| 1. |
- Sarajlić, M., et al.
(författare)
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Germanium "hexa" detector : Production and testing
- 2017
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Ingår i: Journal of Instrumentation. - 1748-0221. ; 12:1
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Tidskriftsartikel (refereegranskat)abstract
- Here we present new result on the testing of a Germanium sensor for X-ray radiation. The system is made of 3 × 2 Medipix3RX chips, bump-bonded to a monolithic sensor, and is called "hexa". Its dimensions are 45 × 30 mm2 and the sensor thickness was 1.5 mm. The total number of the pixels is 393216 in the matrix 768 × 512 with pixel pitch 55 μ m. Medipix3RX read-out chip provides photon counting read-out with single photon sensitivity. The sensor is cooled to -126°C and noise levels together with flat field response are measured. For -200 V polarization bias, leakage current was 4.4 mA (3.2 μ A/mm2). Due to higher leakage around 2.5% of all pixels stay non-responsive. More than 99% of all pixels are bump bonded correctly. In this paper we present the experimental set-up, threshold equalization procedure, image acquisition and the technique for bump bond quality estimate.
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| 2. |
- Sarajlic, M., et al.
(författare)
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Progress on TSV technology for Medipix3RX chip
- 2017
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Ingår i: Journal of Instrumentation. - 1748-0221. ; 12
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Tidskriftsartikel (refereegranskat)abstract
- The progress of Through Silicon Via (TSV) technology for Medipix3RX chip done at DESY is presented here. The goal of this development is to replace the wire bonds in X-ray detectors with TSVs, in order to reduce the dead area between detectors. We obtained the first working chips assembled together with Si based sensors for X-ray detection. The 3D integration technology, including TSV, Re-distribution layer deposition, bump bonding to the Si sensor and bump bonding to the carrier PCB, was done by Fraunhofer Institute IZM in Berlin. After assembly, the module was successfully tested by recording background radiation and making X-ray images of small objects. The active area of the Medipix3RX chip is 14.1 mm x 14.1 mm or 256 x 256 pixels. During TSV processing, the Medipix3RX chip was thinned from 775 mu m original thickness, to 130 mu m. The diameter of the vias is 40 mu m, and the pitch between the vias is 120 mu m. A liner filling approach was used to contact the TSV with the RDL on the backside of the Medipix3RX readout chip.
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