| 1. |
- Lu, Yang, et al.
(författare)
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Precise tuning of interlayer electronic coupling in layered conductive metal-organic frameworks
- 2022
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Ingår i: Nature Communications. - : Nature Portfolio. - 2041-1723. ; 13:1
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Tidskriftsartikel (refereegranskat)abstract
- Layered metal-organic frameworks attract interests for optoelectronics and spintronics. Here, the authors report a strategy to tune interlayer charge transport and thermoelectric properties via side-chain induced control of the layer spacing. Two-dimensional conjugated metal-organic frameworks (2D c-MOFs) have attracted increasing interests for (opto)-electronics and spintronics. They generally consist of van der Waals stacked layers and exhibit layer-depended electronic properties. While considerable efforts have been made to regulate the charge transport within a layer, precise control of electronic coupling between layers has not yet been achieved. Herein, we report a strategy to precisely tune interlayer charge transport in 2D c-MOFs via side-chain induced control of the layer spacing. We design hexaiminotriindole ligands allowing programmed functionalization with tailored alkyl chains (HATI_CX, X = 1,3,4; X refers to the carbon numbers of the alkyl chains) for the synthesis of semiconducting Ni-3(HATI_CX)(2). The layer spacing of these MOFs can be precisely varied from 3.40 to 3.70 angstrom, leading to widened band gap, suppressed carrier mobilities, and significant improvement of the Seebeck coefficient. With this demonstration, we further achieve a record-high thermoelectric power factor of 68 +/- 3 nW m(-1) K-2 in Ni-3(HATI_C3)(2), superior to the reported holes-dominated MOFs.
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| 2. |
- Zhuang, Kejia, et al.
(författare)
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Numerical investigation of sequential cuts residual stress considering tool edge radius in machining of AISI 304 stainless steel
- 2022
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Ingår i: Simulation Modelling Practice and Theory. - : Elsevier BV. - 1569-190X. ; 118
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Tidskriftsartikel (refereegranskat)abstract
- Residual stress affects component performance, and the existence of pre-stress changes the residual stress of machined surfaces as well, emphasizing the importance of studying the evolution of residual stress in sequential cutting. This paper reports a numerical investigation of the machining-induced residual stress profile of sequential cuts for orthogonal cutting of AISI 304, considering the effects of edge radius and cutting depth. A Coupled Eulerian-Lagrangian (CEL) model is employed for the first time to stably simulate the evolution of residual stress of multiple sequential cuts. The effectiveness of the proposed method is verified by comparing the chip formation and surface residual stress between simulated and experimental results. The cutting force and cutting temperature, as well as mechanical and thermal loads, are extracted to explain the generation and evolution of residual stress in sequential cutting. It is found that the residual stress on the machined surfaces will decrease during sequential cutting, and a stable value can be reached after approximately six sequential cuts. With the progress of sequential cutting, a larger honed tool edge radius and cutting depth will lead to a slower reduction of residual stress.
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