991, et al.
(författare)
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Graphene based thermal management system for battery cooling in electric vehicles
- 2020
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Ingår i: Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020.
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Konferensbidrag (refereegranskat)abstract
- In this work, a graphene assembled film integrated heat sink and water cooling technology was used to build an experimental set-up of a thermal management system to demonstrate the possibility to achieve efficient cooling of the propulsion battery in electric vehicles. The experimental results showed that the temperature decrease of a Li-ion battery module can reach 11°C and 9 °C under discharge rates as of 2C and 1C, respectively. The calculated thermal resistance of the graphene based cooling system is about 76% of a similar copper based cooling system. Surface modification was carried out on the graphene sheet to achieve a reliable bonding between the graphene sheet and the battery cell surface. This work provides a proof of concept of a new highly efficient approach for electric vehicle battery thermal management using the light-weight material graphene.
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| 35. |
- Liu, Yangming, et al.
(författare)
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Numerical investigation on the thermal properties of the micro-cooler
- 2010
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Ingår i: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010. - 9781424481422 ; :Article number 5583917, s. 634-638
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Konferensbidrag (refereegranskat)abstract
- The micro-pin-fins prepared on the back side of the power chip enable heat removal on the level of modern microsystem demands. Carbon nanotube (CNT) has been proven to be a potential material for micro-cooler because of its superior advantages including high thermal conductivity, good mechanical property and so forth. And there emerges various applications of CNT in the micro-cooler system. In the present paper, micro-pin-fin heat sink with gas impinging jet as the cooling medium is analyzed. The heat dissipation of forced air convection cooling with micro-pin-fin structures made of aligned carbon nanotube arrays has been taken into consideration. The three-dimensional computational fluid dynamics (CFD) simulation was carried out. The temperature distribution and the pressure drop are studied in the cases of various geometrical parameters of the micro-pin-fin heat sinks at the same heating power prescribed. The fluid flow and the heat transfer phenomena in the micro-pin-fins heat sinks are investigated. The heat removal efficiency of the air microcooler is evaluated. An array of 8×8 fins with the optimized fin-to-base length ratio achieves the best cooling effect © 2010 IEEE.
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| 36. |
- Liu, Ya, 1991, et al.
(författare)
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Surface modification of graphene for use as a structural Fortifier in water-borne epoxy coatings
- 2019
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Ingår i: Coatings. - : MDPI AG. - 2079-6412. ; 9:11
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Tidskriftsartikel (refereegranskat)abstract
- Graphene, the typical two-dimensional sp2 hybridized carbon allotrope, is widely used as a filler for improving the mechanical performance of polymers. However, its superhydrophobic surface makes it a big challenge to obtain stable graphene dispersions, especially in water-borne systems. On the contrary, graphene oxide (GO) shows excellent dispersibility in water, but strong oxidants and acids destroy its structure and degrade its mechanical properties. This largely limits its application in water-borne coatings. In this work, graphene from mechanical exfoliation was surface modified by p-aminophenol derived diazonium salt to achieve a homogenous dispersion. Moreover, the hydroxyl groups in p-aminophenol are able to combine with epoxy resins during the curing process to improve mechanical performance of the final coatings. The result shows that functionalized graphene shows a lower coefficient of friction and better abrasion resistance compared to GO.
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| 37. |
- Liu, Ya, 1991, et al.
(författare)
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Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader
- 2019
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Ingår i: Proceedings - 2019 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2019. ; , s. 1-5
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Konferensbidrag (refereegranskat)abstract
- Thermally conductive materials with electrically insulating properties have been extensively investigated for thermal management of electronic devices. The combined properties of high thermal conductivity, structural stability, corrosion resistance and electric resistivity make hexagonal boron nitride (h-BN) a promising candidate for this purpose. Theoretical studies have revealed that h-BN has a high in-plane thermal conductivity up to 400-800 W m-1 K-1 at room temperature. However, it is still a big challenge to achieve high thermally conductive h-BN thick films that are commercially feasible due to its poor mechanical properties. On the other hand, many polymers exhibit advantages for flexibility. Thus, combining the merits of polymer and the high thermal conductivity of h-BN particles is considered as a promising solution for this issue. In this work, orientated PVP/h-BN films were prepared by electrospinning and a subsequent mechanical pressing process. With the optimized h-BN loading, a PVP/h-BN composite film with up to 22 W m-1 K-1 and 0.485 W m-1 K-1 for in-plane and through-plane thermal conductivity can be achieved, respectively. We believe this work can help accelerate the development of h-BN for thermal management applications.
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| 38. |
- Liu, Ya, 1991, et al.
