| 1. |
- Jiang, Di, 1983, et al.
(författare)
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Carbon Nanotubes in Electronics Interconnect Applications with a Focus on 3D-TSV Technology
- 2012
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Ingår i: ECS Transactions. - : The Electrochemical Society. - 1938-5862 .- 1938-6737. - 9781607683186 ; 44:1, s. 683-692
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Konferensbidrag (refereegranskat)abstract
- High density electronics integration at the system level, supported by advanced packaging solutions, is expected to be the main driving force for the future shrinking of electronics. One recent focus in the field of electronics packaging is the use of through-silicon-via (TSV) to form three-dimensional (3D) integration. A central task in developing 3D-TSV integration is to build reliable and efficient electrical interconnects for signal transfer and power distribution among the stacked layers. Carbon nanotubes (CNTs) are supposed to be a promising material to build future interconnects due to their many attractive electrical and mechanical properties. This paper reviews the state-of-art in CNT integration technology, with a focus on the 3D-TSV interconnect. The simplicity and manufacturability of fabricating and stacking CNT TSVs presented in this paper indicate a great application potential of CNTs as an interconnection material in future 3D integrated electronics.
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| 2. |
- Zhang, Zhfei, et al.
(författare)
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Characterization of CNT Enhanced Conductive Adhesives in Terms of Thermal Conductivity
- 2012
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Ingår i: ECS Transactions. - : The Electrochemical Society. - 1938-5862 .- 1938-6737. - 9781607683186 ; 44:1, s. 1011-1017
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Konferensbidrag (refereegranskat)abstract
- CNTs have excellent thermal, electrical and mechanical properties. They can be used in various ways. One researched field of application is CNT-polymer composites which combine common technologies with advanced materials. This paper will focus on the thermal property of CNT-Ag-filled adhesives and compares the new materials with conventional, electrical Ag-filled conductive adhesives. Several analytical methods, FTIR, Raman analysis, SEM and TEM have been carried out to examine the different surface conditions after physicval and chemical modification of CNTs. The thermal conductivities of composites containing different types of CNTs were investigated. The incorporation of CNTs into polymers resulted in enhancement of the thermal conductivity compared to Ag-filler. The increase of thermal conductivity with addition of CNT filler is obvious, especially for the purified CNT. The value of thermal conductivity is about two times higher than the Ag-filled conductive adhesive. However, improvement on thermal conductivity of the surface modified CNT-filled conductive adhesives is not so obvious. Since the thermal conduction in CNT is by phonon transfer, the nanometric size and the huge interface lead to strong phonon-scattering at the interface. Thus, a relatively low interfacial area, weak interfacial adhesion promotes the conduction of phonons and minimizes coupling losses. According to this, the non-treated MWCNTs seem to have the highest potential to improve the thermal conductivity of epoxies.
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| 3. |
- Alnegren, Patrik, 1988, et al.
(författare)
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Degradation of Ferritic steel interconnects in SOEC environments
- 2013
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Ingår i: ECS Transactions. - : The Electrochemical Society. - 1938-5862 .- 1938-6737. ; 57:1, s. 2261-2270
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Konferensbidrag (refereegranskat)abstract
- This study investigates the corrosion performance of selected ferritic steels in simulated solid oxide electrolysis cell (SOEC) environments for exposure times up 500 h. Ferritic steels have many properties that are desirable for interconnects but suffer from oxidation and chromium evaporation over time. Four different FeCr alloys have been exposed in different concentrations of dry O2 (anode side) and in 34 % H2O -3 % H2-Ar (cathode side) at 850 °C and gravimetrical measurements have been performed to study oxidation rates. Chromium evaporation has been measured and compared for the oxygen containing environments. Chromium evaporation was found to vary largely with oxygen partial pressure, while the oxidation rate of the steels did not vary substantially in the different oxygen partial pressures. Differences in oxidation behavior of the steels were observed between the exposures in dry O2 and in 34 % H2O -3 % H2 -Ar. Both reduced and increased oxidation rates were observed in the cathode side atmosphere compared to the oxygen side atmosphere for different materials.
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| 4. |
- Andersson, Martin, et al.
(författare)
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Analysis of Microscopic Anode Structure Effects on an Anode-Supported SOFC Including Knudsen Diffusion
- 2011
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Ingår i: SOFC12. - : The Electrochemical Society. ; 35, s. 1799-1809
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Konferensbidrag (refereegranskat)abstract
- In this study a two dimensional CFD (COMSOL Multiphysics) is employed to study the effect of anode microscopic structures on the transport phenomena and reactions for an anode-supported solid oxide fuel cell (SOFC). FCs can be considered as energy devices, involving multiple processes, such as (electro-) chemical reactions, heat exchange, gas- and ionic transport. All these complex processes are strongly integrated, needing modeling as an important tool to understand the couplings between mass-, heat-, momentum transport and chemical reactions. For the porous material, the Knudsen diffusion is taken into account in this study. The chemical- and electrochemical reaction rates depend on temperature, material structure, catalytic activity, degradation and partial pressure among others. It is found that the anode thickness and also the anode pore size need to be optimized to achieve high cell efficiency, when the Knudsen diffusion effects are included.
