| 1. |
- Xin, Zhiging, et al.
(författare)
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Scalable Fabrication of Conductive Lines by Patterned Wettability-Assisted Bar-Coating for Low Cost Paper-Based Circuits
- 2019
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Ingår i: Advanced Materials Interfaces. - : Wiley-VCH Verlag. - 2196-7350. ; 6:10
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Tidskriftsartikel (refereegranskat)abstract
- Patterning technology on the paper based on wettability difference for paper-based devices has attracted significant attention for its low cost, easy degradability, and high flexibility. Here, conductive lines are rapidly prepared by patterned wettability-assisted bar-coating for low cost paper-based circuits. It is found that 7 s plasma treatment time for acquiring wettability difference is optimal, which resulted in not only effective splitting of the liquid film but also highly consistent line width with mask. Moreover, low retention force of hydrophobic surface is imperative for self-confinement of the ink into hydrophilic areas, especially for ink with high solid content. The sheet resistance of patterns can reach 5 Ω ◻ −1 after 980 nm laser sintering when using 50 wt% solid content ink with 110 cP viscosity. The geometries of line patterns, i.e., line width and spacing, can be readily tuned by varying the designed size of mask patterns. As-prepared conductive patterns show good conductivity even after 500 bending cycles at 2 mm bending radius. It is believed that this study will provide deeper understanding of wettability difference-assisted patterning process and represents a general strategy for selective wetting, especially for high viscosity ink.
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| 2. |
- Mo, Lixin, et al.
(författare)
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Nano-Silver Ink of High Conductivity and Low Sintering Temperature for Paper Electronics
- 2019
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Ingår i: Nanoscale Research Letters. - : Springer New York LLC. - 1931-7573 .- 1556-276X. ; 14
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Tidskriftsartikel (refereegranskat)abstract
- Highly conductive ink with low sintering temperature is important for printed electronics on paper substrate. Silver nanoparticles (Ag NPs) of different average radii ranging from 48 to 176 nm were synthesized by adjusting the Ag+ concentration in the reaction process. The electric resistivity of the Ag NP-based ink film in relation to Ag NP size, sintering temperature, amount of PVP capping agent on Ag NP surface, and morphology evolution of the film during heating process was investigated. It was found that the resistivity of the films reduced very rapidly with increasing particle size due above all to reduced amount of protective agent capping on the Ag NPs. A semi-empirical relationship between the resistivity and the particle size was proposed. With the help of this mathematical expression, one gains both systematic and detailed insight to the resistivity evaluation with regard to the Ag particle size. The optimal electric resistivity of 4.6 μΩ cm was achieved at 140 °C for 10 min which was very close to the resistivity value of bulk Ag (1.58 μΩ cm). Mechanical flexibility of the printed electronics with the Ag NP-based ink on paper substrates was investigated. The prints on the art coated paper exhibited better flexibility compared to that on the photopaper. This might be attributed to the surface coating composition, surface morphology of the paper, and their corresponding ink absorption property. © 2019, The Author(s).
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| 3. |
- Mo, Lixin, et al.
(författare)
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Silver Nanoparticles Based Ink with Moderate Sintering in Flexible and Printed Electronics
- 2019
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Ingår i: International Journal of Molecular Sciences. - : MDPI AG. - 1661-6596 .- 1422-0067. ; 20:9
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Tidskriftsartikel (refereegranskat)abstract
- Printed electronics on flexible substrates has attracted tremendous research interest research thanks its low cost, large area production capability and environmentally friendly advantages. Optimal characteristics of silver nanoparticles (Ag NPs) based inks are crucial for ink rheology, printing, post-print treatment, and performance of the printed electronics devices. In this review, the methods and mechanisms for obtaining Ag NPs based inks that are highly conductive under moderate sintering conditions are summarized. These characteristics are particularly important when printed on temperature sensitive substrates that cannot withstand sintering of high temperature. Strategies to tailor the protective agents capping on the surface of Ag NPs, in order to optimize the sizes and shapes of Ag NPs as well as to modify the substrate surface, are presented. Different (emerging) sintering technologies are also discussed, including photonic sintering, electrical sintering, plasma sintering, microwave sintering, etc. Finally, applications of the Ag NPs based ink in transparent conductive film (TCF), thin film transistor (TFT), biosensor, radio frequency identification (RFID) antenna, stretchable electronics and their perspectives on flexible and printed electronics are presented.
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