(författare)
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Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader
- 2019
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Ingår i: Advancing Microelectronics. - 2222-8748. ; 2019:NOR, s. 1-5
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Tidskriftsartikel (refereegranskat)abstract
- Thermally conductive materials with electrically insulating properties have been extensively investigated for thermal management of electronic devices. The combined properties of high thermal conductivity, structural stability, corrosion resistance and electric resistivity make hexagonal boron nitride (h-BN) a promising candidate for this purpose. Theoretical studies have revealed that h-BN has a high in-plane thermal conductivity up to 400 - 800 W m−1 K−1 at room temperature. However, it is still a big challenge to achieve high thermally conductive h-BN thick films that are commercially feasible due to its poor mechanical properties. On the other hand, many polymers exhibit advantages for flexibility. Thus, combining the merits of polymer and the high thermal conductivity of h-BN particles is considered as a promising solution for this issue. In this work, orientated PVP/h-BN films were prepared by electrospinning and a subsequent mechanical pressing process. With the optimized h-BN loading, a PVP/h-BN composite film with up to 22 W m-1 K-1 and 0.485 W m-1 K-1 for in-plane and through-plane thermal conductivity can be achieved, respectively. We believe this work can help accelerate the development of h-BN for thermal management applications.
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| 39. |
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| 40. |
- Manchili, Swathi Kiranmayee, 1987, et al.
(författare)
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Effect of Nanopowder Addition on the Sintering of Water-Atomized Iron Powder
- 2020
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Ingår i: Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science. - : Springer Science and Business Media LLC. - 1073-5623. ; 51:9, s. 4890-4901
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Tidskriftsartikel (refereegranskat)abstract
- A promising method of improving the densification of powder metallurgical steel components is to blend nanopowder with the otherwise typically used micrometre-sized powder. The higher surface-to-volume ratio of nanopowder is hypothesized to accelerate the sintering process and increase the inter-particle contact area between the powder particles. This is supposed to enhance the material transport and improve the densification. In the present investigation, water-atomized iron powder (− 45 μm) was mixed separately with pure iron and low-carbon steel nanopowder, each at a ratio of 95 to 5 pct. These powder mixes were compacted at different pressures (400, 600 and 800 MPa) and then sintered at 1350 °C in a pure hydrogen atmosphere. The sintering behavior of the powder blend compacts was compared to that of the compact with micrometre-sized powder only. Densification commenced at much lower temperatures in the presence of nanopowder. To understand this, sintering at intermittent temperatures such as 500 °C and 700 °C was conducted. The fracture surface revealed that the nanopowder was sintered at between 500 °C and 700 °C, which in turn contributed to the densification of the powder mix at the lower temperature range. Based on the sintering experiments, an attempt was made to calculate the activation energy and identify the associated sinter mechanism using two different approaches. It was shown that the first approach yielded values in agreement with the grain-boundary diffusion mechanism. As the nanopowder content increased, there was an increase in linear shrinkage during sintering.
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| 41. |
- Middeldorp, Christel M., et al.
(författare)
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The Early Growth Genetics (EGG) and EArly Genetics and Lifecourse Epidemiology (EAGLE) consortia : design, results and future prospects
- 2019
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Ingår i: European Journal of Epidemiology. - : Springer Science and Business Media LLC. - 0393-2990 .- 1573-7284. ; 34:3, s. 279-300
-
Tidskriftsartikel (refereegranskat)abstract
- The impact of many unfavorable childhood traits or diseases, such as low birth weight and mental disorders, is not limited to childhood and adolescence, as they are also associated with poor outcomes in adulthood, such as cardiovascular disease. Insight into the genetic etiology of childhood and adolescent traits and disorders may therefore provide new perspectives, not only on how to improve wellbeing during childhood, but also how to prevent later adverse outcomes. To achieve the sample sizes required for genetic research, the Early Growth Genetics (EGG) and EArly Genetics and Lifecourse Epidemiology (EAGLE) consortia were established. The majority of the participating cohorts are longitudinal population-based samples, but other cohorts with data on early childhood phenotypes are also involved. Cohorts often have a broad focus and collect(ed) data on various somatic and psychiatric traits as well as environmental factors. Genetic variants have been successfully identified for multiple traits, for example, birth weight, atopic dermatitis, childhood BMI, allergic sensitization, and pubertal growth. Furthermore, the results have shown that genetic factors also partly underlie the association with adult traits. As sample sizes are still increasing, it is expected that future analyses will identify additional variants. This, in combination with the development of innovative statistical methods, will provide detailed insight on the mechanisms underlying the transition from childhood to adult disorders. Both consortia welcome new collaborations. Policies and contact details are available from the corresponding authors of this manuscript and/or the consortium websites.
