| 1. |
|
|
| 2. |
- Fan, Jing-yu, 1972, et al.
(författare)
-
Large-eddy simulation of three-dimensional vortical structures for an impinging transverse jet in the near region
- 2007
-
Ingår i: Shuidonglixue Yanjiu yu Jinzhan / Journal of Hydrodynamics Ser. A. - : Springer Science and Business Media LLC. - 1000-4874. ; 19:3, s. 314-321
-
Tidskriftsartikel (refereegranskat)abstract
- The three-dimensional vortical structures for an impinging transverse jet in the near region were numerically investigated by means of Large-Eddy Simulation (LES). The LES results reproduced the skewed jet shear layer vortices close to the jet nozzle and the scarf vortex in the near-wall zone, in good agreement with the experimental observations. Different vortical modes in the skewed jet shear layer close to the jet nozzle were identified depending upon the velocity ratio between jet and crossflow, namely changing from an approximately axisymmetric mode to a helical one with the velocity ratios varying from 20 to 8. Moreover, the scarf vortex wrapped around the impinging jet in the near-wall zone showed distinct asymmetry with regard to its bilateral spiral legs within the near region. And the entrainment of the ambient crossflow fluids by the scarf vortex in the near-wall zone was appreciably influenced by its asymmetry and in a large part occurred on the surface of the spiral roller structures in the course of spreading downstream.
|
|
| 3. |
|
|
| 4. |
- Yue, Cong, et al.
(författare)
-
Numerical Investigation on the Effect of Filler Distribution on Effective Thermal Conductivity of Thermal Interface Material
- 2008
-
Ingår i: 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 2008. - 9781424427406 ; , s. C1-10
-
Konferensbidrag (refereegranskat)abstract
- Thermal interface materials have been widely adopted in the thermal management for electronics system. Most of the thermal interface materials are made of polymers with thermally conductive particles distributed inside to enhance the thermal conductivity. Thus it is essential to figure out the effective thermal conductivity of this composite material. In the present paper, a parameterized cubic cell model had been developed and implemented by the finite element method. The numerical simulations were carried out to investigate the effect of the filler distributions on the effective thermal conductivity of the thermal interface materials. The volume percentage loadings of the particles ranging from 13% to 74% had been considered, and different particle distribution patterns had also been analyzed. The simulation results were compared with the experimental data as well as other models. A fairly good agreement was obtained for the particle volume percentage loading under consideration, which verified the developed cubic cell model.
|
|
| 5. |
|
|
| 6. |
- Zhang, Yan, 1976, et al.
(författare)
-
Homogenization Model Based on Micropolar Theory for the Interconnection Layer in Microsystem Packaging
- 2006
-
Ingår i: Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06). - 1424404886 ; , s. 166-170
-
Konferensbidrag (refereegranskat)abstract
- The increase in microsystem packaging density sets the requiement for component sizes in the system to become smaller and smaller. The scale decrease makes the analysis more complicated as the corresponding resolution should be improved to a great extent. Interconnection in the system is a typical interface structure that widely appear in the packaing system, in which periodic microstructures may be included inside. A homogenization model is developed in this paper, which focuses on the interface behavior. The interface model based on micropolar theory provides a natural way to include the characteristic scale that can reflect the size effect of the considered structure. Computations are carried out as the numerical example of the model, and comparisons of this model with those of the convertional method show its validity and efficiency.
|
|
| 7. |
|
|
| 8. |
|
|
| 9. |
|
|
| 10. |
|
|
