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  • Fu, Yifeng, 1984, et al. (author)
  • Thick film patterning by lift-off process using double-coated single photoresists
  • 2012
  • In: Materials Letters. - : Elsevier BV. - 1873-4979 .- 0167-577X. ; 76, s. 117-119
  • Journal article (peer-reviewed)abstract
    • A novel method using lift-off process for patterning very thick materials is developed and demonstrated. Unlike conventional lift-off processes, no special lift-off resist is used in this method. Instead, only a double-coated single photoresist is needed. Demonstrations using two commercial photoresists show that good patterning morphology and obvious undercuts as high as 15 mu m are obtained for lift-off, which is very difficult to achieve by existing methods. The application and feasibility of this approach is demonstrated by a carbon nanotube transfer process. This simple and effective method offers wider option to pattern very thick materials in high quality which are in strong demands.
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Type of publication
journal article (1)
Type of content
peer-reviewed (1)
Author/Editor
Liu, Johan, 1960 (1)
Ye, L (1)
Fu, Yifeng, 1984 (1)
University
Chalmers University of Technology (1)
Language
English (1)
Research subject (UKÄ/SCB)
Natural sciences (1)
Year
2012 (1)

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