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| 2. |
- Duo, Xinzhong, et al.
(författare)
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A concurrent multi-band LNA for multi-standard radios
- 2005
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Ingår i: 2005 IEEE International Symposium On Circuits And Systems (ISCAS), Conference Proceedings. - : IEEE. - 0780388348 ; , s. 3982-3985
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Konferensbidrag (refereegranskat)abstract
- A source-degenerated cascade LNA, which works at 2.4GHz and 5.8GHz simultaneously, is designed for Bluetooth and IEEE wireless LAN 802.11 a/b/g receivers. In this design, 0.15 mu m GaAs PHEMT technology and embedded passives in MCM-D substrate are implemented. At 2.4GHz and 5.8GHz, this LNA provides 12.2dB and 15.3dB gain, respectively. Noise figures of the LNA are 0.53dB and 1.43dB, respectively. Good input matching and output matching are also achieved-S11 and S22 at both frequencies are less than -10dB.
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| 3. |
- Duo, Xinzhong, et al.
(författare)
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Broadband CMOS LNAs for IR-UWB receiver
- 2005
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Ingår i: Norchip 2005, Proceedings. - New York : IEEE. - 1424400643 ; , s. 273-276
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Konferensbidrag (refereegranskat)abstract
- Two single-ended wideband LNAs for Ultrawide-band receiver have been designed and implemented in 0.18 mu m CMOS technology. The first one, a feed-back LNA, is a two-stage amplifier with a improved feedback loop, which provides high gain and enables the input port to match with 500 in a wide frequency range from 500MHz to 8GHz. The second one, an LC low-pass-filter matched LNA, employs a third-order low pass filter in the input port to match a frequency range from 3GHz to 8GHz. In both of the LNAs, the input stage is a common source amplifier. Inductive shunt peaking is used for maximizing the bandwidth and flatting the gain. In the feed-back LNA, measurements show that the maximum gain is 11.5dB, the 3-dB; bandwidth is from 500MHz to 7GHz, IIP3 is -2.2dBm at 4GHz, the minimum noise figure is around 5.7dB, S11 is less than 8.2dB, and the power consumption is 14mW. In the LC filter matched LNA, the 3-dB bandwidth is from 3GHz to 7.3GHz. The maximum gain is 9.6dB, IIP3 is 0dBm at 4 GHz, the minimum noise figure is 7.6dB, S11 is less than -13.4dB and the power consumption is 23mW.
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| 4. |
- Duo, Xinzhong
(författare)
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System-on-package solutions for multi-band RF front end
- 2005
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Doktorsavhandling (övrigt vetenskapligt/konstnärligt)abstract
- Advances in microelectronics technology have enabled us to integrate a complex electronic system (such as a radio) on a single chip or in a single package module, known as system-on-chip (SoC) and system-on-package (SoP) paradigms. This brings not only new opportunities for system integration, but also challenges in design and implementation. One of these challenges is how to achieve an optimum total solution of system integration via chip and package co-design, because there is no tool or design methodology available for such kind of optimization. This thesis focuses on innovative multi-band multi-standard radio front-end design and explores a new design methodology. The motivation of developing this design methodology is to achieve an optimum total solution for radio system implementation via chip and package co-design and co-optimization. The methodology starts from RF packaging and components modeling. Necessary models for both on-chip and off-chip passives are developed. Parasitic effects of packages for radio chips are modeled for particular frequencies. Compared with high-speed digital packaging, RF packaging normally deals with narrow band signals. It is possible to absorb some unwanted parasitics by designing proper port matching networks. In addition, cost-performance trade-offs are performed. In this context, we first developed process and technology based cost models, which include parameters like chip real estate, raw materials, package, test and rework. Impact of process variation on final yield has also been considered in the models by using a statistical analysis approach. Performance of different design options is measured by a special FoM (figure-of-merit). Each type of analog/RF circuit (such as LNA, PA and ADC) has its own dedicated FoM. Through a series of cost-performance trade-offs for different on-chip versus off-chip passives and partitions, an optimum total solution is obtained. Finally, this methodology was demonstrated via a number of design examples for multi-band multi-standard radio front-end. The author has explored the optimum solutions for different circuit architectures and process technologies encompassing parallel, concurrent and digitally programmable multi-band radio frond-end blocks. It is interesting to find that, for complex RF circuits like a multi-band multi-standard radio, moving some passives off-chip will have significant cost-savings. In addition to the above contributions, the author has also developed an MCM-D technology on LCP and glass substrates, based on metal deposition and BCB spin-coating at KTH clean room. The author has also performed some preliminary studies on UWB radio for RFID applications.