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| 42. |
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| 43. |
- Mo, Zhimin, et al.
(författare)
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Integrating nano carbon tubes with microchannel cooler
- 2004
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Ingår i: Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4). ; 04:EX905, s. pp 373-376
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Konferensbidrag (refereegranskat)
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| 44. |
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| 45. |
- Shen, Zhiyang, et al.
(författare)
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Novel Lightweight, Highly Thermally Conductive Graphene-Enhanced Heat Pipes for Electronics Cooling and Thermal Management Applications
- 2024
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Ingår i: 2024 International Conference on Electronics Packaging, ICEP 2024. ; , s. 339-340
-
Konferensbidrag (refereegranskat)abstract
- As electronic equipment becomes increasingly lightweight, miniaturized, and highly integrated, the heat dissipation challenges of electronic devices become increasingly greater. Heat pipes are among the most efficient heat-conducting elements. However, conventional heat pipes are gradually unable to meet the heat dissipation needs and lightweight requirements of electronic devices due to limitations in the intrinsic thermal conductivity of the metal and weight constraints. Therefore, it is imperative to explore new high thermal conductivity and lightweight heat pipes. This paper developed a new graphene-reinforced nickel-based heat pipe and a graphene-reinforced aluminum-based heat pipe. The results show that the two graphene-reinforced heat pipes significantly reduce the mass of the heat pipe and improve the heat transfer performance of the heat pipe.
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| 46. |
- Sun, Jie, 1977, et al.
(författare)
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Direct Chemical Vapor Deposition of Large-Area Carbon Thin Films on Gallium Nitride for Transparent Electrodes: A First Attempt
- 2012
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Ingår i: IEEE Transactions on Semiconductor Manufacturing. - : Institute of Electrical and Electronics Engineers (IEEE). - 0894-6507 .- 1558-2345. ; 25:3, s. 494-501
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Tidskriftsartikel (refereegranskat)abstract
- Direct formation of large-area carbon thin films on gallium nitride by chemical vapor deposition without metallic catalysts is demonstrated. A high flow of ammonia is used to stabilize the surface of the GaN (0001)/sapphire substrate during the deposition at 950 degrees C. Various characterization methods verify that the synthesized thin films are largely sp(2) bonded, macroscopically uniform, and electrically conducting. The carbon thin films possess optical transparencies comparable to that of exfoliated graphene. This paper offers a viable route toward the use of carbon-based materials for future transparent electrodes in III-nitride optoelectronics, such as GaN-based light emitting diodes and laser diodes.
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| 47. |
- Tao, W., et al.
(författare)
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Reliability characterisation of bi-modal high temperature stable Isotropic Conductive Adhesives
- 2010
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Ingår i: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xian, 16-19 August 2010. - 9781424481422 ; :Article number 5582437, s. 225-228
-
Konferensbidrag (refereegranskat)abstract
- Conductive adhesives are generally considered to be one of the strongest candidates for replacement of solder in electronics industry. However, some problems related to the performance have so far limited wider applications of conductive adhesives. One of the major problems is tendency to degrade during temperature and humidity aging. In this paper, two kinds of Isotropic Conductive Adhesives (ICA) with high temperature stable matrix and different fillers were fabricated. The first one was fabricated by simply adding silver flakes into matrix as filler using this high temperature stable matrix based on highly cross-linked aromatic functional groups. For the second one, in addition to silver flakes, nanosilver particles with different weight percentages were also added as filler into matrix to form a bi-modal ICA. The weight percentages of nano-silver particles in filler are 1wt%, 2wt% and 3wt% respectively. The filler content of these two ICAs are both 75wt% in total. All test samples were cured at 150°for 1 hour. The random distribution of the silver flakes in the adhesive was observed by SEM. The bulk resistivity of the ICAs with different fillers was investigated to characterize the electrical conductivity of the ICA. The results show that addition of small amount of nano-silver particles improve the electric conductivity of the ICA but the excessive amount of nano-silver particles led to the increase of the ICA's bulk resistivity. The humidity (85°/85RH) test was carried out and the resistances of the samples were measured. It was shown that some electrical resistance increase was observed during the humidity testing with time. The addition of the nano-particles has also some negative effect of the electrical resistance change. But the effect is limited in a few percentage range of the nano-particle addition.
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| 48. |
- Wang, Nan, et al.
