On-chip tensile testing of the mechanical and electro-mechanical properties of nano-scale silicon free-standing beams

• A simple and versatile on-chip tensile testing method is proposed for the statistical evaluation of size effects on the mechanical strength of silicon thin films along with the simultaneous study of (from low to ultra) strain effects on the carrier transport. Mechanical results are presented on the fracture strength of micro-nano scale silicon beams, followed with a discussion on interface states and problems facing reliable nano-electronic and nano-electromechanical characterizations

Subject headings

NATURVETENSKAP  -- Fysik (hsv//swe)

NATURAL SCIENCES  -- Physical Sciences (hsv//eng)

Keyword

Thin film testing

Fracture strength of silicon

Silicon nanowires

Piezoresistivity

Mechanical and electro-mechanical properties of silicon

Surface states

Environmental impact on measurement

On-chip tensile testing

MEMS/NEMS

Nano-mechanical testing

Fracture

Publication and Content Type

art (subject category)

ref (subject category)