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| 5. |
- Peltonen, Teemu, et al.
(författare)
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A 0.18 #x003BC;m CMOS Ultra-Wideband Low-Noise Amplifier with High IIP3
- 2005
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Ingår i: Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05). ; , s. 452-454
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Konferensbidrag (refereegranskat)abstract
- In this paper an ultra-wideband low-noise amplifier (LNA) for the frequency range of 3.1 - 9.4 GHz using 0.18 mu m CMOS RF process is introduced. Single-ended single stage LNA structure utilises an input LC-ladder, cascode transistor configuration and LRC-feedback to realise an ultra broad bandwidth response. In operating frequency range noise figure (NF) of 3.1 dB and gain of 10.6 dB were achieved along with high linearity (IIP3) even upto 10.9 dBm at 3.1 GHz. With the bias network, the LNA had a total power consumption of 31 mW from 1.8 V supply.
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| 6. |
- Rodriguez Duenas, Saul, et al.
(författare)
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CMOS UWB IR Non-Coherent Receiver for RF-ID Applications
- 2006
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Ingår i: Circuits and Systems, 2006 IEEE North-East Workshop on. - 1424404169 ; , s. 213-216
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Konferensbidrag (refereegranskat)abstract
- Ultra Wide Band Impulse-Radio (UWB-IR) bringsthe opportunity of increased bitrates in RFID systems. This paperpresents the implementation of a CMOS non-coherent UWBimpulse receiver targeted for readers in RFID applications. Thereceiver consists of an RF-front-end and an On-Off keying (OOK)10Mbps demodulator, which is implemented using a 0.18umCMOS process. The receiver works for 3.1GHz-5GHz, has asensitivity of -70dBm, and consumes 31mW from a 1.8V supply.
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| 7. |
- Zheng, Li-Rong, et al.
(författare)
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Embedded smart systems for intelligent paper and packaging
- 2005
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Ingår i: 55th Electronic Components & Technology Conference, Vols 1 and 2, 2005 Proceedings. - 0780389069 ; , s. 1776-1782
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Konferensbidrag (refereegranskat)abstract
- In this paper, we present architecture, circuit implementation and integration issues of an embedded smart system for innovative, long-range interconnected identification/sensor network in warehouse and intelligent goods distribution systems. The network is interconnected via IEEE 802.11 and ultra-wideband (UWB) wireless air interfaces. A self-powered, ultra-low power UWB transceiver with BPSK modulation is designed for transponders and implemented in 0.18um CMOS technology. Low power consumption is achieved by developing innovative circuit and system architectures. Instead of pumping up energy from the Gaussian pluses emitted by the reader, a power converter draws energy from the 802.11 access point and its surrounding electromagnetic waves. Functionality of the transceiver is verified and integration issues for smart labels are investigated on thin foils of liquid crystal polymer.
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| 8. |
- Zheng, Li-Rong, et al.
(författare)
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On-chip versus off-chip passives in radio and mixed-signal system-on-package design
- 2006
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Ingår i: ESTC 2006 - 1st Electronics Systemintegration Technology Conference. - New York : IEEE. - 1424405521 - 9781424405527 ; , s. 221-232
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Konferensbidrag (refereegranskat)abstract
- Optimal total solution for new radio architecture and implementation requires accurate trade-offs for off-chip versus off-chip passives. In this paper, a complete and systematic design methodology for RF blocks in SoP (system-on-package) versus SoC (system-on-chip) is presented. This methodology explores trade-offs between Performance and cost when different on-chip or off-chip passives are used. For a better presentation, the method and design techniques are demonstrated through four multi-band/multi-standard radio design examples with various technologies and different circuit topologies. Our study reveals that, in order to obtain cost benefits in RF-SoPs, small RF chips should be merged as larger chips and the integration density of each RF chip should be high enough. Our study also indicates that in a complex chip like a multi-band radio, moving passives off chip could achieve further cost savings and significant performance improvements. These are general conclusions but, our method offers a detailed analysis which can give quantitative measurements of cost savings and performance improvements in off-chip versus off-chip passives in RF SoP design.
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