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- Batsleer, Janet, et al.
(författare)
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Non-formal spaces of socio-cultural accompaniment: Responding to young unaccompanied refugees – reflections from the Partispace project
- 2018
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Ingår i: European Educational Research Journal. - : SAGE Publications. - 1474-9041. ; 17:2, s. 305-322
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Tidskriftsartikel (refereegranskat)abstract
- Drawing on research in progress in the Partispace project we make a case for the recognition of the importance of non-formal spaces in response to young refugees across three different national contexts: Frankfurt in Germany; Gothenburg in Sweden; and Manchester in the UK. It is argued that recognition of local regulation and national controls of immigration which support climates of hostility makes it important to recognise and affirm the significance of non-formal spaces and ‘small spaces close to home’ which are often developed in the ‘third space’ of civil society and arise from the impulses driven by the solidarity of volunteers. In these contexts it is important that practices of hospitality can develop which symbolically reconstitute refugees as hosts and subjects of a democratic conversation, without which there is no possible administrative solution to the refugee crisis. It is essential that educational spaces such as schools, colleges and universities forge strong bonds with such emergent spaces.
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| 2. |
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| 3. |
- Laakso, Miku J., et al.
(författare)
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Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires
- 2018
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Ingår i: IEEE Access. - : Institute of Electrical and Electronics Engineers (IEEE). - 2169-3536. ; 6, s. 44306-44317
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Tidskriftsartikel (refereegranskat)abstract
- A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). However, TGVs are challenging to realize because via holes in glass typically do not have a sufficiently high-quality sidewall profile for super-conformal electroplating of metal into the via holes. To overcome this problem, we demonstrate here that the via holes can instead be filled by magnetically assembling metal wires into them. This method was used to produce TGVs with a typical resistance of 64 m Omega, which is comparable with other metal TGV types reported in the literature. In contrast to many TGV designs with a hollow center, the proposed TGVs can be more area efficient by allowing solder bump placement directly on top of the TGVs, which was demonstrated here using solder-paste jetting. The magnetic assembly process can be parallelized using an assembly robot, which was found to provide an opportunity for increased wafer-scale assembly speed. The aforementioned qualities of the magnetically assembled TGVs allow the realization of glass interposers and MEMS packages in different thicknesses without the drawbacks associated with the current TGV fabrication methods.
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| 4. |
- Laakso, Miku, 1989-, et al.
(författare)
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Through-Glass Vias for MEMS Packaging
- 2018
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- Novelty / Progress Claims We have developed a new method for fabrication of through-glass vias (TGVs). The method allows rapid filling of via holes with metal rods both in thin and thick glass substrates.Background Vertical electrical feedthroughs in glass substrates, i.e. TGVs, are often required in wafer-scale packaging of MEMS that utilizes glass lids. The current methods of making TGVs have drawbacks that prevent the full utilization of the excellent properties of glass as a package material, e.g. low RF losses. Magnetic assembly has been used earlier to fabricate through-silicon vias (TSVs), and in this work we extend this method to realize TGVs [1]. Methods The entire TGV fabrication process is maskless, and the processes used include: direct patterning of wafer metallization using femtosecond laser ablation, magnetic-fieldassisted self-assembly of metal wires into via holes, and solder-paste jetting of bump bonds on TGVs.Results We demonstrate that: (1) the magnetically assembled TGVs have a low resistance, which makes them suitable even for low-loss and high-current applications; (2) the magneticassembly process can be parallelized in order to increase the wafer-scale fabrication speed; (3) the magnetic assembly produces void-free metal filling for TGVs, which allows solder placement directly on top of the TGV for the purpose of high integration density; and (4) good thermal-expansion compatibility between TGV metals and glass substrates is possible with the right choice of materials, and several suitable metals-glass pairs are identified for possible improvement of package reliability [2].[1] M. Laakso et al., IEEE 30th Int. Conf. on MEMS, 2017. DOI:10.1109/MEMSYS.2017.7863517[2] M. Laakso et al., “Through-Glass Vias for Glass Interposers and MEMS Packaging Utilizing Magnetic Assembly of Microscale Metal Wires,” manuscript in preparatio
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| 5. |
- Larsson, S., et al.
(författare)
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Simple method for quality factor estimation in resonating MEMS structures
- 2018
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Ingår i: Proceedings of the 17th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications, 2017. - : IOP Publishing.
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Konferensbidrag (refereegranskat)abstract
- The quality factor of a packaged MEMS resonating structure depends on both the packaging pressure and the structure's proximity to the walls. This type of mechanical constraints, which causes energy dissipation from the structure to the surrounding air, are applicable for oscillating energy harvesters and should be considered in the design process. However, the modelling of energy losses or the measurements of their direct influence inside a packaged chip is not trivial. In this paper, a simple experimental method to quantify the energy loss in an oscillating MEMS structures due to the surrounding air is described together with preliminary results. The main advantage of the method is the ability to characterize the damping contributions under different vacuum and packaging conditions without requiring any packaging of the harvester chip or fabrication of multiple devices with different cavity depths. © Published under licence by IOP Publishing Ltd.
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| 6. |
- Shah, Umer, et al.
(författare)
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Low Loss High Linearity RF Interposers Enabled by Through-Glass Vias
- 2018
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Ingår i: IEEE Microwave and Wireless Components Letters. - : IEEE. - 1531-1309 .- 1558-1764. ; 28:11, s. 960-962
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Tidskriftsartikel (refereegranskat)abstract
- This letter reports on a new low-loss and high linearity3-D wafer-level interposer technology enabled by throughglass vias (TGVs) with an inverted via configuration. Theproposed TGV utilizes a tapered via sidewall profile to achievea void-free conformal metal coverage with lower process timeand fewer fabrication steps than a fully filled conventional TGV.Measurement results for a single 100 μm tall TGV show aninsertion loss of 0.014 dB at 10 GHz and a DC resistanceof 28 mΩ. Finally, this letter reports for the first time onnonlinearity measurements of TGVs. Single-tone measurementsshow that the third harmonic level for a coplanar waveguide(CPW) TGV test structure is only 2 dB higher than a referenceCPW through line without TGVs, indicating an overall excellentlinearity performance.
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| 7. |
- Vyas, Agin, 1992, et al.
(författare)
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A micromachined coupled-cantilever for piezoelectric energy harvesters
- 2018
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Ingår i: Micromachines. - : MDPI AG. - 2072-666X. ; 9:5
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Tidskriftsartikel (refereegranskat)abstract
- This paper presents a demonstration of the feasibility of fabricating micro-cantilever harvesters with extended stress distribution and enhanced bandwidth by exploiting an M-shaped two-degrees-of-freedom design. The measured mechanical response of the fabricated device displays the predicted dual resonance peak behavior with the fundamental peak at the intended frequency. This design has the features of high energy conversion efficiency in a miniaturized environment where the available vibrational energy varies in frequency. It makes such a design suitable for future large volume production of integrated self powered sensors nodes for the Internet-of-Things
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