CMOS-integrated Si/SiGe quantum-well infrared microbolometer focal plane arrays manufactured with very large-scale heterogeneous 3-d integration

• We demonstrate infrared focal plane arrays utilizing monocrystalline silicon/silicon-germanium (Si/SiGe) quantum-well microbolometers that are heterogeneously integrated on top of CMOS-based electronic read-out integrated circuit substrates. The microbolometers are designed to detect light in the long wavelength infrared (LWIR) range from 8 to 14 μm and are arranged in focal plane arrays consisting of 384 × 288 microbolometer pixels with a pixel pitch of 25 μm × 25 μm. Focal plane arrays with two different microbolometer designs have been implemented. The first is a conventional single-layer microbolometer design and the second is an umbrella design in which the microbolometer legs are placed underneath the microbolometer membrane to achieve an improved pixel fill-factor. The infrared focal plane arrays are vacuum packaged using a CMOS compatible wafer bonding and sealing process. The demonstrated heterogeneous 3-D integration and packaging processes are implemented at wafer-level and enable independent optimization of the CMOS-based integrated circuits and the microbolometer materials. All manufacturing is done using standard semiconductor and MEMS processes, thus offering a generic approach for integrating CMOS-electronics with complex miniaturized transducer elements

Ämnesord

NATURVETENSKAP  -- Fysik -- Annan fysik (hsv//swe)

NATURAL SCIENCES  -- Physical Sciences -- Other Physics Topics (hsv//eng)

Nyckelord

Long-wavelength infrared imaging

LWIR

MEMS

Si/SiGe quantum-wells

wafer-level vacuum packaging

thermal imaging

uncooled microbolometer

very large-scale heterogeneous 3-D integration

Bolometers

Chip scale packages

CMOS integrated circuits

Focal plane arrays

Focusing

Infrared detectors

Infrared devices

Infrared imaging

Infrared radiation

Integrated circuit design

Monocrystalline silicon

Pixels

Semiconductor quantum wells

Silicon wafers

Substrates

Temperature sensors

Thermography (imaging)

Three dimensional integrated circuits

VLSI circuits

Wafer bonding

3-D integration

Long-wavelength infrared

Uncooled microbolometers

Wafer level vacuum packaging

MOEMS

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