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- Kakanakova-Georgieva, Anelia, 1970-, et al.
(författare)
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Interface chemistry of WN/4H-SiC structures
- 1999
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Ingår i: Applied Surface Science. - 0169-4332 .- 1873-5584. ; 151:3-4, s. 225-232
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Tidskriftsartikel (refereegranskat)abstract
- The interface chemistry of WN/4H–SiC structures has been studied by means of X-ray photoelectron spectroscopy (XPS). XPS investigations have been performed on as deposited, 800°C and 1200°C annealed (4 min) samples. The as deposited and 800°C annealed samples are characterized by chemically inert interfaces. Complete nitrogen out-diffusion from the WN layer, significant carbon diffusion into the contact layer, tungsten carbide and tungsten silicide formation occur during the 1200°C annealing process. The 800°C annealed WN/4H–SiC contacts are found to be of a Schottky type with a barrier height of 0.91 eV. The Schottky barrier height and the ideality factor show no significant changes during 100 h storage at 500°C under nitrogen and during operation at increasing temperature up to 350°C in air.
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| 2. |
- Kassamakova, L, et al.
(författare)
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Study of the electrical, thermal and chemical properties of Pd ohmic contacts to p-type 4H-SiC : dependence on annealing conditions
- 1999
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Ingår i: Materials Science and Engineering: B. - 0921-5107 .- 1873-4944. ; 61-62, s. 291-295
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Tidskriftsartikel (refereegranskat)abstract
- The electrical and chemical properties of Pd ohmic contacts to p-type 4H-SiC, together with their thermal stability, have been studied in the annealing temperature range 600–700°C. The ohmic behaviour of as-deposited and annealed contacts has been checked from I–V characteristics and the contact resistivity has been determined by the linear TLM method in order to determine the electrical properties and the thermal stability. An ohmic behaviour was established after annealing at 600°C, while the lowest contact resistivity 5.5×10−5 Ω.cm2 was obtained at 700°C. The contact structure, before and after annealing, was investigated using X-ray photoelectron spectroscopy depth analysis. As-deposited Pd films form an abrupt and chemically inert Pd/SiC interface. Annealing causes the formation of palladium silicide. After formation at 600°C the contact structure consists of unreacted Pd and Pd3Si. During annealing at 700°C, Pd and SiC react completely and a mixture of Pd3Si, Pd2Si and C in a graphite state is found in the contact layer. The examination of the thermal stability shows that after a 100 h heating at 500°C, only the contacts annealed at 700°C did not suffer from a change in resistivity. This can be explained by a more complete reaction between the Pd contact layer and the SiC substrate at this higher annealing temperature.
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