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Träfflista för sökning "WFRF:(Shiri Daryoush 1975) srt2:(2022)"

Sökning: WFRF:(Shiri Daryoush 1975) > (2022)

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1.
  • Grigoras, K., et al. (författare)
  • Qubit-Compatible Substrates With Superconducting Through-Silicon Vias
  • 2022
  • Ingår i: IEEE Transactions on Quantum Engineering. - 2689-1808. ; 3
  • Tidskriftsartikel (refereegranskat)abstract
    • We fabricate and characterize superconducting through-silicon vias and electrodes suitable for superconducting quantum processors. We measure internal quality factors of a million for test resonators excited at single-photon levels, on chips with superconducting vias used to stitch ground planes on the front and back sides of the chips. This resonator performance is on par with the state of the art for silicon-based planar solutions, despite the presence of vias. Via stitching of ground planes is an important enabling technology for increasing the physical size of quantum processor chips, and is a first step toward more complex quantum devices with three-dimensional integration.
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2.
  • Kosen, Sandoko, 1991, et al. (författare)
  • Building blocks of a flip-chip integrated superconducting quantum processor
  • 2022
  • Ingår i: Quantum Science and Technology. - : IOP Publishing. - 2058-9565. ; 7:3
  • Tidskriftsartikel (refereegranskat)abstract
    • We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips-one quantum chip and one control chip-that are bump-bonded together. We demonstrate time-averaged coherence times exceeding 90 mu s, single-qubit gate fidelities exceeding 99.9%, and two-qubit gate fidelities above 98.6%. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers.
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