| 1. |
- Gu, Huaxin, et al.
(författare)
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Hypoxia aggravates the effects of ocean acidification on the physiological energetics of the blue mussel Mytilus edulis
- 2019
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Ingår i: Marine Pollution Bulletin. - : Elsevier BV. - 0025-326X .- 1879-3363. ; 149
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Tidskriftsartikel (refereegranskat)abstract
- © 2019 Elsevier Ltd Apart from ocean acidification, hypoxia is another stressor to marine organisms, especially those in coastal waters. Their interactive effects of elevated CO2 and hypoxia on the physiological energetics in mussel Mytilus edulis were evaluated. Mussels were exposed to three pH levels (8.1, 7.7, 7.3) at two dissolved oxygen levels (6 and 2 mg L−1) and clearance rate, absorption efficiency, respiration rate, excretion rate, scope for growth and O: N ratio were measured during a14-day exposure. After exposure, all parameters (except excretion rate) were significantly reduced under low pH and hypoxic conditions, whereas excretion rate was significantly increased. Additive effects of low pH and hypoxia were evident for all parameters and low pH appeared to elicit a stronger effect than hypoxia (2.0 mg L−1). Overall, hypoxia can aggravate the effects of acidification on the physiological energetics of mussels, and their populations may be diminished by these stressors.
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| 2. |
- Shuaishuai, Wang, et al.
(författare)
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Facile Chemoenzymatic Synthesis of O-Mannosyl Glycans
- 2018
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Ingår i: Angewandte Chemie International Edition. - : Wiley-VCH Verlagsgesellschaft. - 1433-7851 .- 1521-3773. ; 57:30, s. 9268-9273
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Tidskriftsartikel (refereegranskat)abstract
- Abstract O?Mannosylation is a vital protein modification involved in brain and muscle development whereas the biological relevance of O-mannosyl glycans has remained largely unknown owing to the lack of structurally defined glycoforms. An efficient scaffold synthesis/enzymatic extension (SSEE) strategy was developed to prepare such structures by combining gram-scale convergent chemical syntheses of three scaffolds and strictly controlled sequential enzymatic extension catalyzed by glycosyltransferases. In total, 45 O-mannosyl glycans were obtained, covering the majority of identified mammalian structures. Subsequent glycan microarray analysis revealed fine specificities of glycan-binding proteins and specific antisera.
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| 3. |
- Lu, Yu, et al.
(författare)
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Electroless deposition of high-uniformity nickel microbumps with ultrahigh resolution of 8 μm pitch for monolithic Micro-LED display
- 2024
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Ingår i: Materials Science in Semiconductor Processing. - 1369-8001. ; 175
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Tidskriftsartikel (refereegranskat)abstract
- Micro-light-emitting diode (Micro-LED) displays have attracted growing attention due to their unsurpassed properties that satisfy the requirements of reality/virtual reality (AR/VR) displays. A crucial procedure of monolithic integration technology in high-density microdisplays is the interconnection process, which is intimately associated with the quality of the display device. Microfluidic electroless interconnection (MELI), an innovative low-temperature and pressure-free chip-stacking approach that eliminates the warpage-induced issues and cracking damage of the chip caused by thermo-compression bonding (TCB), holds great promise as a technology for establishing interconnections between the CMOS driver and Micro-LED. However, the requirement for the consistency of the microbump arrays and the risk of creating bridges is significantly intensified with smaller gaps in stacked chips, which restricts the application range of MELI to high-density interconnects. This paper analyzes the feasibility of further lowering the stand-off height of stacked chips in ultrafine pitch interconnects by optimizing the bump preparation process. The plasma modification time and surfactant concentration during the bump preparation process have been investigated. The result indicated that microbump arrays with a uniformity of less than 3% could be successfully manufactured by employing a 7-min plasma treatment and incorporating optimal surfactants, which catalyzes the implementation of the subsequent vertical interconnection process and eventually enhances yields of Micro-LEDs.
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| 4. |
- Lu, Yu, et al.
(författare)
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Electroless deposition of nickel microbumps for fine-pith flip-chip bonding
- 2024
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Ingår i: Journal of Physics: Conference Series. - 1742-6588 .- 1742-6596. ; 2783:1
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Konferensbidrag (refereegranskat)abstract
- The reliability of micro-light-emitting diode (Micro-LED) is closely associated with the uniformity of microbumps arrays. With continual decreases in pixel pitch in recent years, it is a challenge to guarantee the uniformity of bump arrays. To satisfy current requirements for ultra-high-density interconnections, this study proposes an electroless plating method for fabricating highly uniform nickel microbumps. This technique differs from electroplating, in which the morphology and consistency of microbumps can be easily controlled. Furthermore, it is a high-selectivity and cost-effective method of microbumps fabrication that eliminates solder wastage and avoids metal lift-off in traditional evaporation. To minimize the non-uniformity of the bumps, we aim to optimize the oxygen plasma treatment parameters and deposition intervals to eliminate the issues of skip plating, hydrogen bubble entrapment, and nodules. Under the combined effect of plasma treatment and intermittent deposition method, microbump arrays with less than 5% uniformity were successfully prepared, achieving the demands of high-density bonding. In addition, the preparation process is highly reproducible, extending the application range of this technique.
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| 5. |
- Wang, Shuaishuai, et al.
(författare)
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Fabrication of Super Uniform Nickel Bumps Using Electroless Plating on Micro-LEDs’ TFT Driver Substrates
- 2024
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Ingår i: Digest of Technical Papers - SID International Symposium. - 2168-0159 .- 0097-966X. ; 55:S1, s. 194-196
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Konferensbidrag (refereegranskat)abstract
- In this study, in order to achieve high-yield Micro-LED chip bonding and thus further advance the breakthrough of Micro- LED interconnect technology. In this study, an electroless plating method is used to achieve the highly uniform nickel bump arrays on thin film transistor (TFT) driver substrate. Initially, the photoresists AZ4620 and AZ2070 are chosen for the experiments, which can cover the step structure uniformly of TFT substrate. Subsequently, the morphology of bumps on the TFT substrate influenced by the plasma treatment and the deposition time is investigated. The 1% uniformity of the nickel bump arrays by the electroless plating for 30 minutes after 5-minute plasma treatment is achieved, which lays the foundation for the electroless plating self-bonding.
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