(författare)
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Highly thermal conductive and electrically insulated graphene based thermal interface material with long-term reliability
- 2019
-
Ingår i: Proceedings - Electronic Components and Technology Conference. - 0569-5503. ; 2019-May, s. 1564-1568
-
Konferensbidrag (refereegranskat)abstract
- High density packaging in combination with increased transistor integration inevitably leads to challenging power densities in terms of thermal management. The conventional TIMs that are widely used in the microelectronic industry today are experiencing more and more stress due to their limited thermal performance and poor reliability. Composed by particle laden polymer matrix, thermal conductivity (K) of conventional TIMs is generally limited to 5 W/mK, and such values can be even lower for electrically insulated TIMs. Conventional TIMs also suffer from severe pump-out and dry-out failures, which brought great threat to the performance and lifetime of the electronic devices. Here, we solve these problems by applying a novel highly thermal conductive, electrically insulated and reliable graphene based TIMs (I-GTs). Composed by vertical graphene structures, I-GTs provide a continuous heat pathway from top to bottom, which enables superfast heat dissipation at through-plane direction. The highest bulk through-plane thermal conductivity of the conductive body can reach up to 1000 W/mK, which is orders of magnitude higher than conventional TIMs, and even outperforms the pure indium TIMs by over ten times. The highly flexible and foldable nature of I-GT enables at least 100% compressibility upon small applied pressures. As excellent gap fillers, I-GT can provide complete physical contact between two surfaces and thereby minimize the contact resistance to heat flow. The measured minimum thermal resistance for I-GTs reaches about 30 Kmm2/W. Such values are significantly higher than the randomly dispersed composites presented above. To ensure fully electrical insulation, a smooth and soft adhesive layer with a thickness of few microns was coated on the surface of I-GT. The breakdown voltage of I-GT reaches up to 950 V. Thermal cycling test shows the highly stable nature of I-GT. The good compressibility and elasticity of I-GT ensures continued proper TIM contact with substrates, which counteracts the effect of internal stress induced by the mismatch of coefficient of thermal expansion (CTE) during temperature cycling. In addition, the I-GTs have the advantages of low density and good maintainability. The resulting I-GTs thus opens new opportunities for addressing large heat dissipation issues for form-factor driven electronics and other high power driven systems.
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| 49. |
- Wang, Nan, et al.
(författare)
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Highly Thermal Conductive and Light -weight Craphene-based Heatsink
- 2019
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Ingår i: 2019 22ND EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION (EMPC). - 2165-2341. - 9780956808660
-
Konferensbidrag (refereegranskat)abstract
- With the developing trend ofminiaturization and integration of modem electronic devices, commercial hearsinks ivaterigh, like copper and ii iv are facing mare and mare challenges, such as inefficient cooling performance, large size turd heavy weight. Here, we salve the probletn by developing a novel highly thermal conductive and 11Mo-weight graphene heatsink. Cornposed by vertically-aligned and continUOUS graphene structures, heat transport was highly efficiero from the base 1o fin Ii: ininside the heatsink, The maximum through-platre thermal catuluctivity ofgraphene heatsink can be up to 1000 1500 Ward( which is over 7 times higher than aluminum, and even outperforms copper about 4 times_ Gmphene heatsink demonstrated outstanding cooling perffrmance which wm superior to copper heatsink with the same dimension and same power input. Noticeably, the graphene hearsink also has anportant advantagas of light-weight and high emissions,. The measured density (1 1 g cmli is only onroeighth of copper and lam than hoor of aluminum and emissivity is about ten times hiher than pure rapper and aluminum. The resulting graphene heatsink thus opertS rim opportunities for addressing large heat dissMatMn issues in weight' driven electronics and othm high power smions.
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| 50. |
- Wang, Teng, 1983, et al.
(författare)
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Development of Carbon Nanotube Bumps for Ultra Fine Pitch Flip Chip Interconnection
- 2006
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Ingår i: 1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006. - 9781424405527 ; 2, s. 892-895
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Konferensbidrag (refereegranskat)abstract
- Since 1991, carbon nanotubes have been considered for successful applications in various fields due to their unique properties. In the present work, carbon nanotubes are applied in integrated circuit packaging, as the bump interconnection for flip chip. The reason for choosing carbon nanotubes as the bump material is their special electrical, mechanical and thermal properties, which may promote both the performance and reliability of the flip chip packaging. Moreover, carbon nanotubes can be formed according to a precisely predefined small-scale pattern, which makes extremely high density interconnection possible. Vertically aligned carbon nanotubes are grown on silicon in the form of square arrays of different sizes, heights and pitches. Attempts to use thermal compression and anisotropic conductive adhesive to bond chips carrying carbon nanotube bumps with ceramic substrates are also executed. Mechanical testing is performed afterward to determine the strength of the bonding interfaces. The strength of the bonding by thermal compression is very weak, in the range from 1.9 to 7.0 g/mm2. The bonding by anisotropic conductive adhesive is much stronger, indicating a possible approach to bond chips carrying carbon nanotube bumps.
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