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Träfflista för sökning "WFRF:(Frohlich H) srt2:(2005-2009)"

Sökning: WFRF:(Frohlich H) > (2005-2009)

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1.
  • Uhlig, Steffen, et al. (författare)
  • Polymer optical interconnects - A scalable large-area panel processing approach
  • 2006
  • Ingår i: IEEE Transactions on Advanced Packaging. - 1521-3323 .- 1557-9980. ; 29:1, s. 158-170
  • Tidskriftsartikel (refereegranskat)abstract
    • A flexible approach to producing optical interconnects on 609.6 * 609.6 mm large-area panels is demonstrated. Stepwise projection patterning from 101.6 * 101.6 mm masks has generated optical waveguide patterns over the whole panel using large-area projection lithography equipment. The waveguide routing design allows optical waveguides on different 101.6 * 101.6 mm tiles to be interconnected. Four different waveguide connecting geometries in the border region between tiles have been fabricated and tested. Multimode waveguides from inorganic-organic hybrid polymers (ORMOCER) (cross section: = 50 µm * 10 µm) with refractive index step between core and cladding ?n = 0.01 were produced. The index step was adjusted by mixing two diffrent ORMOCER systems. The materials show good adhesion to numerous substrates, such as glass and silicon. Application concepts such as flexible manufacturing of optoelectrical hybrid backplanes with two-dimensional interconnect, a three-dimensional optical interconnect with optical vias, and a hybrid backplane with the optical interconnect in a strip-format on a separate plane right above the electrical plane are proposed. Promising new technologies are presented along with preliminary demonstrativ viability. © 2006 IEEE.
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2.
  • Uhlig, Steffen, et al. (författare)
  • Preventing of dewetting effects for inorganic-organic hybrid polymers applied in sequentially buildup (SBU) technology without surface pretreatments
  • 2006
  • Ingår i: IEEE transactions on electronics packaging manufacturing (Print). - 1521-334X .- 1558-0822. ; 29:4, s. 297-307
  • Tidskriftsartikel (refereegranskat)abstract
    • Upon processing waveguide structures by using the ORMOCER materials ORMOCORE as core material, and a mixture of ORMOCORE and ORMOCER-III (refractive index tuning agent) as cladding material, dewetting effects of the core layer from the cladding layer were observed. A similar phenomenon was observed for a mixture of ORMOCORE and ORMOCLAD which was used as comparative refractive index tuning material. In order to use these material combinations for large-area panel (LAP) processing, a pretreatment or activation of surfaces is necessary but hard to realize. However, the addition of small amounts of ORMOCER-III or ORMOCLAD, respectively, to the core layer material, prevented the dewetting phenomenon. The objective of this, however, is to minimize the content of refractive index tuning agent in the core layer by retaining a good wetting behavior during multilayer processing. Wet film stability tests and contact angle measurements of these ORMOCER systems in various compositions on another ORMOCER surface of a specific cladding material composition were performed on a hotplate. Furthermore, contact angles of droplets formed by deionized water, formamide, and di-iodomethane on cured surfaces of these ORMOCER systems in a wide range of compositions were characterized, and surface tensions were calculated. By adding 0.1 wt% of ORMOCER-III or 5 wt% ORMOCLAD, respectively, to the pure ORMOCORE solution, the dewetting phenomenon was eliminated, while simultaneously the refractive index was affected only to a minor degree and no changes in the optical loss could be detected. It was shown that by adding ORMOCER-III or ORMOCLAD to pure ORMOCORE, the surface tension of the compound system was reduced. In comparison to silanization or gasplasma treatment to overcome dewetting effects in microelectronics multilayer processing, the investigated mixing method eliminates process steps and thus costs, and opens new process routes for LAP processing. © 2006 IEEE.
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