| 1. |
- Ebefors, Thorbjörn, et al.
(author)
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Through-Silicon Vias and 3D Inductors for RF Applications
- 2014
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In: Microwave journal (International ed.). - 0192-6225. ; 57:2, s. 80-
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Journal article (peer-reviewed)abstract
- To cope with an increasing number of frequency bands and advanced mobile phone standards supporting high data rates, current and future wireless communication systems must satisfy stringent performance expectations while simultaneously being more energy-efficient and having lower operating costs. One major limitation of today's mobile phones is poor impedance matching of the antenna to the RF front end section resulting in poor antenna efficiency. This is exacerbated by current trends toward higher miniaturization and integration, presenting ever increasing challenges in the design of complex RF systems and the management of RF interaction on signal lines. By introducing tunable RF elements, the overall system architecture can be simplified, leading to significant cost reductions and performance optimization.
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| 2. |
- Shah, Umer, et al.
(author)
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Permeability Enhancement by Multilayer Ferromagnetic Composites for Magnetic-Core On-Chip Inductors
- 2014
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In: IEEE Microwave and Wireless Components Letters. - : IEEE Press. - 1531-1309 .- 1558-1764. ; 24:10, s. 677-679
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Journal article (peer-reviewed)abstract
- This letter reports about unpatterned ferromagnetic NiFe/AlN multilayer composites used as advanced magnetic core materials for on-chip and interposer integrated inductances. The proposed composite structure reduces RF induced currents and thus pushes the permeability cutoff to beyond 3.7 GHz, which is by a factor of 7.1 higher than for homogeneous NiFe layers of same thickness. To the best knowledge of the authors, we achieve the highest effective relative permeability of 28 at 1 GHz, highest ferromagnetic resonance frequency and highest inductance enhancement factor above 1 GHz ever reported for devices based on on-chip unpatterned NiFe magnetic cores. A single loop inductor is also implemented as a technology demonstrator, achieving an inductance enhancement of 4.8 and a quality factor enhancement of 4.5 at 400 MHz.
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