| 1. |
- Lu, Xiuzhen, et al.
(författare)
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Enhanced Mechanical and Thermal Properties of Ag Joints Sintered by Spark Plasma Sintering
- 2022
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Ingår i: Journal of Electronic Materials. - : Springer Science and Business Media LLC. - 1543-186X .- 0361-5235. ; 51:11, s. 6310-6319
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Tidskriftsartikel (refereegranskat)abstract
- Nano-silver paste has been considered to be one of the most promising materials for interconnects of semiconductor devices operating at high temperature. However, its application is limited by conventional sintering methods due to the long dwell time. In this paper, a spark plasma sintering (SPS) technique with a very short sintering time of no more than 5 min was explored for the sintering of nano-silver paste. The effects of sintering conditions including pretreatment time, sintering temperature, dwell time and applied pressure on shear strength and thermal conductivity of the sintered Ag joints were investigated. The shear strength of sintered Ag joints increased as the sintering temperature and applied pressure increased. Robust sintered Ag joints with an average shear strength of 40.18 MPa were obtained by sintering at 300 degrees C for 5 min under a pressure of 3 MPa. The thermal properties were improved by pretreating the nano-silver paste for a shorter time. Thermal conductivity of 41.50 W m(-1) K-1 is obtained for samples pretreated for 25 min and sintered at 250 degrees C for 5 min.
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| 2. |
- Lv, Zhen, et al.
(författare)
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Reduction of thermal resistance of Ag-coated GFs/copper structure using nano-Ag paste as interconnection
- 2022
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Ingår i: Journal of Physics: Conference Series. - : IOP Publishing. - 1742-6588 .- 1742-6596. ; 2174:1
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Konferensbidrag (refereegranskat)abstract
- Reduction of the thermal resistance between graphene films (GFs) and substrate is crucial to the application of GFs in thermal management. GFs/copper structures were prepared using nano-Ag paste as interconnection material. The effect of the thickness of nano-Ag paste on thermal resistance of GFs/copper structure was investigated. A thin layer of Ag was coated on GFs by physical vapor deposition (PVD) to further reduce thermal resistance. The thermal resistance of GFs/copper structure using Ag-coated GFs is 5.84% lower than that using raw GFs. The thermal resistance of GFs/copper structure decreases first and then increases with the increase of coating temperature and thickness of Ag layer. The minimum thermal resistance of 1.64 mm2·K·W-1 was gained for GFs/copper structure using GFs coated Ag at 300 ℃ for 60 min.
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| 3. |
- Zhou, Chenfei, et al.
(författare)
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A novel nano-Ag paste with Ag-rGO and its application in GF/Cu laminated structure
- 2022
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Ingår i: 2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022.
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Konferensbidrag (refereegranskat)abstract
- The high contact thermal resistance of the interface between graphene films (GF) and substrates has become one of the key obstacles for the application of GF in electronic devices. A novel nano-Ag paste with nano-Ag particles modified reduced graphene oxide (Ag-rGO) was introduced to enhance the heat transport via the interface of GF and substrate. The influence of the content of Ag-rGO on shear strength and electrical resistivity of sintered Ag structure was investigated. The maximum shear strength and the minimum electrical resistivity were got for sintered Ag structure with 0.5 wt.% Ag-rGO. Reduced contact thermal resistance of GF and Cu substrate (GF/Cu) laminated structure was gained by using sintered Ag structure with Ag-rGO as interconnect materials. The minimum value of the thermal resistance of 2.02 ± 0.26 mm2·K/W was obtained for GF/Cu laminated structure connected by sintered Ag structure with 1 wt.% Ag-rGO.
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