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Träfflista för sökning "WFRF:(Uren D) "

Sökning: WFRF:(Uren D)

  • Resultat 1-7 av 7
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1.
  • Aad, G., et al. (författare)
  • 2010
  • swepub:Mat__t
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2.
  • Aad, G., et al. (författare)
  • 2012
  • swepub:Mat__t (refereegranskat)
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3.
  • Aad, G., et al. (författare)
  • 2014
  • Ingår i: Journal of High Energy Physics. - 1029-8479 .- 1126-6708. ; :9, s. 1-49
  • Tidskriftsartikel (refereegranskat)
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5.
  • Olsson, T, et al. (författare)
  • Anti-JC virus antibody prevalence in a multinational multiple sclerosis cohort
  • 2013
  • Ingår i: Multiple sclerosis (Houndmills, Basingstoke, England). - : SAGE Publications. - 1477-0970 .- 1352-4585. ; 19:11, s. 1533-1538
  • Tidskriftsartikel (refereegranskat)abstract
    • JC virus (JCV) is an opportunistic virus known to cause progressive multifocal leukoencephalopathy. Anti-JC virus (Anti-JCV) antibody prevalence in a large, geographically diverse, multi-national multiple sclerosis (MS) cohort was compared in a cross-sectional study. Overall, anti-JCV antibody prevalence was 57.6%. Anti-JCV antibody prevalence in MS patients ranged from approximately 47% to 68% across these countries: Norway, 47.4%; Denmark, 52.6%; Israel, 56.6%; France, 57.6%; Italy, 58.3%; Sweden, 59.0%; Germany, 59.1%; Austria, 66.7% and Turkey, 67.7%. Prevalence increased with age (from 49.5% in patients < 30 years of age to 66.5% in patients ≥ 60 years of age; p < 0.0001 comparing all age categories), was lower in females than in males (55.8% versus 61.9%; p < 0.0001) and was not affected by prior immunosuppressant or natalizumab use.
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7.
  • Pooth, A., et al. (författare)
  • Morphological and electrical comparison of Ti and Ta based ohmic contacts for AlGaN/GaN-on-SiC HFETs
  • 2017
  • Ingår i: Microelectronics and Reliability. - : Elsevier BV. - 0026-2714. ; 68, s. 2-4
  • Tidskriftsartikel (refereegranskat)abstract
    • The morphology and impact on leakage currents of two different ohmic metal stacks for GaN based transistor devices is investigated in this work. The results have implications for the performance and reliability of a GaN transistor device. A low temperature Ta based and a higher temperature anneal Ti based metallization are compared. The low temperature process shows a smoother metal semiconductor interface together with several orders of magnitude lower vertical and lateral leakage compared to the conventional higher temperature process. In addition to the leakage tests, back bias ramping experiments are performed unveiling potential advantages of the conventional approach in mitigating current collapse. However the low leakage will enable higher voltage operation making the low temperature process the preferable choice for high power RF applications, if simultaneously current collapse can be controlled.
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  • Resultat 1-7 av 7

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