| 11. |
- Hu, Q.M., et al.
(författare)
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Effect of Zr on the properties of (TiZr)Ni alloys from first-principles calculations
- 2007
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Ingår i: Physical Review B. - 0163-1829. ; 76:22, s. 224201-
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Tidskriftsartikel (refereegranskat)abstract
- The effect of Zr on the martensitic transformation (MT) behavior and mechanical properties of (Ti(0.5-x)Zr(x))Ni(0.5) alloys is investigated by calculating the elastic constants and elastic moduli in the B2 phase as a function of x for 0 <= x <= 0.2. The calculations are performed using the coherent potential approximation implemented within the framework of the exact muffin-tin orbitals method. We find that the theoretical elastic properties correlate well with the behavior of the MT. With increasing Zr concentration, the anisotropy of the alloy decreases, indicating that the nonbasal plane shear on which the modulus C(44) plays an important role, dominates and, therefore, a monoclinic martensitic phase should result. The experimental Zr content dependence of the MT temperature is paralleled with the calculated C(44) versus Zr content. The theoretical elastic moduli demonstrate that the (TiZr)Ni alloys, with Zr distributed randomly on the Ti sublattice, are intrinsically ductile, which suggests that the poor ductility of these alloys may be ascribed to some other factors, for example, impurities, precipitation, and grain boundaries.
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| 12. |
- Niklaus, Frank, et al.
(författare)
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Adhesive wafer bonding
- 2006
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Ingår i: Journal of Applied Physics. - : AIP Publishing. - 0021-8979 .- 1089-7550. ; 99:3
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Forskningsöversikt (refereegranskat)abstract
- Wafer bonding with intermediate polymer adhesives is an important fabrication technique for advanced microelectronic and microelectromechanical systems, such as three-dimensional integrated circuits, advanced packaging, and microfluidics. In adhesive wafer bonding, the polymer adhesive bears the forces involved to hold the surfaces together. The main advantages of adhesive wafer bonding include the insensitivity to surface topography, the low bonding temperatures, the compatibility with standard integrated circuit wafer processing, and the ability to join different types of wafers. Compared to alternative wafer bonding techniques, adhesive wafer bonding is simple, robust, and low cost. This article reviews the state-of-the-art polymer adhesive wafer bonding technologies, materials, and applications.
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| 13. |
- Niklaus, Frank, et al.
(författare)
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Wafer-Level 3D Integration Technology Platforms for ICs and MEMS
- 2005
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Ingår i: TWENTY SECOND INTERNATIONAL VLSI MULTILEVEL INTERCONNECTION (VMIC). ; , s. 486-493
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- Wafer-level three-dimensional (3D) integration is an emerging technology to increase theperformance and functionality of integrated circuits (ICs) and microelectromechanical systems(MEMS). In ICs, wafer-level 3D integration based on wafer bonding offers the potential for a highdensity of micron-sized through-die vias necessary for highest performance memory stacks,microprocessors with large L2 caches and ASICs with large embedded memories. In MEMS devices,wafer-level 3D integration based on wafer bonding offers the potential for integrating highperformance transducer materials such as various monocrystalline semiconductor materials withelectronic circuits for arrayed, highly integrated sensor and actuator components. This invited paperpresents an overview of current wafer-level 3D integration platforms that use wafer bonding withpolymer adhesives for ICs and MEMS applications.
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| 14. |
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| 15. |
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| 16. |
- Zhang, F, et al.
(författare)
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BLX-1002, a novel thiazolidinedione with no PPAR affinity, stimulates AMP-activated protein kinase activity, raises cytosolic Ca2+, and enhances glucose-stimulated insulin secretion in a PI3K-dependent manner
- 2009
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Ingår i: American journal of physiology. Cell physiology. - : American Physiological Society. - 1522-1563 .- 0363-6143. ; 296:2, s. C346-C354
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Tidskriftsartikel (refereegranskat)abstract
- BLX-1002 is a novel small thiazolidinedione with no apparent affinity to peroxisome proliferator-activated receptors (PPAR) that has been shown to reduce glycemia in type 2 diabetes without adipogenic effects. Its precise mechanisms of action, however, remain elusive, and no studies have been done with respect to possible effects of BLX-1002 on pancreatic β-cells. We have investigated the influence of the drug on β-cell function in mouse islets in vitro. BLX-1002 enhanced insulin secretion stimulated by high, but not low or intermediate, glucose concentrations. BLX-1002 also augmented cytoplasmic free Ca2+ concentration ([Ca2+]i) at high glucose, an effect that was abolished by pretreatment with the Ca2+-ATPase inhibitor thapsigargin. In contrast, BLX-1002 did not interfere with voltage-gated Ca2+ channel or ATP-sensitive K+ channel activities. In addition, cellular NAD(P)H stimulated by glucose was not affected by the drug. The stimulatory effect of BLX-1002 on insulin secretion at high glucose was completely abolished by treatment with the phosphatidylinositol 3-kinase (PI3K) inhibitors wortmannin or LY-294002. Stimulation of the β-cells with BLX-1002 also induced activation of AMP-activated protein kinase (AMPK) at high glucose. Our study suggests that BLX-1002 potentiates insulin secretion only at high glucose in β-cells in a PI3K-dependent manner. This effect of BLX-1002 is associated with an increased [Ca2+]i mediated through Ca2+ mobilization, and an enhanced activation of AMPK. The glucose-sensitive stimulatory impact of BLX-1002 on β-cell function may translate into substantial clinical benefits of the drug in the management of type 2 diabetes, by avoidance of hypoglycemia.
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