| 1. |
- Errando-Herranz, Carlos, et al.
(författare)
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Integration of microfluidics with grating coupled silicon photonic sensors by one-step combined photopatterning and molding of OSTE
- 2013
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Ingår i: Optics Express. - : Optical Society of America. - 1094-4087. ; 21:18, s. 21293-21298
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Tidskriftsartikel (refereegranskat)abstract
- We present a novel integration method for packaging silicon photonic sensors with polymer microfluidics, designed to be suitable for wafer-level production methods. The method addresses the previously unmet manufacturing challenges of matching the microfluidic footprint area to that of the photonics, and of robust bonding of microfluidic layers to biofunctionalized surfaces. We demonstrate the fabrication, in a single step, of a microfluidic layer in the recently introduced OSTE polymer, and the subsequent unassisted dry bonding of the microfluidic layer to a grating coupled silicon photonic ring resonator sensor chip. The microfluidic layer features photopatterned through holes (vias) for optical fiber probing and fluid connections, as well as molded microchannels and tube connectors, and is manufactured and subsequently bonded to a silicon sensor chip in less than 10 minutes. Combining this new microfluidic packaging method with photonic waveguide surface gratings for light coupling allows matching the size scale of microfluidics to that of current silicon photonic biosensors. To demonstrate the new method, we performed successful refractive index measurements of liquid ethanol and methanol samples, using the fabricated device. The minimum required sample volume for refractive index measurement is below one nanoliter.
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| 2. |
- Errando-Herranz, Carlos, et al.
(författare)
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Integration Of Polymer Microfluidic Channels, Vias, And Connectors With Silicon Photonic Sensors By One-Step Combined Photopatterning And Molding Of OSTE
- 2013
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Ingår i: Proceedings of the 2013 17th International Solid-State Sensors, Actuators and Microsystems Conference (Transducers). - : IEEE conference proceedings. ; , s. 1613-1616
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Konferensbidrag (refereegranskat)abstract
- We demonstrate a method for the fast and simple packaging of silicon sensors into a microfluidic package consisting of the recently introduced {OSTE} polymer. The microfluidic layer is first microstructured and thereafter dry-bonded to a silicon photonic sensor, in a process compatible with wafer-level production, and with the entire packaging process lasting only 10 minutes. The fluidic layer combines molded microchannels and fluidic (Luer) connectors with photopatterned through-holes (vias) for optical fiber probing and fluid connections. All the features are fabricated in a single photocuring step. We report measurements with an integrated silicon photonic {Mach-Zehnder} interferometer refractive index sensor packaged by these means.
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| 3. |
- Errando-Herranz, Carlos, et al.
(författare)
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Integration of polymer microfluidics with silicon photonic biosensors by one-step combined photopatterning and molding of OSTE
- 2013
-
Konferensbidrag (refereegranskat)abstract
- We demonstrate a method for the fast and simple packaging of silicon sensors into a microfluidic package consisting of the recently introduced {OSTE} polymer. The microfluidic layer is first microstructured and thereafter dry-bonded to a silicon photonic sensor, in a process compatible with wafer-level production, and with the entire packaging process lasting only 10 minutes. The fluidic layer combines molded microchannels and fluidic (Luer) connectors with photopatterned through-holes (vias) for optical fiber probing and fluid connections. All the features are fabricated in a single photocuring step. We report measurements with an integrated silicon photonic {Mach-Zehnder} interferometer refractive index sensor packaged by these means.
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| 4. |
- Forsberg, Fredrik, et al.
(författare)
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A Comparative study of the bonding energy in adhesive wafer bonding
- 2013
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Ingår i: Journal of Micromechanics and Microengineering. - : IOP Publishing. - 0960-1317 .- 1361-6439. ; 23:8, s. 1-7
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Tidskriftsartikel (refereegranskat)abstract
- Adhesion energies are determined for three different polymers currently used in adhesive wafer bonding of silicon wafers. The adhesion energies of the polymer off-stoichiometry thiol-ene-epoxy OSTE+ and the nano-imprint resist mr-I 9150XP are determined. The results are compared to the adhesion energies of wafers bonded with benzocyclobutene, both with and without adhesion promoter. The adhesion energies of the bonds are studied by blister tests, consisting of delaminating silicon lids bonded to silicon dies with etched circular cavities, using compressed nitrogen gas. The critical pressure needed for delamination is converted into an estimate of the bond adhesion energy. The fabrication of test dies and the evaluation method are described in detail. The mean bond energies of OSTE+ were determined to be 2.1 and 20 J m(-2) depending on the choice of the epoxy used. A mean bond energy of 1.5 J m(-2) was measured for mr-I 9150XP.
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| 5. |
- Forsberg, Fredrik, 1980-, et al.
(författare)
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Low temperature adhesive wafer bonding using OSTE(+) for heterogeneous 3D MEMS integration
- 2013
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Ingår i: Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on. - : IEEE conference proceedings. - 9781467356541 ; , s. 342-346
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Konferensbidrag (refereegranskat)abstract
- We demonstrate, for the first time, the use of off stoichiometry thiolene-epoxy, OSTE(+) for adhesive wafer bonding. The dual cure system, with an initial UV-curing step followed by a second thermal cure, allows for high bond strength and potentially high quality material interfaces. We show that cured OSTE(+) is easily removed in oxygen plasma and that the characteristics of OSTE(+) make it a potential candidate for use in heterogeneous 3D MEMS integration. Furthermore, we show how the bond energies of wafers bonded with OSTE(+) adhesive compares with the bond energies of wafers bonded with Cyclotene 3022-46 (BCB) and mr-I 9150XP nanoimprint resist.
