| 1. |
- Huiberts, JN, et al.
(författare)
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Synthesis of yttriumtrihydride films for ex-situ measurements
- 1996
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Ingår i: JOURNAL OF ALLOYS AND COMPOUNDS. - : ELSEVIER SCIENCE SA LAUSANNE. - 0925-8388. ; 239:2, s. 158-171
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Tidskriftsartikel (övrigt vetenskapligt/konstnärligt)abstract
- A new method has been developed to synthesize compact yttriumtrihydride by making use of a thin film technique. For electrical measurements yttrium films of typically 500 nm thickness are covered under UHV conditions by a 5 nm thick palladium overlayer wh
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| 2. |
- Cho, Choong-Rae, et al.
(författare)
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Preparation of Na0.5K0.5NbO3/La0.6Sr0.2Mn1.2O3/LaAlO3 Thin Film Structures by Pulsed Laser Deposition
- 1999
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Ingår i: Multicomponent oxide films for electronics. - Warrendale, Pa : Materials Research Society. - 1558994815 - 9781558994812 ; , s. 249-254
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Konferensbidrag (refereegranskat)abstract
- We report on ferroelectric/giant magnetoresistive Nao.sKo.sNbCVLao.oSrojMniO} (NKN/LSMO) heterostructures gro\vn onto LaAlOj (001) single crystal using KrF pulsed laser ablation of stoichiometric ceramic target. Main processing parameters have been optimized to obtain smooth LSMO template layer, avoid NKN-LSMO interdiffusion, preserve NKN stoichiometry against the lost of volatile potassium and sodium and achieve reasonable reliability of NKN film performance. X-ray diffraction 0- 20 scans and rocking curves evidence for single-phase content and high c-axis orientation both in template LSMO and top NKN layers. Ferroelectric measurements yield remnant polarization P, of 1.5 (.iC/cm2 and spontaneous polarization Ps of 7 jiC/cm2 at electric field strength of 130 kV/cm. At room temperature, dielectric permittivity e' and dissipation factor tancJhave been found to vary from 595 to 555 and 0.046 to 0.029 respectively in the frequency range of 0.4 to 20 kHz. At 10 kHz dielectric permittivity linearly increases from 410 to 650 in the temperature range 77 K to 415 K while the dissipation factor below 320 K does not exceed 3%.
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| 3. |
- Hong, J., et al.
(författare)
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Plasma chemistries for high density plasma etching of SiC
- 1999
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Ingår i: Journal of Electronic Materials. - Charlottesville, VA, USA. - 0361-5235 .- 1543-186X. ; 28:3, s. 196-201
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Tidskriftsartikel (refereegranskat)abstract
- A variety of different plasma chemistries, including SF6, Cl2, ICI, and IBr, have been examined for dry etching of 6H-SiC in high ion density plasma tools (inductively coupled plasma and electron cyclotron resonance). Rates up to 4500 angstroms·min-1 were obtained for SF6 plasmas, while much lower rates (≀800 angstroms·min-1) were achieved with Cl2, ICI, and IBr. The F2-based chemistries have poor selectivity for SiC over photoresist masks (typically 0.4-0.5), but Ni masks are more robust, and allow etch depths ≥10 Όm in the SiC. A micromachining process (sequential etch/deposition steps) designed for Si produces relatively low etch rates (<2,000 angstroms·min-1) for SiC.
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| 4. |
- Leerungnawarat, P., et al.
(författare)
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Via-hole etching for SiC
- 1999
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Ingår i: Journal of Vacuum Science & Technology B. - : American Vacuum Society. - 1071-1023 .- 1520-8567. ; 17, s. 2050-2054
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Tidskriftsartikel (refereegranskat)abstract
- Four different F2-based plasma chemistries for high-rate etching of SiC under inductively coupled plasma (ICP) conditions were examined. Much higher rates (up to 8000 #x2009; #xc5; #x2009;min-1) were achieved with NF3 and SF6 compared with BF3 and PF5, in good correlation with their bond energies and their dissociation efficiency in the ICP source. Three different materials (Al, Ni, and indium #x2013;tin oxide) were compared as possible masks during deep SiC etching for through-wafer via holes. Al appears to produce the best etch resistance, particularly when O2 is added to the plasma chemistry. With the correct choice of plasma chemistry and mask material, ICP etching appears to be capable of producing via holes in SiC substrates. #xa9; 1999 American Vacuum Society.
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