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1.	Hansson, Josef, 1991, et al. (author) Effect of Fiber Concentration on Mechanical and Thermal Properties of a Solder Matrix Fiber Composite Thermal Interface Material 2019 In: IEEE Transactions on Components, Packaging and Manufacturing Technology. - 2156-3985 .- 2156-3950. ; 9:6, s. 1045-1053 Journal article (peer-reviewed)abstract Increased demand on the mechanical and thermal properties on the thermal interface and die attach material creates a demand for materials with tailored material properties. Solder matrix fiber composites (SMFCs) have been shown to address these challenges, but have, so far, required complicated procedures and components. In this paper, we present the fabrication of a new type of SMFC based on commercially available fiber networks infiltrated with Sn-Ag-Cu alloy (SAC305) or indium using equipment for large-volume production. The composite material exhibits similar thermal properties compared to pure solder, and mechanical properties that can be tailored toward specific applications. We also show that the handling properties of the SMFC allows it to be used in process flows where multiple reflow cycles are required and can achieve a well-defined bond line thickness (BLT) and good bonding using fluxless reflow under pressure.

Hansson, Josef, 1991, et al. (author)
Effect of Fiber Concentration on Mechanical and Thermal Properties of a Solder Matrix Fiber Composite Thermal Interface Material
2019
In: IEEE Transactions on Components, Packaging and Manufacturing Technology. - 2156-3985 .- 2156-3950. ; 9:6, s. 1045-1053
Journal article (peer-reviewed)abstract
- Increased demand on the mechanical and thermal properties on the thermal interface and die attach material creates a demand for materials with tailored material properties. Solder matrix fiber composites (SMFCs) have been shown to address these challenges, but have, so far, required complicated procedures and components. In this paper, we present the fabrication of a new type of SMFC based on commercially available fiber networks infiltrated with Sn-Ag-Cu alloy (SAC305) or indium using equipment for large-volume production. The composite material exhibits similar thermal properties compared to pure solder, and mechanical properties that can be tailored toward specific applications. We also show that the handling properties of the SMFC allows it to be used in process flows where multiple reflow cycles are required and can achieve a well-defined bond line thickness (BLT) and good bonding using fluxless reflow under pressure.

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