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| 5. |
- Andersson, Martin, et al.
(författare)
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Three-Dimensional Design Optimization Of An Anode-Supported SOFC Using FEM
- 2013
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Ingår i: ECS Transactions. - : The Electrochemical Society. - 1938-5862 .- 1938-6737. ; 57:1, s. 2485-2494
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Konferensbidrag (refereegranskat)abstract
- Abstract in UndeterminedSolid oxide fuel cells (SOFCs) are promising as energy producing devices, which at this stage of development will require extensive analysis and benefit from numerical modeling. A 3D model is developed based on the FEM for a single cell planar SOFC design optimization. Ion, electron, heat, gas-phase species and momentum transport equations are implemented and coupled to the kinetics of electrochemical reactions. High current density spots are identified, where the electron transport distance is short and the oxygen concentration is high. The relatively thin cathode results in a significant oxygen mole fraction gradient in the direction normal to the main flow direction. The electron transport especially within the cathode is found to be limiting for the electrochemical reactions at positions far from the channel walls (interconnect ribs). It is concluded that an increased pore size in the cathode support layer increases the current density more than an increased pore size in the anode support layer.
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| 6. |
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| 7. |
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| 8. |
- Bengtsson, Stefan, 1961
(författare)
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Wafer bonding: A retrospective
- 2010
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Ingår i: ECS Transactions. - : The Electrochemical Society. - 1938-5862 .- 1938-6737. - 9781566778237 ; 33:4, s. 429-439
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Konferensbidrag (refereegranskat)abstract
- Wafer bonding has become well-known and widely used as the process of adhesion of two flat mirror-polished wafers without the use of any intermediate adhesive layer. Today, it is used as a versatile tool in a wide variety of scientific fields and the technique has reach industrial maturity in particular for the manufacturing of Silicon-On-Insulator (SOI) materials, but also in other fields, such as for sensors, microsystems, optics and photonics. The early development of wafer bonding is reviewed and a retrospective view is taken on wafer bonding, addressing some of the critical research achievements and breakthroughs over the last three decades. The focus is limited to wafer bonding without the use of adhesive layers or electrostatic fields, and will hence not discuss related techniques, such as anodic bonding.
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| 9. |
- Bexell, Ulf, et al.
(författare)
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High temperature oxidation of plastically deformed ferritic interconnect steel
- 2011
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Ingår i: ECS Transactions. - Pennington : The Electrochemical Society. - 1938-5862 .- 1938-6737. ; 35:1, s. 2463-2470
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Tidskriftsartikel (refereegranskat)abstract
- In this study, thin sheets of a 22% Cr ferritic steel, Sandvik Sanergy HT has been coated with a thin metallic cobalt film. Samples of the coated steel sheet were exposed to two different forming experiments simulating different aspects of sheet metal forming and post high temperature oxidation. The results show that the metallic cobalt film cracks when the steel sheet is subjected to biaxial straining but that the cracks heal at high temperature. Material subjected to modified scratch testing i.e. simulating the contact between sheet metal and forming tool will oxidize in the same manner as non-scratched material. Also, from high temperature corrosion point of view there is no difference between materials formed under lubricated or dry conditions when oxidized. However, from a tribological point of view a lubricated contact situation is preferred.
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| 10. |
- Blennow, P., et al.
(författare)
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Investigation of Cu-based infiltration coatings for metal-supported SOFC
- 2013
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Ingår i: ECS Transactions. - : The Electrochemical Society. - 1938-5862 .- 1938-6737. ; 57:1, s. 771-780
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Konferensbidrag (refereegranskat)abstract
- Metal-supported solid oxide fuel cells are candidates for the next generation of SOFCs. However, the cell design with an FeCr/YSZ-based anode backbone suffers from corrosion when the cells are run at high fuel utilization, which limits the long term durability. In this work, new infiltration coatings based on Cu in combination with Ni:Ce0.8Gd0.2O 1.9 (Ni:CGO) have been studied. The candidates for a corrosion resistant coating should limit the formation of Cr2O3 on the surface of FeCr particles. Promising fuel cell performance with an ASR of 0.5 Ωcm2 was obtained at 650 °C with H2 as fuel. However, various analysis techniques showed no improved corrosion resistance with the addition of a Cu coating.
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