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Sökning: WFRF:(Liljeholm Jessica) > (2017)

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1.
  • Khorramdel, Behnam, et al. (författare)
  • Inkjet printing technology for increasing the I/O density of 3D TSV interposers
  • 2017
  • Ingår i: Microsystems & Nanoengineering. - : Nature Publishing Group. - 2055-7434. ; 3, s. 17002-
  • Tidskriftsartikel (refereegranskat)abstract
    • Interposers with through-silicon vias (TSVs) play a key role in the three-dimensional integration and packaging of integrated circuits and microelectromechanical systems. In the current practice of fabricating interposers, solder balls are placed next to the vias; however, this approach requires a large foot print for the input/output (I/O) connections. Therefore, in this study, we investigate the possibility of placing the solder balls directly on top of the vias, thereby enabling a smaller pitch between the solder balls and an increased density of the I/O connections. To reach this goal, inkjet printing (that is, piezo and super inkjet) was used to successfully fill and planarize hollow metal TSVs with a dielectric polymer. The under bump metallization (UBM) pads were also successfully printed with inkjet technology on top of the polymer-filled vias, using either Ag or Au inks. The reliability of the TSV interposers was investigated by a temperature cycling stress test (-40 °C to +125 °C). The stress test showed no impact on DC resistance of the TSVs; however, shrinkage and delamination of the polymer was observed, along with some micro-cracks in the UBM pads. For proof of concept, SnAgCu-based solder balls were jetted on the UBM pads.
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2.
  • Laakso, Miku, 1989-, et al. (författare)
  • Maskless Manufacturing of Through Glass Vias (TGVs) and Their Test Structures
  • 2017
  • Ingår i: Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). - 9781509050789 ; , s. 753-756
  • Konferensbidrag (refereegranskat)abstract
    • Through glass vias (TGVs) are a key component in glass-based interposers and microelectromechanical-system lid wafers. Magnetic-field-assisted self-assembly has been demonstrated earlier in fabrication of through silicon vias. Here we present an entirely maskless TGV fabrication process utilizing magnetic assembly. Femtosecond laser is used for ablative direct patterning of surface metal layers and for exposing the TGV conductors after wafer thinning. The proposed TGV structure is shown to be electrically functional by measuring the TGV resistance values.
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