| 1. |
- Lauridsen, Jonas, et al.
(författare)
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Microstructure evolution of Ti-Si-C-Ag nanocomposite coatings deposited by DC magnetron sputtering
- 2010
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Ingår i: Acta Materialia. - : Elsevier Ltd.. - 1359-6454 .- 1873-2453. ; 58:20, s. 6592-6599
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Tidskriftsartikel (refereegranskat)abstract
- Nanocomposite coatings consisting of Ag and TiCx (x < 1) crystallites in a matrix of amorphous SiC were deposited by high-rate magnetron sputtering from Ti-Si-C-Ag compound targets. Different target compositions were used to achieve coatings with a Si content of similar to 13 at.%, while varying the C/Ti ratio and Ag content. Electron microscopy, helium ion microscopy, X-ray photoelectron spectroscopy and X-ray diffraction were employed to trace Ag segregation during deposition and possible decomposition of amorphous SiC. Eutectic interaction between Ag and Si is observed, and the Ag forms threading grains which coarsen with increased coating thickness. The coatings can be tailored for conductivity horizontally or vertically by controlling the shape and distribution of the Ag precipitates. Coatings were fabricated with hardness in the range 10-18 GPa and resistivity in the range 77-142 mu Omega cm.
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| 2. |
- Sarius, N. G., et al.
(författare)
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Ni and Ti diffusion barrier layers between Ti-Si-C and Ti-Si-C-Ag nanocomposite coatings and Cu-based substrates
- 2012
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Ingår i: Surface & Coatings Technology. - : Elsevier BV. - 0257-8972 .- 1879-3347. ; 206:8-9, s. 2558-2565
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Tidskriftsartikel (refereegranskat)abstract
- Sputtered Ni and Ti layers were investigated as a diffusion barrier to substitute electroplated Ni between Ti-Si-C and Ti-Si-C-Ag nanocomposite coatings and Cu or CuSn substrates. Samples were subjected to thermal annealing studies by exposure to 400 degrees C for 11 h. Dense diffusion barrier and coating hindered Cu from diffusing to the surface. This condition was achieved for electroplated Ni in combination with magnetron-sputtered Ti-Si-C and Ti-Si-C-Ag layers deposited at 230 degrees C and 300 degrees C. and sputtered Ti or Ni layers in combination with Ti-Si-C-Ag deposited at 300 degrees C.
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| 3. |
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| 4. |
- Gunnarsson Sarius, Niklas, 1976-, et al.
(författare)
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Ni and Ti diffusion barrier layers between Ti-Si-C-Ag nanocomposite coatings and Cu-based substrates
- 2012
-
Ingår i: Surface & Coatings Technology. - : Elsevier. - 0257-8972 .- 1879-3347. ; 206:8-9, s. 2558-2565
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Tidskriftsartikel (refereegranskat)abstract
- Sputtered Ni and Ti layers were investigated as substitutes for electroplated Ni as adiffusion barrier between Ti-Si-C and Ti-Si-C-Ag nanocomposite coatings and Cu orCuSn substrates. Samples were subjected to thermal annealing studies by exposure to400 ºC during 11 h. Dense diffusion barrier and coating hindered Cu from diffusing tothe surface. This condition was achieved for electroplated Ni in combination withmagnetron-sputtered Ti-Si-C and Ti-Si-C-Ag layers deposited at 230 ºC and 300 ºC,and sputtered Ti or Ni layers in combination with Ti-Si-C-Ag deposited at 300 ºC.
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| 5. |
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| 6. |
- Lauridsen, Jonas, et al.
(författare)
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High-rate deposition of amorphous and nanocomposite Ti-Si-C multifunctional coatings
- 2010
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Ingår i: Surface & Coatings Technology. - : Elsevier BV. - 0257-8972 .- 1879-3347. ; 205:2, s. 299-305
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Tidskriftsartikel (refereegranskat)abstract
- Amorphous (a) and nanocomposite Ti-Si-C coatings were deposited at rates up to 16 mu m/h by direct current magnetron sputtering from a Ti3SiC2 compound target, using an industrial pilot-plant system, onto high-speed steel. Si, and SiO2 substrates as well as NI-plated Cu cylinders, kept at a temperature of 200 or 270 degrees C. Electron microscopy, X-ray photoelectron spectroscopy, and X-ray diffraction analyses showed that TiC/a-C/a-SiC nanocomposites were formed consisting of textured TIC nanocrystallites (nc) embedded in a matrix of a-C and a-SiC. Elastic recoil detection analysis showed that coatings deposited at a target-to-substrate distance of 2 cm and an Ar pressure of 10 mTorr have a composition close to that of the Ti3SiC2 compound target, as explained by ballistic transport of the species Increased target-to-substrate distance from 2 cm to 8 cm resulted in a higher carbon-to-titanium ratio in the coatings than for the Ti3SiC2 compound target, due to different gas-phase scattering properties between the sputtered species The coating microstructure could be modified from nanocrystalline to predominantly amorphous by changing the pressure and target-to-substrate conditions to 4 mTorr and 2 cm, respectively. A decreased pressure from 10 mTorr to 4 or 2 mTorr at a target-to-substrate distance of 2 cm decreased the deposition rate up to a factor of similar to 7 as explained by resputtering and an increase in the plasma sheath thickness. The coatings exhibited electrical resistivity in the range 160-800 mu Omega cm, contact resistance down to 08 m Omega at a contact force of 40 N, and nanoindentation hardness in the range of 6-38 GPa.
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