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- Jensen, Jens A. D.
(författare)
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Engineering of metal microstructures : process-microstructure-property relationships for electrodeposits
- 2002
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Doktorsavhandling (övrigt vetenskapligt/konstnärligt)abstract
- The relationships between growth-conditions, topography and microstructure, and physical properties of electrochemically deposited copper, nickel and zinc-iron alloys were studied. Growth was investigated while systematically varying process parameters such as electrolyte chemistry, type and concentration of additives, current density, and mass transport. The grown films were analysed by a variety of characterisation techniques - including optical light microscopy, electron microscopy, atomic force microscopy, X-ray diffraction, thin film tensile testing, and nanoindentation.Studies of anomalous Zn-Fe alloy electrodeposition from a chloride-based electrolyte, suggest that a zinc-chloro-hydroxy-precipitate layer forms close to the cathode during deposition. Deposition current density, as well as the chloride-content of the electrolyte, controls the stability of the corresponding boundary layer at the cathode and hereby the composition of the deposited Zn-Fe alloy. Alloys with Fe-contents ranging from 5-80 wt-% were deposited from the same electrolyte, characterised by a sharp change in deposit-composition with electrochemical current density, which made the deposition of well-defined Zn-Fe compositionally modulated alloys (CMA) possible.Ni membranes were deposited from a Watts type electrolyte with or without the sulphur-containing additive sodium-saccharin. This additive caused a strong levelling as well as a grain refining effect on Ni-deposits. However, additional microstructural defects were introduced in the deposits with the use of sodium-saccharin, which led to embrittlement of the deposits. By using ultrasonic streaming near the cathode during electrodeposition in the Watts type electrolyte, improved material distribution in machined 3-dimensional groove geometries was observed.Electrochemical deposition of buried contacts for high efficiency silicon photovoltaic cells led to the development of a patented process for superconformal Cu-filling of high aspect ratio vias, while further studies on electrochemical Cu-deposition from acidic electrolytes led to the formulation of a 3-dimensional zone-structure diagram for electrodeposited Cu.
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- Jensen, Jens
(författare)
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On-line vectorcardiography during coronary angioplasty and unstable coronary artery disease
- 2000
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Doktorsavhandling (övrigt vetenskapligt/konstnärligt)abstract
- This thesis evaluates the usefulness of continuous vectorcardiography (VCG) in patients undergoing elective coronary angioplasty and in patients with unstable coronary artery disease (CAD), for detection and quantitation of myocardial ischemia and for identification of patients at risk of coronary events. The aims were to investigate, whether continuous on-line VCG: 1. gives independent prognostic information regarding death, myocardial infarction (MI) and revascularization, in patients with unstable CAD; 2. during elective angioplasty may identify procedure-related MI; 3. during elective angioplasty gives independent prognostic information as regards repeat revascularization; 4. during elective angioplasty, is different in men and women; and 5. during elective angioplasty, relates to systolic and diastolic myocardial velocities determined by tissue Doppler echocardiography. One hundred and fifty patients (age 69±10, 93 men), with unstable CAD, were studied with online VCG recordings for 24 hours. All patients were followed-up while in hospital and 5 to 6 months after discharge. VCG monitoring was performed during elective and initially angiographically successful angioplasty in 192 consecutive patients (age 58±10, 144 men). All patients underwent cardiac enzyme determination before and after the procedure. A 6-month follow-up was obtained. In another 15 patients (age 61±9, 12 men), treated with elective angioplasty, tissue Doppler echocardiography was performed before and at the end of each balloon inflation. The main findings in the different substudies are: 1. VCG monitoring in patients with unstable CAD identifies patients with increased risk of death as well as combined cardiac events. ST Change Vector Magnitude (STC-VM) seems to be the best predictor. The number of STC-VM episodes, with a cutoff value at > 3 STC-VM episodes, is closely related (p<0.0004) to future cardiac events. 2. VCG monitoring during angioplasty may detect patients suffering a procedure-related MI. With a cutoff value at > 200[my]V, maximum STC-VM identifies a procedure-related MI with a sensitivity of 93%, specificity of 59% and a negative predictive value of 99% (P<0.0001). 3. VCG monitoring during angioplasty, may identify patients at increased risk of a revascularization during 6 months follow-up. With a cutoff value at > 240 s, total ischemic time of ST Vector Magnitude (ST-VM) predicts a further revascularization (P<0.01). 4. Women develop VCG signs of more severe myocardial ischemia, have more frequent ischemic episodes and report more severe angina pectoris during the angioplasty procedure than men. 5. STC-VM, during angioplasty, seems to be most closely related to the peak systolic velocity deterioration of the left ventricle, as measured by tissue Doppler echocardiography. In conclusion, VCG monitoring in patients with unstable CAD and during angioplasty gives independent prognostic information. As a prognostic variable, STC-VM seems to be at least as good as ST-VM. Women develop VCG signs of more severe and more frequent myocardial ischemia during the angioplasty procedure than men. STC-VM seems to be the best variable for ischemic monitoring during angioplasty.
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- Pantleon, Karen, et al.
(författare)
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X-ray diffraction investigation of electrochemically deposited copper
- 2004
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Ingår i: Materials Science Forum. - 0255-5476 .- 1662-9752. ; 443-4, s. 201-204
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Tidskriftsartikel (refereegranskat)abstract
- Copper layers were deposited from acidic electrolytes containing different amounts of organic additives, designed for the formation of Cu-interconnect structures. Amorphous Ni-P substrates allow to study the unbiased growth of the electrodeposits. The crystallographic texture was investigated by the determination of X-ray diffraction (XRD) pole figures and the calculation of the orientation distribution functions. XRD results are discussed in relation to the morphologies of the electrodeposits as investigated with light optical microscopy and correlated with the process parameters during electrodeposition.
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- Rasmussen, A.A., et al.
(författare)
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Microstructure in electrodeposited copper layers, the role of the substrate
- 2001
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Ingår i: Electrochimica Acta. - 0013-4686 .- 1873-3859. ; 47:1, s. 67-74
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Tidskriftsartikel (refereegranskat)abstract
- The microstructures of Cu layers, ranging in thickness from 3 to 12 µm, were investigated. The layers were electrodeposited from an acidic copper electrolyte onto two distinct substrate materials important for the micro-components industry: an Au layer with a pronounced <111>-texture, and a nano-crystalline Ni-P layer. The evolutions of surface topography, morphology and crystallographic texture in the layers were investigated with scanning electron microscopy (SEM), transmission electron microscopy (TEM) and X-ray diffraction analysis, respectively. Distinct surface topographies were observed for Cu layers deposited on the Au and Ni-P substrates. Deposition onto the Au substrate resulted in a very smooth surface of all Cu layers, whereas the Ni-P substrate caused an irregular surface for 3-µm-thick layers of Cu. The crystallographic texture in the Cu layers in the first few micrometres depended strongly on the crystallographic texture in the substrate. The Cu crystallites inherited the <111>-orientation of the Au substrate, whilst no preferred crystallographic orientation was observed in the Cu crystallites on the nano-crystalline Ni-P substrate. For Cu layers thicker than 3 µm a <110>-fibre texture developed on both the substrates. © 2001 Elsevier Science Ltd. All rights reserved.
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