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Träfflista för sökning "WFRF:(Hsu C.) srt2:(2005-2009)"

Sökning: WFRF:(Hsu C.) > (2005-2009)

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1.
  • Acciari, V. A., et al. (författare)
  • Radio Imaging of the Very-High-Energy gamma-Ray Emission Region in the Central Engine of a Radio Galaxy
  • 2009
  • Ingår i: Science. - : American Association for the Advancement of Science (AAAS). - 0036-8075 .- 1095-9203. ; 325:5939, s. 444-448
  • Tidskriftsartikel (refereegranskat)abstract
    • The accretion of matter onto a massive black hole is believed to feed the relativistic plasma jets found in many active galactic nuclei (AGN). Although some AGN accelerate particles to energies exceeding 10(12) electron volts and are bright sources of very-high-energy (VHE) gamma-ray emission, it is not yet known where the VHE emission originates. Here we report on radio and VHE observations of the radio galaxy Messier 87, revealing a period of extremely strong VHE gamma-ray flares accompanied by a strong increase of the radio flux from its nucleus. These results imply that charged particles are accelerated to very high energies in the immediate vicinity of the black hole.
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2.
  • Hsiao, C.L., et al. (författare)
  • High-phase-purity zinc-blende InN on r -plane sapphire substrate with controlled nitridation pretreatment
  • 2008
  • Ingår i: Applied Physics Letters. - : AIP Publishing. - 0003-6951 .- 1077-3118. ; 92:11
  • Tidskriftsartikel (refereegranskat)abstract
    • High-phase-purity zinc-blende (zb) InN thin film has been grown by plasma-assisted molecular-beam epitaxy on r -plane sapphire substrate pretreated with nitridation. X-ray diffraction analysis shows that the phase of the InN films changes from wurtzite (w) InN to a mixture of w-InN and zb-InN, to zb-InN with increasing nitridation time. High-resolution transmission electron microscopy reveals an ultrathin crystallized interlayer produced by substrate nitridation, which plays an important role in controlling the InN phase. Photoluminescence emission of zb-InN measured at 20 K shows a peak at a very low energy, 0.636 eV, and an absorption edge at ∼0.62 eV is observed at 2 K, which is the lowest bandgap reported to date among the III-nitride semiconductors. © 2008 American Institute of Physics.
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  • Hsu, Li-Han, 1981, et al. (författare)
  • Fabrication process and 110 GHz measurement result of MS-to-CPW RF-via transition for RF-MEMS devices packaging applications
  • 2009
  • Ingår i: 2009 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2009. - 9781893580138
  • Konferensbidrag (refereegranskat)abstract
    • This paper presents the fabrication process of RF-via (0-level) and flip-chip bump (1-level) transitions for applications of packaging MS (microstrip) RF-MEMS devices. The interconnect structure with MS-to-CPW transition between GaAs MEMS substrate and Al2O3 motherboard was in-house fabricated. A novel fabrication process for RF-MEMS packaging is in detail. After fabrication, the samples were measured up to 110 GHz using on-wafer probing measurement. From the measured results, the insertion loss of entire interconnect structure is better than -2 dB up to 100 GHz, documenting the feasibility for millimeter-wave RF-MEMS devices packaging applications.
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9.
  • Tengstedt, Carl, 1974-, et al. (författare)
  • Study and comparison of conducting polymer hole injection layers in light emitting devices
  • 2005
  • Ingår i: Organic electronics. - : Elsevier BV. - 1566-1199 .- 1878-5530. ; 6:1, s. 21-33
  • Tidskriftsartikel (refereegranskat)abstract
    • A set of polyaniline- and poly(3,4-ethylene dioxythiophene)-based materials were studied as hole injection layers in polymer light emitting devices. The choice of polymeric counterion/dopant poly(styrenesulfonic acid), and poly(acrylamido-2-methyl-1-propanesulfonic acid), and poly(acrylamide) blended with polyaniline/poly(acrylamido-2-methyl-1-propanesulfonic acid) was found to influence both work function and film morphology, which in turn affects device performance. The work functions of the polymer films spanned the range of over 1 eV and the surface region of the films were found to be low in conducting polymer content compared to the bulk. This was particularly the case of the polyaniline/poly(acrylamido-2-methyl-1-propanesulfonic acid) blended with poly(acrylamide) which showed device efficiency equal to that of the poly(3,4-ethylene dioxythiophene)–poly(styrenesulfonic acid) reference. The turn on voltage, however, was significantly larger, likely due to the insulating poly(acrylamide)-rich surface region of the polyaniline/poly(acrylamido-2-methyl-1-propanesulfonic acid)/poly(acrylamide) film. The polymer blend of polyaniline/poly(styrenesulfonic acid) yielded the highest work function (5.5 ± 0.1 eV).
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10.
  • Wu, W.-C., et al. (författare)
  • 60 GHz Broadband MS-to-CPW Hot-Via Flip Chip Interconnects
  • 2007
  • Ingår i: Microwave and Wireless Components Letters, IEEE. ; 17:11, Nov. 2007, s. 784-786
  • Tidskriftsartikel (refereegranskat)abstract
    • In this letter, the microstrip-to-coplanar waveguide(MS-to-CPW) hot-via flip chip interconnect has been experimentallydemonstrated to have broadband performance from dc to67 GHz. The interconnect structures with the hot-via transitions were first designed and optimized by using the electromagnetic simulation tool. Three types of designs were investigated in this letter. The interconnect structures were then fabricated and radio frequency (RF) tested up to 67 GHz. The optimized interconnectstructure with the compensation design demonstrated excellent RFcharacteristics with the insertion loss less than 0.5 dB and the returnloss below 18 dB over a very broad bandwidth from dc to67 GHz. This is to our
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  • Resultat 1-10 av 24

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