| 1. |
- Du, Hao, et al.
(author)
-
Evolution of microstructure and properties of TiNbCrAlHfN films grown by unipolar and bipolar high-power impulse magnetron co-sputtering: The role of growth temperature and ion bombardment
- 2023
-
In: Surface & Coatings Technology. - : ELSEVIER SCIENCE SA. - 0257-8972 .- 1879-3347. ; 459
-
Journal article (peer-reviewed)abstract
- Growth temperature (Ts) and ion irradiation energy (Ei) are important factors that influence film growth as well as their properties. In this study, we investigate the evolution of crystal structure and residual stress of TiNb-CrAlHfN films under various Ts and Ei conditions, where the latter is mainly controlled by tuning the flux of sputtered Hf ions using bipolar high-power impulse magnetron (BP-HiPIMS). The results show that TiNbCrAlHfN films exhibit the typical FCC NaCl-type structure. By increasing Ts from room temperature to 600 degrees C, the film texture changes from high-surface-energy (111) to low-surface-energy (100) accompanied by a higher crystal-linity in the out-of-plane direction and a more disordered growth tilt angle to the surface plane. In addition, compressive stress decreases with increasing Ts, which is ascribed to changes in the film growth both in the early and post-coalescence stages and more tensile thermal stress at elevated Ts. In contrast, a clear texture transition window is seen under various Ei of Hf+ ions, i.e., high-surface-energy planes change to low-surface-energy planes as Ei exceeds-110 eV, while low-surface-energy planes gradually transform back to high-surface-energy planes when Ei increases from 210 to 260 eV, indicating renucleation events for Ei > 210 eV. Compressive stress in-creases with increasing Ei but is still lower than that of a reference series with DC substrate bias UDC =-100 V. The study shows that it is possible to tailor properties of FCC-structured high-entropy nitrides by varying Ts and Ei in a similar fashion to conventional transition metal nitrides using the approach of unipolar and bipolar HiPIMS co-sputtering.
|
|
