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- Johansson, Jonas, 1972-, et al.
(författare)
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Thermal analysis of an electronic module with a double-sided PCB housed in a 2-MCU enclosure for avionic applications
- 2004
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Ingår i: 37th International Symposium on Microelectronics (IMAPS 2004): Everything in Electronics...Between the Chip and the System!. - : Curran Associates, Inc.. - 9781604234626 ; , s. 747-755
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Konferensbidrag (refereegranskat)abstract
- Thermal analysis of an electronic module housed in a 2 Modular Concept Unit (MCU, ARINC 600 standard) enclosure used in a helicopter application has been performed by means of computational fluid dynamics (CFD). The case temperature of surface-mounted components on a folly populated multi-layer double sided PCB has been evaluated for total power levels ranging from 12 W to 60 W. A simulation procedure has been proposed in order to evaluate the maximum cooling effect of power re-distribution between the PCB sides at different total power levels and for different PCB configurations, given thermal constraints for the case temperature of surface-mounted componellls. As a result, thermal design guidelines for electronic modules with double-sided PCBs have been developed regarding preferable power distribution between the sides of the PCB.
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