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Search: WFRF:(Minami M) > (2010-2014)

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  • Kobayashi, M., et al. (author)
  • 3C-SiC MOSFET with High Channel Mobility and CVD Gate Oxide
  • 2011
  • In: Materials Science Forum. - 0255-5476 .- 1662-9752. ; 679-680, s. 645-648
  • Journal article (peer-reviewed)abstract
    • 3C-SiC MOSFET with 200 cm2/Vs channel mobility was fabricated. High performance device processes were adopted, including room temperature implantation with resist mask, polysilicon-metal gates, aluminium interconnects with titanium and titanium nitride and a specially developed activation anneal at 1600°C in Ar to get a smooth 3C-SiC surface and hence the expected high channel mobility. CVD deposited oxide with post oxidation annealing was investigated to reduce unwanted oxide charges and hence to get a better gate oxide integrity compared to thermally grown oxides. 3C-SiC MOSFETs with 600 V blocking voltage and 10 A drain current were fabricated using the improved processes described above. The MOSFETs assembled with TO-220 PKG indicated specific on-resistances of 5 to 7 mΩcm2.
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  • Result 11-14 of 14

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