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| 6. |
- Saharil, Farizah, et al.
(författare)
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Dry adhesive bonding of nanoporous inorganic membranes to microfluidic devices using the OSTE(+) dual-cure polymer
- 2013
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Ingår i: Journal of Micromechanics and Microengineering. - : Institute of Physics Publishing (IOPP). - 0960-1317 .- 1361-6439. ; 23:2, s. 025021-
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Tidskriftsartikel (refereegranskat)abstract
- We present two transfer bonding schemes for incorporating fragile nanoporous inorganic membranes into microdevices. Such membranes are finding increasing use in microfluidics, due to their precisely controllable nanostructure. Both schemes rely on a novel dual-cure dry adhesive bonding method, enabled by a new polymer formulation: OSTE(+), which can form bonds at room temperature. OSTE(+) is a novel dual-cure ternary monomer system containing epoxy. After the first cure, the OSTE(+) is soft and suitable for bonding, while during the second cure it stiffens and obtains a Young's modulus of 1.2 GPa. The ability of the epoxy to react with almost any dry surface provides a very versatile fabrication method. We demonstrate the transfer bonding of porous silicon and porous alumina membranes to polymeric microfluidic chips molded into OSTE(+), and of porous alumina membranes to microstructured silicon wafers, by using the OSTE(+) as a thin bonding layer. We discuss the OSTE(+) dual-cure mechanism, describe the device fabrication and evaluate the bond strength and membrane flow properties after bonding. The membranes bonded to OSTE(+) chips delaminate at 520 kPa, and the membranes bonded to silicon delaminate at 750 kPa, well above typical maximum pressures applied to microfluidic circuits. Furthermore, no change in the membrane flow resistance was observed after bonding.
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| 7. |
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| 8. |
- Saharil, Farizah, et al.
(författare)
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LIGATION-BASED MUTATION DETECTION AND RCA IN SURFACE UN-MODIFIED OSTE+ POLYMER MICROFLUIDIC CHAMBERS
- 2013
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Ingår i: 17th IEEE International Conference on Solid-State Sensors, Actuators and Microsystems & EUROSENSORS XXVII (IEEE TRANSDUCERS 2013). - : IEEE conference proceedings. - 9781467359818 ; , s. 357-360
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Konferensbidrag (refereegranskat)abstract
- For the first time, we demonstrate DNA mutation detection in surface un-modified polymeric microfluidic chambers without suffering from bubble trapping or bubble formation. Microfluidic devices were manufactured in off-stoichiometry thiol-ene epoxy (OSTE+) polymer using an uncomplicated and rapid fabrication scheme. The device performance was compared to that of PMMA and PDMS devices. In OSTE+ devices, we were able to perform ligation-based mutation detection and rolling circle amplification (RCA) assays directly on the un-modified surface without suffering from bubble formation or enzyme inhibition during bio-operation at elevated temperatures. In contrast, PMMA, PDMS and COP microfluidic devices required specific surface treatment.
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| 9. |
- Vastesson, Alexander, et al.
(författare)
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ROBUST MICRODEVICE MANUFACTURING BY DIRECT LITHOGRAPHY AND ADHESIVE-FREE BONDING OF OFF-STOICHIOMETRY THIOL-ENE-EPOXY (OSTE+) POLYMER
- 2013
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Ingår i: 17th IEEE International Conference on Solid-State Sensors, Actuators and Microsystems & EUROSENSORS XXVII (IEEE TRANSDUCERS 2013). - : IEEE conference proceedings. - 9781467359818 ; , s. 408-411
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Konferensbidrag (refereegranskat)abstract
- We here demonstrate, for the first time, the use of direct lithography in off-stoichiometry thiol-ene-epoxy (OSTE+) to fabricate a microdevice. First, the photolithographic property of OSTE+ is shown by using a photomask to create micropillars with an aspect-ratio of 1:10 in a 2 mm thick layer. Secondly, a three-layer OSTE+ microdevice containing in-/outlet holes, channels, and pillars is fabricated by using a combination of direct lithography and adhesive-free dry bonding. The resulting microdevice shows desirable properties, such as leak-free filling and hydrophilic surfaces. This fabrication method enhances the microstructurability of OSTE+ beyond that of conventional soft lithography replica molding of other polymers, such as PDMS.
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| 10. |
- Zhou, Xiamo, 1990-, et al.
(författare)
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Rapid Fabrication Of OSTE+ Microfluidic Devices With Lithographically Defined Hydrophobic/ Hydrophilic Patterns And Biocompatible Chip Sealing
- 2013
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Ingår i: 17th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2013. - Freiburg, Germany : NO. ; , s. 134-136
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Konferensbidrag (refereegranskat)abstract
- Here we present an uncomplicated and robust method for rapid prototyping of microfluidic devices featuring: 1) lithographically defined, permanently surface modified hydrophilic and hydrophobic regions with contact angles varying from 18o to 118o, in which all four channel walls are surface modified in a single step using polymer chain grafting; 2) polymer chains grafted from open surfaces before bonding, making this method suitable for batch fabrication; 3) biomolecule-compatible, room temperature, dry, homogeneous chip-sealing, in which native as well as hydrophobic/hydrophilic modified OSTE+ surfaces allow for epoxy-epoxy and thiol-epoxy covalent bonding, hence greatly simplifying alignment and dramatically increasing device yields. We demonstrate the method with a functional microfluidic device. This represents a complete, simplified and robust method for batch-manufacturing compatible prototyping of microfluidic devices with tunable mechanical and surface properties.
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