Mechanical properties of liquid-phase-bonded copper-ceramic substrates.

• Liquid-phase bonding of copper foils to ceramic substrates is a very attractive technique for the fabrication of metallized substrates for hybrid power electronics applications. The design and reliability considerations of such substrates necessitate the knowledge of their mechanical properties. Therefore, stresses and strains in the copper and in the ceramic of bonded substrates were investigated. Theoretical calculations are presented to support the experimental results.

Ämnesord

TEKNIK OCH TEKNOLOGIER  -- Materialteknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Materials Engineering (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Maskinteknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Mechanical Engineering (hsv//eng)

Nyckelord

CERAMIC MATERIALS - Bonding

PRINTED CIRCUITS

Materials science

Teknisk materialvetenskap

Engineering mechanics

Teknisk mekanik

Publikations- och innehållstyp

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